Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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07/05/2006 | EP1397455B1 Hot-melt adhesive provided in the form of granulated material |
07/05/2006 | EP1059346B1 Adhesive composition, resin material, rubber article and pneumatic tire |
07/05/2006 | CN1798820A Activatable material for sealing,Baffling or reinforcing and method of forming same |
07/05/2006 | CN1262619C Automotive adhesive |
07/04/2006 | US7071263 Epoxy adhesives and bonded substrates |
07/04/2006 | US7070670 Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device |
06/29/2006 | DE102004060783A1 2 K Versteifungsmaterial für Außenhautanwendungen 2 K stiffening material for skin applications |
06/28/2006 | EP1673411A2 Adhesive compositions |
06/28/2006 | CN1793267A Epoxy resin type high strength structure adhesive |
06/28/2006 | CN1793207A Silicomethane coupling agent containing cyanide and secondary amino and its preparation process and application thereof |
06/28/2006 | CN1261990C Bound board with electric conductor, method for mfg. semiconductor device and semiconductor device |
06/28/2006 | CN1261480C Epoxy resin curing agent and ultra-low temperature adhesive of epoxy resin prepared by it |
06/22/2006 | WO2006064849A1 Conductive adhesive, and utilizing the same, conductive section and electronic part module |
06/22/2006 | WO2006064678A1 Adhesive for circuit connection |
06/21/2006 | EP1672010A1 Two component stiffening material for outer skin applications |
06/21/2006 | EP1671813A1 Pneumatic radial tire |
06/21/2006 | EP1530617B1 Epoxy compositions having improved shelf life and articles containing the same |
06/21/2006 | CN1791653A Foamable underfill encapsulant |
06/21/2006 | CN1791652A Epoxy adhesives and bonded substrates |
06/21/2006 | CN1791647A Primer, conductor foil with resin, laminate and process for producing the laminate |
06/21/2006 | CN1789363A Preparation method of ultraviolet cured adhesive for flat panel display |
06/21/2006 | CN1260317C Preparation process of anisotropic conductive coating |
06/21/2006 | CN1260292C Formulation for strippable adhesive and coating films and high-performance adhesives |
06/15/2006 | WO2006062162A1 Laminate film |
06/14/2006 | CN1788062A Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices |
06/14/2006 | CN1787133A Method for preparing injection forming rare earth permanent magnet material by thermoplastic thermosetting adhesive |
06/14/2006 | CN1786098A Polyaniline corrosion proof sealant |
06/14/2006 | CN1786097A Liquid state flexible package, polymer lithium battery diaphragm binding glue |
06/13/2006 | US7060786 Heat resistant resin composition and adhesive film |
06/08/2006 | US20060121272 Thermo-activated adhesive material for fpcb agglutinations |
06/08/2006 | US20060121225 Adhesive |
06/07/2006 | EP1666846A1 Magnetic encoder |
06/07/2006 | EP1232198B1 Uv-curable compositions |
06/01/2006 | DE102004057651A1 Heat-activable adhesive tape for producing and reprocessing flexible printed circuit board and bonding to polyimide, is based on composition containing acrylonitrile-butadiene copolymer, polyvinyl acetal, epoxide resin and hardener |
06/01/2006 | DE102004057650A1 Heat-activable adhesive tape for producing and reprocessing flexible printed circuit board and bonding to polyimide, is based on composition containing acid- or anhydride-modified acrylonitrile-butadiene copolymer and epoxide resin |
05/31/2006 | EP1377645A4 Flexible thermal protective compositions and coatings and structures formed with them |
05/30/2006 | US7053521 Method for enhancing epoxy adhesion to gold surfaces |
05/30/2006 | US7053133 High room temperature storage stability and no catalytic action before activation by ultraviolet rays; thermal press bonding; epoxy resin, an ultraviolet activatable cationic polymerization catalyst, a polymerization inhibitor and water |
05/30/2006 | US7052756 Adhesive for optical disk and optical disk |
05/26/2006 | WO2006055161A1 Anisotropic conductive adhesive composition |
05/24/2006 | CN1775889A Adhesive for slow-binding prestress reinforcement |
05/18/2006 | US20060106166 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
05/18/2006 | US20060106142 Preparation of acrylic polymer sol for coating |
05/18/2006 | CA2582418A1 Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom |
05/17/2006 | EP1657725A1 Insulation-coated electroconductive particles |
05/17/2006 | EP1657287A2 Protective articles |
05/17/2006 | CN1772832A Oil absorbing quick curing adhesive |
