Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
---|
08/31/2005 | CN1660916A Acrylic resin |
08/31/2005 | CN1217406C Sheet material for forming chip protection film and method for making semiconductor chip |
08/30/2005 | US6936664 Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product |
08/30/2005 | US6936644 Uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that |
08/25/2005 | WO2005078034A1 Conductive adhesive |
08/25/2005 | US20050187311 coating resins comprising aromatic cyanates and addition polymers on circuit substrates, then curing with light and heat to form insulation layer with improved surface smoothness and excellent dielectric properties |
08/25/2005 | US20050186762 Process for producing semiconductor chips having a protective film on the back surface |
08/25/2005 | US20050186434 coating aromatic cyanates on circuit substrates, then curing with light and heat to form insulation layer with improved surface smoothness and excellent dielectric properties |
08/25/2005 | US20050184402 Sheet to form a protective film for chips |
08/24/2005 | EP1566422A1 Uv-cure adhesive composition for optical disk, cured material and goods |
08/24/2005 | EP1470181B1 Improved interface adhesive |
08/24/2005 | EP1470177A4 Adhesive of epoxy compound, aliphatic amine and tertiary amine |
08/24/2005 | CN1216114C Structural glue containing nano material |
08/23/2005 | US6933333 Conductive adhesive sealant for bipolar fuel cell separator plate assemblies |
08/18/2005 | WO2005076376A2 Adhesive sheet for light-emitting diode device and light-emitting diode device |
08/17/2005 | CN1656862A Nanoparticle filled underfill |
08/17/2005 | CN1656190A Segmented curable transfer tapes |
08/17/2005 | CN1654582A Interfacial adhesive for steel bridge surface paving |
08/17/2005 | CN1654581A Adhesive for textile industry and method for preparing same |
08/11/2005 | WO2005073314A1 Reactive thermosetting system with long storage life |
08/11/2005 | US20050176899 Mannich bases from isolated amine adducts |
08/11/2005 | US20050175806 Adhesive tape |
08/10/2005 | EP1358291B1 Method for adhering substrates using light activatable adhesive film |
08/10/2005 | CN1653610A Thermosetting adhesive sheet with electroconductive and thermoconductive properties |
08/10/2005 | CN1651542A Epoxy resin binding agent for sand paper and its preparation method |
08/04/2005 | WO2005071034A1 Thixotropic reactive composition |
08/04/2005 | US20050171228 UV-curable compositions |
08/04/2005 | DE60109366T2 Klebstoff auf der Basis von Epoxidharzen mit Allyl- oder Vinylgruppen zur Befestigung von Halbleitern Adhesive on the base of epoxy resins with allyl or vinyl groups for attachment of semiconductors |
08/03/2005 | EP1366130B1 Adhesives and adhesive compositions containing thioether groups |
08/03/2005 | CN1649978A Sealing method |
07/27/2005 | EP1557455A1 Thixotropic reactive composition |
07/27/2005 | EP1086190B1 Adhesive and coating formulations for flexible packaging |
07/27/2005 | CN1646658A Two-pack type adhesive |
07/27/2005 | CN1646657A Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
07/27/2005 | CN1646594A Mannich bases from isolated amine adducts |
07/27/2005 | CN1212447C Coloured cementing material for paving road surface and its preparation method |
07/26/2005 | US6921782 Adhesive and electric device |
07/26/2005 | CA2162882C Electrically conductive adhesive compositions |
07/21/2005 | US20050159511 bisphenol-A diglycidyl ether, bisphenol-F diglycidyl ether, or bisphenol-A/F diglycidyl ether as liquid epoxy resins; epoxy adduct of a dicarboxylic acid and a diglycidyl ether; a urea derivative (reaction product of diphenylmethane diisocyanate/p, p*-/ and butylamine) as thixotropic agent; curing agent |
07/21/2005 | US20050158552 Poly(arylene ether) adhesive compositions |
07/21/2005 | DE10359088A1 Electrical apparatus consists of at least two electronic components, at least one connection for the components, and a cover layer |
07/20/2005 | EP1554355A1 Heat-curable adhesive composition |
07/20/2005 | CN1643024A Thermosetting resin composition and adhesive films |
07/20/2005 | CN1640980A Ceramic wine glass anticounterfeit epoxy adhesive and its preparing method |
07/20/2005 | CN1640979A Fast-setting two-component epoxy adhesive and its preparing method |
07/20/2005 | CN1640977A Polymeric adhesive for exposed wall thermal-insulation |
07/19/2005 | US6919385 Energy-ray curing resin composition |
07/19/2005 | US6919262 Release sheet and a protective film forming layer of a thermosetting or energy ray-curable component and binder component formed on a detachable surface of the release sheet |
07/14/2005 | US20050154091 Method of preparation of a water based epoxy curing agent |
07/14/2005 | DE10357355A1 2 K Klebstoffe für den Fahrzeugbau 2K adhesives for the automotive industry |
