Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
07/2006
07/05/2006EP1397455B1 Hot-melt adhesive provided in the form of granulated material
07/05/2006EP1059346B1 Adhesive composition, resin material, rubber article and pneumatic tire
07/05/2006CN1798820A Activatable material for sealing,Baffling or reinforcing and method of forming same
07/05/2006CN1262619C Automotive adhesive
07/04/2006US7071263 Epoxy adhesives and bonded substrates
07/04/2006US7070670 Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device
06/2006
06/29/2006DE102004060783A1 2 K Versteifungsmaterial für Außenhautanwendungen 2 K stiffening material for skin applications
06/28/2006EP1673411A2 Adhesive compositions
06/28/2006CN1793267A Epoxy resin type high strength structure adhesive
06/28/2006CN1793207A Silicomethane coupling agent containing cyanide and secondary amino and its preparation process and application thereof
06/28/2006CN1261990C Bound board with electric conductor, method for mfg. semiconductor device and semiconductor device
06/28/2006CN1261480C Epoxy resin curing agent and ultra-low temperature adhesive of epoxy resin prepared by it
06/22/2006WO2006064849A1 Conductive adhesive, and utilizing the same, conductive section and electronic part module
06/22/2006WO2006064678A1 Adhesive for circuit connection
06/21/2006EP1672010A1 Two component stiffening material for outer skin applications
06/21/2006EP1671813A1 Pneumatic radial tire
06/21/2006EP1530617B1 Epoxy compositions having improved shelf life and articles containing the same
06/21/2006CN1791653A Foamable underfill encapsulant
06/21/2006CN1791652A Epoxy adhesives and bonded substrates
06/21/2006CN1791647A Primer, conductor foil with resin, laminate and process for producing the laminate
06/21/2006CN1789363A Preparation method of ultraviolet cured adhesive for flat panel display
06/21/2006CN1260317C Preparation process of anisotropic conductive coating
06/21/2006CN1260292C Formulation for strippable adhesive and coating films and high-performance adhesives
06/15/2006WO2006062162A1 Laminate film
06/14/2006CN1788062A Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices
06/14/2006CN1787133A Method for preparing injection forming rare earth permanent magnet material by thermoplastic thermosetting adhesive
06/14/2006CN1786098A Polyaniline corrosion proof sealant
06/14/2006CN1786097A Liquid state flexible package, polymer lithium battery diaphragm binding glue
06/13/2006US7060786 Heat resistant resin composition and adhesive film
06/08/2006US20060121272 Thermo-activated adhesive material for fpcb agglutinations
06/08/2006US20060121225 Adhesive
06/07/2006EP1666846A1 Magnetic encoder
06/07/2006EP1232198B1 Uv-curable compositions
06/01/2006DE102004057651A1 Heat-activable adhesive tape for producing and reprocessing flexible printed circuit board and bonding to polyimide, is based on composition containing acrylonitrile-butadiene copolymer, polyvinyl acetal, epoxide resin and hardener
06/01/2006DE102004057650A1 Heat-activable adhesive tape for producing and reprocessing flexible printed circuit board and bonding to polyimide, is based on composition containing acid- or anhydride-modified acrylonitrile-butadiene copolymer and epoxide resin
05/2006
05/31/2006EP1377645A4 Flexible thermal protective compositions and coatings and structures formed with them
05/30/2006US7053521 Method for enhancing epoxy adhesion to gold surfaces
05/30/2006US7053133 High room temperature storage stability and no catalytic action before activation by ultraviolet rays; thermal press bonding; epoxy resin, an ultraviolet activatable cationic polymerization catalyst, a polymerization inhibitor and water
05/30/2006US7052756 Adhesive for optical disk and optical disk
05/26/2006WO2006055161A1 Anisotropic conductive adhesive composition
05/24/2006CN1775889A Adhesive for slow-binding prestress reinforcement
05/18/2006US20060106166 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
05/18/2006US20060106142 Preparation of acrylic polymer sol for coating
05/18/2006CA2582418A1 Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom
05/17/2006EP1657725A1 Insulation-coated electroconductive particles
05/17/2006EP1657287A2 Protective articles
05/17/2006CN1772832A Oil absorbing quick curing adhesive
05/17/2006CN1256396C High temperature epoxy adhesive films
