| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 02/01/2005 | CA2090560C Heat-resistant adhesive composition |
| 01/27/2005 | WO2005007766A1 Adhesive epoxy composition and process for applying it |
| 01/26/2005 | EP1499654A1 Mannich bases from isolated amine adducts |
| 01/26/2005 | CN1570010A Making method of epoxy resin adhesive for building |
| 01/26/2005 | CN1570009A Organic voelknerite heat-resistant filling suitable for epoxy-resin adhesive |
| 01/25/2005 | US6846559 For use in sealing, baffling, reinforcing, structural bonding or the like of a variety of structures; for applying to frame rail of an automotive vehicle such as a sport utility vehicle |
| 01/20/2005 | WO2004101349A3 Activatable material for sealing, baffling or reinforcing and method of forming same |
| 01/20/2005 | US20050014908 Adhesive for gas barrier laminates and laminated films |
| 01/20/2005 | US20050014859 Formed by molding alpha olefin, glycidol acrylic and polycarboxylic acid monomers then electron beam irradiating; melt processibility, thermosetting property, adherability; solder heat resistance; semiconductor manufacturing |
| 01/19/2005 | CN1568358A Laminates with structured layers |
| 01/19/2005 | CN1566248A Weathering-resistant and permeable adhesive for paving a road and its constitutional body |
| 01/19/2005 | CN1566247A Adhesive, rubber reinforced cord yarn, driving belt and method for producing driving belt |
| 01/18/2005 | US6844419 Mounting process for outgassing-sensitive optics |
| 01/13/2005 | US20050008832 Connecting microelectronic circuit |
| 01/12/2005 | EP1496094A2 An adhesive sheet based on a siloxane-modified polyamideimide resin composition, and a CSP board and a semiconductor device produced by using the sheet |
| 01/12/2005 | EP1496078A1 Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition containing the same, film-forming material and adhesive for electronic parts made thereof |
| 01/12/2005 | CN1184647C Electric conducting binder using for through-hole filling |
| 01/06/2005 | WO2005002002A1 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
| 01/06/2005 | WO2005000990A2 Water-based adhesive compositions with polyamine functioning as curative and binder |
| 01/06/2005 | US20050003577 Semiconductor package production method and semiconductor package |
| 01/05/2005 | CN1560169A Epoxy conductive adhesives with climate adaptive |
| 01/05/2005 | CN1560168A Preparation precess of anisotropic conductive coating |
| 01/05/2005 | CN1560167A Epoxy resin adhesive containing dimalea mic and preparation process thereof |
| 01/04/2005 | US6838170 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 12/30/2004 | US20040266972 Adhesive of expoxy compound, aliphatic amine and tertiary amine |
| 12/29/2004 | WO2004113466A1 Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same |
| 12/29/2004 | EP1490904A1 Thermosetting adhesive sheet with electroconductive and thermoconductive properties |
| 12/29/2004 | EP1490451A1 Activatable material |
| 12/29/2004 | EP1490450A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| 12/23/2004 | US20040258922 Water-based adhesive compositions with polyamine curative and binder |
| 12/22/2004 | EP1368401B1 Liquid epoxy resin emulsions, method for the production and use thereof |
| 12/22/2004 | EP1334161B1 Structural hot melt material and methods |
| 12/22/2004 | EP0823729B1 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device |
| 12/21/2004 | US6833433 Method for producing aliphatic oligocarbonate diols |
| 12/21/2004 | US6833044 Solvent-free two-component curable adhesive composition |
| 12/16/2004 | US20040254294 Conductive adhesive sealant for bipolar fuel cell separator plate assemblies |
| 12/15/2004 | EP1485252A1 Epoxy adhesive having improved impact resistance |
| 12/15/2004 | EP1299497B1 Epoxy based reinforcing patches with improved adhesion to oily metal surfaces |
| 12/15/2004 | CN1555405A Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| 12/15/2004 | CN1180463C Anisotropic electrically conductive binding material and connecting method |
| 12/14/2004 | US6831113 Safe and consistant filling of end use containers of one component heat curable, solvent free, hot melt epoxy resin compositions which have a melting point less than 55 degrees C. |
| 12/09/2004 | US20040249090 Curable: moldability, adhesive properties on substrates such as metals when cured |
| 12/08/2004 | EP1483304A2 Organoborane amine complex polymerization initiators and polymerizable compositions |
| 12/07/2004 | CA2184915C Single-package, duroplastic hardenable coating compound |
| 12/02/2004 | WO2004104130A2 Epoxy adhesives and bonded substrates |
| 12/01/2004 | CN1551910A Adhesive for gas barrier laminates and laminated films |
| 12/01/2004 | CN1551320A Anisotropic conductive adhesive, assembling method,electrooptical device module and electronic device |
| 12/01/2004 | CN1551315A Semiconductor device, adhesive and adhesive film |
| 12/01/2004 | CN1177972C Creping method for cellulose paper width |
| 11/25/2004 | WO2004101349A2 Activatable material for sealing, baffling or reinforcing and method of forming same |
| 11/25/2004 | WO2004085510B1 Reactive hot melt adhesive formulation for joining stamped metal and plastic parts |
| 11/25/2004 | US20040234774 Epoxy adhesives and bonded substrates |