07/13/2005 | CN1639295A Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator |
07/13/2005 | CN1639290A Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
07/13/2005 | CN1639211A Organoborane amine complex polymerization initiators and polymerizable compositions |
07/13/2005 | CN1637442A Polarizing disk and producing method thereof |
07/13/2005 | CN1637039A Method of preparation of a water based epoxy curing agent |
07/13/2005 | CN1210325C Liquid epoxy resin emulsions, method for production and use thereof |
07/12/2005 | US6916890 Thermally reworkable epoxy resins and compositions based thereon |
06/30/2005 | US20050143496 Adhesives for car body assembly |
06/29/2005 | EP1548082A1 Adhesive composition and glass plate with thermoplastic elastomer molding |
06/29/2005 | EP1548078A1 Chemically crosslinkable adhesive tapes |
06/29/2005 | EP1546275A1 Method of adhesion of conductive materials, laminate, and adhesive composition |
06/29/2005 | EP1546211A1 Preparation of acrylic polymer sol for coating |
06/29/2005 | CN1633487A Adhesive sheet and semiconductor device and process for producing the same |
06/29/2005 | CN1633455A Latent hardener, process for producing the same, and adhesive containing latent hardener |
06/29/2005 | CN1632363A Gas pipe-line composite reinforcement construction and construction method thereof |
06/29/2005 | CN1632262A Energy conservation and thermal insulation decorative panel |
06/29/2005 | CN1632032A Monocomponent room-temperature cured flexible and elastic epoxy conductive silver adhesive |
06/29/2005 | CN1632031A Epoxy resin adhesive containing non-wood fiber component and its preparation method |
06/29/2005 | CN1208419C Permeable road surface adhesive |
06/29/2005 | CN1208418C Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
06/28/2005 | US6911720 Semiconductor device adhesive sheet with conductor bodies buried therein |
06/28/2005 | US6911109 Room temperature curable epoxy resin/(meth)acrylate component, a epoxy resin hardener, a transition metal complex as catalyst |
06/23/2005 | US20050137292 Adhesive composition |
06/23/2005 | US20050133155 hot melt adhesives comprising alkali-soluble copolymers or terpolymers in the form of protective films for smooth surfaces such as glass, metal or plastics |
06/22/2005 | EP1544230A1 Method of preparation of a water based epoxy curing agent |
06/22/2005 | EP1543086A1 Hybrid plastisol/hot melt compositions |
06/22/2005 | CN1629243A Heat-resistant and impact-resistant acrylic/epoxy adhesive |
06/22/2005 | CN1629242A Sprayable adhesive material for laser marking semiconductor wafers, dies and devices |
06/22/2005 | CN1629240A 丙烯酸粘合剂片材 Acrylic adhesive sheet |
06/16/2005 | WO2005054393A1 Microcapsule type adhesive composition |
06/15/2005 | EP1541610A1 Two-component adhesive for use in vehicle manufacturing |
06/15/2005 | EP1539825A2 Transformable pressure sensitive adhesive tape and use thereof in display screens |
06/15/2005 | EP1093504B1 Thermosettable adhesive |
06/15/2005 | CN1628163A 粘合性树脂组合物及其用途 The adhesive resin composition and uses thereof |
06/15/2005 | CN1626578A Steel-plate-reinforcement resin composition, steel plate reinforcing sheet, and reinforcing method of steel plate |
06/14/2005 | US6906120 Poly(arylene ether) adhesive compositions |
06/14/2005 | CA2353358C Rope of chemical anchoring adhesive |
06/09/2005 | DE10353953A1 Kaschierklebstoffe, enthaltend Polyurethan und Epoxidharz Laminating adhesives containing polyurethane and epoxy resin |
06/09/2005 | DE10297737T5 Neues Schwefel enthaltendes phenolisches Harz New sulfur-containing phenolic resin |
06/09/2005 | DE102004054295A1 Verfahren zum Verbessern der Adhäsion von Epoxidharz an Goldflächen A method for improving the adhesion of epoxy resin to gold surfaces |
06/08/2005 | CN1625577A Novel sulfurized phenolic resin, process for producing the same, phenol derivative having thioether structure or disulfide structure, process for producing the same, and epoxy resin composition and ad |
06/07/2005 | US6903144 Non-aqueous solvent-free process for making UV curable adhesive and sealants from expodized monohydroxylated diene polymers |
06/07/2005 | US6902689 Epoxy, epoxy system, and method of forming a conductive adhesive connection |
06/02/2005 | WO2005049683A1 Laminating adhesives containing polyurethane and epoxide resin |
06/01/2005 | EP1218950B1 Method for encapsulating components |
06/01/2005 | CN1621478A Flexible adhesive compositions |
05/31/2005 | US6900550 Semiconductor device including adhesive agent layer with embedded conductor bodies |
05/31/2005 | US6900269 Halogen-free resin composition |
05/25/2005 | EP1532220A1 Curable adhesive articles having topographical features therein |
05/25/2005 | DE10348783A1 System und Verfahren zur Verlegung von Bodenbelägen System and method for installation of floor coverings |