05/17/2006 | CN1256396C High temperature epoxy adhesive films |
05/11/2006 | US20060100388 Pressure sensitive adhesive composition for electro-magnetic shielding film and electro-magnetic shielding filter using the same |
05/11/2006 | US20060100315 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
05/11/2006 | US20060100314 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
05/11/2006 | US20060100299 Transformable pressure sensitive adhesive tape and use thereof in display screens |
05/10/2006 | CN1255493C Epoxy resin adhesive containing non-wood fiber component and its preparation method |
05/10/2006 | CN1255449C Epoxy resin composition |
05/04/2006 | WO2006046474A1 Curable composition |
05/04/2006 | WO2006046473A1 Curable composition |
05/04/2006 | WO2006046472A1 Curable composition |
05/04/2006 | WO2006005716A3 Fire retardant composition |
05/04/2006 | US20060093779 Radiation-curable compositions for optical media |
05/04/2006 | US20060091019 Method of adhesion of conductive materials, laminate, and adhesive composition |
05/03/2006 | EP1651700A1 Command-cure adhesives |
05/03/2006 | CN1768099A Thermally conductive adhesive composition and process for device attachment |
05/03/2006 | CN1766400A Method for reinforcing defective pipeline and composite material therefor |
05/03/2006 | CN1254507C Adhesive composition and adhesive sheet for semiconductor device |
04/26/2006 | CN1764692A Epoxy resin compositions containing mannich bases, suitable for high-temperature applications |
04/26/2006 | CN1763145A Adhesive tape composition for electronic components |
04/26/2006 | CN1763144A Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
04/26/2006 | CN1253523C Adhesive for leakage blocking up by robot and its formulating method and use |
04/26/2006 | CN1253522C Flexible adhesive compositions |
04/20/2006 | DE102004050792A1 Bauelemente-Modul für Hochtemperaturanwendungen und Verfahren zum Herstellen eines derartigen Bauelemente-Moduls Components module for high temperature applications and methods for producing such components module |
04/20/2006 | CA2583916A1 Aging-resistant coatings and adhesive composites |
04/19/2006 | EP1646698A1 Adhesive epoxy composition and process for applying it |
04/19/2006 | CN1252210C Connection material and connection structure body |
04/19/2006 | CN1252204C Method for adhering substrates using light activatable adhesive film |
04/13/2006 | DE102004049717A1 Alterungsbeständige Beschichtungen und Klebeverbunde Age-resistant coatings and adhesive bonds |
04/12/2006 | EP1137733B1 Two-component material for chemical fixing means |
04/12/2006 | CN1759155A A conductive adhesive composition |
04/12/2006 | CN1757693A Wet-adhering, quick-curing binder for stone type cultural relic |
04/12/2006 | CN1250667C Dynamic structural adhesive for bridge |
04/12/2006 | CN1250666C Bond composition and method of agglutinating and ornamenting stone, ornament and mending agent |
04/12/2006 | CN1250665C Impact-resistant epoxy resin compositions |
04/12/2006 | CN1250663C Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using same |
04/12/2006 | CN1250604C Method for producing aliphatic oligocarbonate diols |
04/11/2006 | CA2352396C Low temperature curing, sag-resistant epoxy primer |
04/06/2006 | WO2006035709A1 Epoxy resin composition and article |
04/06/2006 | US20060074209 Uv-cure adhesive composition for optical disk, cured material and goods |
04/05/2006 | CN1756784A Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith |
04/05/2006 | CN1249809C Binding thin film for semiconductor, lead wire frame using same and semiconductor device |
04/05/2006 | CN1249701C Radiation-curable compsns. for optical media |
04/05/2006 | CN1249192C Adhesive composition and its uses |
04/05/2006 | CN1249161C Cast composite based on thermosetting epoxy resin |
04/05/2006 | CN1249128C Fire retarded resin composition |
04/04/2006 | US7022408 Oriented acrylic hotmelts |
03/29/2006 | EP1640428A1 Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same |
03/29/2006 | CN1248212C Adhesive for optical disk and optical disk |
03/29/2006 | CN1247729C Monocomponent room-temperature cured flexible and elastic epoxy conductive silver adhesive |
03/29/2006 | CN1247728C Bond composition for precision parts, case for timekeeper and manufacturing method |
03/23/2006 | DE102004037472A1 Additive für Epoxid-Harze Additives for epoxy resins |
03/22/2006 | EP1328602B1 Two component thermosettable compositions useful for producing structural reinforcing adhesives |
03/22/2006 | CN1246412C Flexible printing circuit board adhesive |