Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
---|
11/08/2006 | CN1858141A Steel cord adhesive for radial tyre and its preparing method |
11/08/2006 | CN1283894C Method for applying chemical anchoring adhesion |
11/02/2006 | WO2006115231A1 Curable resin composition and process for producing bonded part obtained with the same |
11/02/2006 | WO2006115146A1 Adhesive sheet with base used for flexible printed circuit board, method for producing same, multilayer flexible printed circuit board, and rigid-flex printed circuit board |
11/02/2006 | US20060247333 Epoxy resin composition |
11/02/2006 | EP1717851A1 Circuit-connecting material and circuit terminal connected structure and connecting method |
11/02/2006 | EP1373425B1 Protective articles and methods employing the same |
11/01/2006 | CN1854231A Die attach adhesives with improved stress performance |
11/01/2006 | CN1853847A Carbon-fibre composite material for repairing and reinforcing weld seam defect and its method |
11/01/2006 | CN1282697C Thermosetting organic resin composition |
10/26/2006 | WO2006112672A1 Functional adhesive, construction material using the same, and method for preparing the adhesive |
10/26/2006 | DE102005018671A1 Schlagzähe Epoxidharz-Zusammensetzungen Impact-resistant epoxy resin compositions |
10/25/2006 | EP1714991A1 Photosensitive epoxy resin adhesive composition and use thereof |
10/25/2006 | CN1852956A Water-resistant adhesive composition for wood |
10/25/2006 | CN1850931A Stone thin sheet composite rubber, and its preparing method |
10/24/2006 | US7125461 Activatable material for sealing, baffling or reinforcing and method of forming same |
10/19/2006 | WO2006109831A1 Processes for production of adhesives |
10/18/2006 | EP1711572A1 Thixotropic reactive composition |
10/18/2006 | CN1847352A Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
10/18/2006 | CN1847351A Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
10/18/2006 | CN1280375C Adhesive for laminated product, anchoring agent, laminated films, multiplayer packaging material and packaging bag |
10/18/2006 | CN1280372C Adhesive composition and glass plate with thermoplastic elastomer molding |
10/12/2006 | WO2006106143A1 Surface covering which is hardened in several stages |
10/12/2006 | CA2604040A1 Surface coating with multi-stage curing |
10/11/2006 | CN1845977A Adhesive agent and method for production thereof |
10/11/2006 | CN1279134C Method for adhering substrates using ultraviolet activatable adhesive film and ultraviolet irradiation apparatus |
10/05/2006 | US20060223904 Adhesive composition and optical disc prepared therewith |
10/04/2006 | EP0979854B1 Circuit connecting material, and structure and method of connecting circuit terminal |
10/04/2006 | CN1840562A Method for preparing latent hardener |
09/28/2006 | WO2006101127A1 Electroconductive joining material and electric or electronic device using the same |
09/27/2006 | EP1704185A1 Reactive thermosetting system with long storage life |
09/27/2006 | EP1252218B1 Epoxy resin composition |
09/27/2006 | CN1837317A Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film |
09/21/2006 | US20060207720 Manufacturing method of inkjet head, and adhesive agent composition |
09/21/2006 | US20060207713 Forming a SiO2 layer on a silicon substrate; applying a heat-curable conductive adhesive layer; laminating the single crystal plate on the adhesive; heat curing; and polishing, polarizing and etching the crystal plate; fabrication of many electric or electronic devices including a microactuator |
09/21/2006 | DE102005058624A1 Verfahren zur Herstellung eines Adsorberwärmetauschers A process for producing an adsorption |
09/20/2006 | CN1836295A Insulation-coated electroconductive particles |
09/20/2006 | CN1836021A Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same |
09/20/2006 | CN1836018A Adhesive composition and optical disc prepared therewith |
09/20/2006 | CN1276045C Method of adhesion of conductive materials, laminate, and adhesive composition |
09/19/2006 | US7108806 Mixing epoxy resin, amine, filler, corrosion inhibitor and oxygen scavenger, imidazole curing agent and solvent |
09/14/2006 | US20060205897 Two-component epoxy adhesive composition |
09/13/2006 | CN1832222A Organic electroluminescent device and manufacturing method for the same |
09/13/2006 | CN1831074A Gooey composition of flexible printing wiring plate and adhibit thin film using thereof |
09/13/2006 | CN1831073A Low stress conductive adhesive |
09/13/2006 | CN1274780C Water-resistant adhesive composite for wood |
09/12/2006 | US7105594 Conductive carbon filled polyvinyl butyral adhesive |
09/07/2006 | DE102005047725A1 Device for stiffening the wall of an air duct comprises profile sections whose surfaces contacting the air duct wall are glued to the latter |
08/31/2006 | WO2006090794A1 Latent hardener for epoxy resin and epoxy resin composition |
