Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
10/2001
10/03/2001CN1072091C Coated abrasive article incorporating energy cured hot melt bottom coat and making method thereof
10/02/2001US6297344 Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-range
09/2001
09/27/2001US20010024764 Obtained by thermal crosslinking of an acrylate ester, tert-butoxycarbonyl (BOC) protected hydroxy-functional (meth)acrylates, photoinitiator, and isocyanate or epoxide crosslinking agents; polymer is deprotected prior to curing
09/26/2001EP1135448A1 Optical fiber connector using colored photocurable adhesive
09/25/2001US6294270 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
09/25/2001US6294259 Polyimide hybrid adhesives
09/20/2001US20010022404 Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film
09/19/2001EP1133537A1 Backing for adhesive tape and such tape
09/18/2001US6291557 Alkali-soluble adhesive agent
09/18/2001US6291555 Highly viscous chemical anchoring adhesive
09/13/2001US20010021753 Polymer compositions, their preparation and their use
09/13/2001US20010020697 Thermosetting adhesive material
09/11/2001US6288170 Clean peeling with heat, inseparable at use temperature
09/06/2001DE10008841A1 Polyacrylate adhesive material, e.g. for adhesive tape, obtained by heat-crosslinking a mixture of hydroxyalkyl acrylate copolymer with special protecting groups, photoinitiator and bifunctional isocyanate or epoxide
09/05/2001EP1130070A2 Adhesives for thermally shrinkable films or labels
09/05/2001CN1311511A Aeolotropic conductive adhering film
08/2001
08/30/2001US20010018477 Adhesive composition
08/30/2001US20010018122 Epoxy resin blend
08/29/2001EP1127907A2 Thermally crosslinked acrylate hotmelts
08/29/2001EP0858488B1 Reactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive
08/29/2001CN1310750A Adhesive which hardens in several stages
08/29/2001CN1310219A Electric conducting binder using for through-hole filling
08/29/2001CA2338874A1 Adhesives for thermally shrinkable films or labels
08/23/2001WO2001060938A1 Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device
08/21/2001US6277914 Polymeric adhesive and structures with multiple polymeric layers, their process of preparation and their use
08/21/2001US6277481 Adhesive composition and adhesive sheet
08/21/2001US6277346 Photocatalyst composite includes a mixture of photocatalyst particles having a photocatalytic function with cement as a less degradative adhesive adhered on a substrate.
08/16/2001WO2001058979A1 Photocurable composition, process for producing photocurable composition, photocurable pressure-sensitive adhesive sheet, process for producing photocurable pressure-sensitive adhesive sheet, and method of bonding
08/16/2001EP1123348A2 Impact-resistant epoxide resin compositions
08/15/2001CN1308662A Tackified thermoplastic-epoxy pressure sentitive adhesives
08/14/2001US6274643 Photocatalyst
08/14/2001US6273989 Bonding electronic components such as printed circuit boards. superior peel strength, chemical resistance, moisture resistance, and temperature stability.
08/09/2001WO2001057110A1 Epoxy resin composition
08/07/2001US6270616 Metal-filled, plateable structural adhesives for cyanate ester composites
08/01/2001CN1306562A Adhesive and coating formulations of flexible packaging
07/2001
07/31/2001US6268056 Seal assembly with new resin stabilized adhesive composition to bond an insert member to the elastomeric seal material
07/25/2001EP1117747A1 Adhesive compositions and their precursors
07/25/2001CN1304945A Energy ray solidification type resin composition
07/24/2001US6265782 Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film
07/24/2001US6265469 Blend containing a steric hindered piperidinyloxy compound
07/18/2001EP1115770A1 Adhesive system to form reversible glued joints
07/18/2001CN1303892A Thermoset binding material
07/17/2001US6261685 Thermosetting adhesive and adhesive sheet thereof
07/17/2001US6261684 Infrared-blocking transparent film
07/12/2001WO2001049797A2 Multi-layered sealant
07/11/2001CN1303423A Radiation curable adhesive for bonding of optical discs
07/11/2001CN1303329A Multi-functional electrically and thermally conductive adhesive tape
07/05/2001US20010007003 Pressure sensitive adhesives
07/04/2001CN1301635A Laser composite decorative material and its producing method