05/11/2006US20060100388 Pressure sensitive adhesive composition for electro-magnetic shielding film and electro-magnetic shielding filter using the same
05/11/2006US20060100315 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
05/11/2006US20060100314 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
05/11/2006US20060100299 Transformable pressure sensitive adhesive tape and use thereof in display screens
05/10/2006CN1255493C Epoxy resin adhesive containing non-wood fiber component and its preparation method
05/10/2006CN1255449C Epoxy resin composition
05/04/2006WO2006046474A1 Curable composition
05/04/2006WO2006046473A1 Curable composition
05/04/2006WO2006046472A1 Curable composition
05/04/2006WO2006005716A3 Fire retardant composition
05/04/2006US20060093779 Radiation-curable compositions for optical media
05/04/2006US20060091019 Method of adhesion of conductive materials, laminate, and adhesive composition
05/03/2006EP1651700A1 Command-cure adhesives
05/03/2006CN1768099A Thermally conductive adhesive composition and process for device attachment
05/03/2006CN1766400A Method for reinforcing defective pipeline and composite material therefor
05/03/2006CN1254507C Adhesive composition and adhesive sheet for semiconductor device
04/2006
04/26/2006CN1764692A Epoxy resin compositions containing mannich bases, suitable for high-temperature applications
04/26/2006CN1763145A Adhesive tape composition for electronic components
04/26/2006CN1763144A Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
04/26/2006CN1253523C Adhesive for leakage blocking up by robot and its formulating method and use
04/26/2006CN1253522C Flexible adhesive compositions
04/20/2006DE102004050792A1 Bauelemente-Modul für Hochtemperaturanwendungen und Verfahren zum Herstellen eines derartigen Bauelemente-Moduls Components module for high temperature applications and methods for producing such components module
04/20/2006CA2583916A1 Aging-resistant coatings and adhesive composites
04/19/2006EP1646698A1 Adhesive epoxy composition and process for applying it
04/19/2006CN1252210C Connection material and connection structure body
04/19/2006CN1252204C Method for adhering substrates using light activatable adhesive film
04/13/2006DE102004049717A1 Alterungsbeständige Beschichtungen und Klebeverbunde Age-resistant coatings and adhesive bonds
04/12/2006EP1137733B1 Two-component material for chemical fixing means
04/12/2006CN1759155A A conductive adhesive composition
04/12/2006CN1757693A Wet-adhering, quick-curing binder for stone type cultural relic
04/12/2006CN1250667C Dynamic structural adhesive for bridge
04/12/2006CN1250666C Bond composition and method of agglutinating and ornamenting stone, ornament and mending agent
04/12/2006CN1250665C Impact-resistant epoxy resin compositions
04/12/2006CN1250663C Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using same
04/12/2006CN1250604C Method for producing aliphatic oligocarbonate diols
04/11/2006CA2352396C Low temperature curing, sag-resistant epoxy primer
04/06/2006WO2006035709A1 Epoxy resin composition and article
04/06/2006US20060074209 Uv-cure adhesive composition for optical disk, cured material and goods
04/05/2006CN1756784A Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith
04/05/2006CN1249809C Binding thin film for semiconductor, lead wire frame using same and semiconductor device
04/05/2006CN1249701C Radiation-curable compsns. for optical media
04/05/2006CN1249192C Adhesive composition and its uses
04/05/2006CN1249161C Cast composite based on thermosetting epoxy resin
04/05/2006CN1249128C Fire retarded resin composition
04/04/2006US7022408 Oriented acrylic hotmelts
03/2006
03/29/2006EP1640428A1 Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same
03/29/2006CN1248212C Adhesive for optical disk and optical disk
03/29/2006CN1247729C Monocomponent room-temperature cured flexible and elastic epoxy conductive silver adhesive
03/29/2006CN1247728C Bond composition for precision parts, case for timekeeper and manufacturing method
03/23/2006DE102004037472A1 Additive für Epoxid-Harze Additives for epoxy resins
03/22/2006EP1328602B1 Two component thermosettable compositions useful for producing structural reinforcing adhesives
03/22/2006CN1246412C Flexible printing circuit board adhesive
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