| 11/25/2004 | US20040234763 Anisotropically conductive adhesive, mounting method, electro-optical device module, and electronic device |
| 11/25/2004 | US20040232563 Adhesive tape |
| 11/25/2004 | CA2524783A1 Activatable material for sealing, baffling or reinforcing and method of forming same |
| 11/24/2004 | EP1478710A1 Sealing method |
| 11/24/2004 | CN1549850A Protective articles |
| 11/24/2004 | CN1549843A Fluxing compositions |
| 11/24/2004 | CN1548494A Epoxy resin and inductor assembly for preventing electromagnetic interference |
| 11/24/2004 | CN1176994C Non-aqueous solvent-free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 11/23/2004 | US6822047 Particularly on copper; epoxy resin having a reactive double bond, a radical curing resin, and a radical initiator |
| 11/18/2004 | WO2004099312A1 Epoxy resin compositions containing mannich bases, suitable for high-temperature applications |
| 11/18/2004 | US20040230000 Epoxy resins, phenolic resins, a synthetic rubber (acrylonitrile-butadiene), and microcapsules having a thermoplastic resin shell; improved bonding strength and storage stability; microelectronics; pressure sensitive adhesives |
| 11/17/2004 | CN1546591A High connecting intensity thermosetting conducting resin |
| 11/17/2004 | CN1546590A Preparation method of room temperature cured high temperature tolerant flexible epoxy adhesive |
| 11/17/2004 | CN1546589A Dynamic structural adhesive for bridge |
| 11/17/2004 | CN1176173C Adhesive for mutual inductor, and preparing method thereof |
| 11/16/2004 | US6818097 Highly heat-resistant plasma etching electrode and dry etching device including the same |
| 11/11/2004 | US20040221953 Activatable material for sealing, baffling or reinforcing and method of forming same |
| 11/10/2004 | EP1475412A1 Epoxy compositions containing a Mannich base suitable for high temperature applications |
| 11/10/2004 | EP1187888B1 bonded structure |
| 11/10/2004 | EP1115770B1 Adhesive system to form reversible glued joints |
| 11/10/2004 | CN1545729A 胶粘带 Adhesive tape |
| 11/04/2004 | US20040216838 Processes for the production of components fo electronic apparatuses |
| 11/04/2004 | DE10297225T5 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente Die attach adhesives for semiconductor applications, to processes for the production of semiconductor components and manufactured by such a method, semiconductor devices |
| 11/04/2004 | DE10297224T5 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente Die attach adhesives for semiconductor applications, to processes for the production of semiconductor components and manufactured by such a method, semiconductor devices |
| 11/03/2004 | EP1317499B1 Method for cross-linking polyacrylates |
| 11/03/2004 | CN1542076A Adhesives composition, adhesive film, and semiconductor apparatus using the same |
| 11/03/2004 | CN1542075A Adhesive compound |
| 10/28/2004 | US20040213994 Dicing/die bonding adhesion tape |
| 10/28/2004 | US20040213973 Film adhesive for sealing, film laminate for sealing and sealing method |
| 10/27/2004 | EP1470181A1 Improved interface adhesive |
| 10/27/2004 | EP1470177A1 Adhesive of epoxy compound, aliphatic amine and tertiary amine |
| 10/27/2004 | EP1412445A4 Polysilazane-modified polyamine hardeners for epoxy resins |
| 10/26/2004 | US6808597 Methods of making and using creping adhesives comprised of polyamine-epihalohydrin resin/poly(vinyl alcohol) mixtures |
| 10/21/2004 | US20040206943 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same |
| 10/20/2004 | CN1539179A Batch electrically connecting sheet |
| 10/20/2004 | CN1171965C Viscous and amine-cured chemical anchoring adhesive |
| 10/14/2004 | US20040204515 Chemical resistant epoxy composition |
| 10/12/2004 | US6803081 An epoxidized block copolymer, a saturated block copolymer and/or a rosin derived alcohol, and a photoinitiator; useful for tape and label industry |
| 10/12/2004 | US6802446 Conductive adhesive material with metallurgically-bonded conductive particles |
| 10/07/2004 | WO2004085564A1 Two-component epoxy adhesive composition comprising flexibilizers |
| 10/07/2004 | WO2004085510A1 Reactive hot melt adhesive formulation for joining stamped metal and plastic parts |
| 10/07/2004 | US20040197563 epoxy resin; flexibilizer such as the reaction product of epichlorohydrin and polypropylene glycol, a high functionality acrylic monomer, and/or a glycidyl ether of an alkyl phenol; and curing agent; automotive exterior panel |
| 10/06/2004 | EP1389408B1 Method for producing components for electronic devices |
| 10/06/2004 | EP0925914B1 Process for production of a readily bondable polyamidefilm |
| 10/06/2004 | CN1169902C Binding composition for bonding semiconductor chips |
| 10/05/2004 | US6800371 Curable composition comprising mixture of epoxy resin, catalyst and epoxy reactive thioether-containing compound; resulting adhesives are water and/or solvent resistant and bond to plastics such as polycarbonates, metals, silicon |
| 10/05/2004 | US6800157 Chain extender, a catalyst, a reactive epoxy resin, and a polymeric toughner forms a thermally curable structural adhesive |
| 09/30/2004 | WO2004083333A1 Pressure sensitive adhesive composition for electro-magnetic shielding film and electro-magnetic shielding filter using the same |