07/03/2001US6255423 Pressure sensitive adhesive sheet and use thereof
07/03/2001US6255364 Crosslinkable waterborne dispersions of epoxidized polydiene block copolymers and amino resins
06/2001
06/28/2001WO2001046333A1 Acidic polymer-based thermosettable psas, methods of their use, and thermoset adhesives therefrom
06/28/2001WO2001046331A2 Acidic polymer-based thermosettable psas, methods of their use, and thermoset adhesives therefrom
06/28/2001WO2001046290A1 Ambient-temperature-stable, one-part curable epoxy adhesive
06/19/2001US6248810 Waterborne dispersions of epoxidized polydiene block copolymers and amino resins
06/19/2001US6248204 Structural reinforcement component that includes a hydrophobic fumed silica in an amount of about 5 to about 20 weight percent, based on the epoxy resin component
06/13/2001CN1298913A Solidifying agent of epoxy resin
06/13/2001CN1067096C Structural adhesive composition having high temp. resistance
06/07/2001WO2001040396A2 Urethane modified epoxy adhesive composition
06/06/2001EP1104797A1 Adhesive composition
06/06/2001CN1297975A Quick-setting single-component surface adhesive
06/06/2001CN1066770C Single-component solid thermosetting coating material
06/05/2001US6241915 Epoxy, epoxy system, and method of forming a conductive adhesive connection
05/2001
05/31/2001WO2001038636A1 Creping adhesives
05/30/2001EP1102801A1 Method for producing vinyl compounds
05/29/2001US6239232 Polyetherimide or polysulphone with polyepoxide partially reacted with aromatic polyamine
05/29/2001US6238597 Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate
05/23/2001EP0789720B1 Stable, low cure-temperature semi-structural pressure sensitive adhesive
05/22/2001US6235850 Epoxy/acrylic terpolymer self-fixturing adhesive
05/16/2001EP1099542A1 Plastic-coated metal plate
05/16/2001EP1098945A1 Tackified thermoplastic-epoxy pressure sensitive adhesives
05/16/2001EP1098924A1 Adhesive compositions
05/16/2001CN1065895C One-coating rubber-to-metal bonding adhesive
05/10/2001WO2001032797A1 Pressure sensitive adhesive tape and silicone-free release coating used therein
05/08/2001US6228500 Adhesive composition and precursor thereof
05/03/2001WO2001030934A1 Reactive hot-melt adhesive composition
05/03/2001WO2001030930A1 Anti-adherent silicone/adhesive complex with stabilising additive in silicone
05/03/2001CA2389015A1 Anti-adherent silicone/adhesive complex with stabilising additive in silicone
05/01/2001US6225379 Epoxy resin composition for bonding semiconductor chips
04/2001
04/26/2001WO2001029134A1 Formulation for strippable adhesive and coating films and high performance adhesives
04/25/2001EP1093504A1 Thermosettable adhesive
04/25/2001EP1093499A1 Radiation curable adhesive for bonding of optical discs
04/25/2001EP0915753A4 Siloxane-modified adhesive/adherend systems
04/17/2001US6217996 Aromatic polyimide film and its composite sheet
04/17/2001CA2004131C A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism
04/11/2001EP0646138B1 Randomly epoxidized small star polymers
04/05/2001WO2001023466A1 Electrically conductive adhesive containing epoxide-modified polyurethane
04/05/2001DE19959347A1 Adhesive film, useful for the absorption of sound and vibration from a cutting or grinding device, comprises a denatured epoxy resin and/or rubber and noise and vibration absorbing material.
04/05/2001DE19943149A1 Verfahren zur Verkapselung von Bauelementen A process for the encapsulation of components
04/04/2001EP1088870A1 Thermosetting adhesive composition and adhered structure
04/04/2001EP1088042A1 Adhesive which hardens in several stages
04/04/2001EP0897431B1 Bonding fibrous batts with thermosetting fiber-binders of certain epoxy resins
04/03/2001US6211261 Thermosetting pressure-sensitive adhesive and adhesive sheet thereof
03/2001
03/28/2001EP1087262A2 Energy-ray curing resin composition
03/28/2001EP1086190A1 Adhesive and coating formulations for flexible packaging
03/28/2001CN1289352A Adhesive composition and precursor thereof
03/28/2001CN1288924A Single-component organic heat-conducting daub
03/27/2001US6207732 Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-range
03/27/2001US6207730 Epoxy and microsphere adhesive composition
03/22/2001WO2001019895A1 Uv-curable compositions
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