08/31/2006 | WO2006090715A1 Rubber-based curable hot-melt adhesive composition |
08/31/2006 | DE102005012457B3 New oligomer and polymer containing epoxy and silane groups (obtained by reacting epoxy group containing low-molecular oligomer or polymer compound with a silane group) useful for preparing anhydrous hardenable mixture |
08/30/2006 | EP1490451B1 Activatable material |
08/30/2006 | EP1490450B1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
08/30/2006 | EP0835917B1 Ultraviolet-curing adhesive composition and article |
08/30/2006 | CN1272522C Chemical anchoring adhesive rope |
08/30/2006 | CN1272398C Polymeric adhesive for exposed wall thermal-insulation |
08/24/2006 | WO2006088704A1 Surfacing and/or joining method |
08/24/2006 | WO2006088180A1 Semiconductor device manufacturing method |
08/24/2006 | WO2006088164A1 Microparticle enclosing resin component and use thereof |
08/24/2006 | WO2006088127A1 Electromagnetic-wave-shielding adhesive film, process for producing the same, and method of shielding adherend from electromagnetic wave |
08/24/2006 | DE102005006282A1 Strahlungsvernetzbare Schmelzhaftklebstoffe The radiation curable hot melt pressure sensitive adhesives |
08/24/2006 | CA2597867A1 Surfacing and/or joining method |
08/23/2006 | EP1578838B1 Thermally cuarble epoxy resin composition having an improved impact resistance at low temperatures |
08/23/2006 | EP1425358B1 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus. |
08/23/2006 | CN1822252A Temperature pressure binding permanent magnet material and its preparing method |
08/23/2006 | CN1821337A Binder composition for semiconductor device and binder sheet for semiconductor device |
08/23/2006 | CN1821336A Anisotropic conductive glue and its preparing method |
08/22/2006 | US7094843 Containing a hydroxyl-containing aromatic compound, such as a phenol-formaldehyde condensate |
08/17/2006 | WO2006085623A1 Endoscope device |
08/17/2006 | WO2006084537A2 Radiation cross-linkable hot-melt contact adhesives |
08/17/2006 | US20060182974 Multi-layer sandwich materials with epoxide-based organic interlayers |
08/16/2006 | EP1689816A1 Curable silicone composition and cured product thereof |
08/15/2006 | US7090920 laminate comprising thermoplastic substrate, conductive metal foil at least partially disposed on substrate, adhesive disposed between substrate and the metal foil, poly(arylene ether) resin, thermosetting resin, poly(vinyl butyral-co-vinyl acetate) resin toughening agent; circuit board applications |
08/10/2006 | WO2006083677A1 Use of aramid fiber conjunction with thermoplastics to improve wash-off resistance and physical properties such as impact and expansion |
08/10/2006 | CA2593675A1 Use of aramid fiber conjunction with thermoplastics to improve wash-off resistance and physical properties such as impact and expansion |
08/09/2006 | EP1687353A1 Laminating adhesives containing polyurethane and epoxide resin |
08/09/2006 | EP1279709B1 Method of bonding adherend |
08/09/2006 | CN1816606A Adhesive epoxy composition and process for applying it |
08/08/2006 | US7087696 Uv-curable epoxy acrylates |
08/08/2006 | US7087304 Polysulfide-based toughening agents, compositions containing same and methods for the use thereof |
08/08/2006 | US7087294 Multilayer containing adhesive layer |
08/02/2006 | CN1810847A Improved epoxy acrylic ester and its prepn |
08/02/2006 | CN1268038C Batch electrically connecting sheet |
08/02/2006 | CN1267520C Felt environmental protection rapid forming adhesive for vehicle internal decorative material and preparing method thereof |
08/01/2006 | US7084210 Vehicular reinforcement; polymethyl methacrylate viscosity enhancing agent; small voids and high Young's modulus |
07/26/2006 | EP1546275A4 Method of adhesion of conductive materials, laminate, and adhesive composition |
07/26/2006 | CN1265958C Improved transparent adhesive sheet |
07/20/2006 | WO2006075482A1 Curable composition |
07/20/2006 | US20060159930 Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same |
07/19/2006 | CN1806326A Dicing/die boding sheet |
07/19/2006 | CN1803882A Alpha, omega end amino polyether used as epoxy resin curing agent and method for preparing the same |
07/19/2006 | CN1264941C Stripping film and adhesive film using stripping film |
07/13/2006 | US20060154078 Curable high-molecular weight epoxy resin based on multicylcic monomer, dicylopentadiene dioxide, a glycidyl acrylate and a curing agent; no phase separation in matrix when dyed with a heavy metal; high adhesion and conduction accuracy; strength, heat/moisture resistance, flexibility; semiconductors |
07/12/2006 | EP1372954B1 Improved transparent adhesive sheet |
07/12/2006 | CN1800290A Flame-proof low-smoke low-toxicity epoxy adhesive |
07/11/2006 | US7074481 Adhesive for joining surface of semiconductor |
07/11/2006 | CA2467924C Instant pothole repair |
07/11/2006 | CA2236819C Reactive resin manufacture |
07/06/2006 | DE102004063329A1 Heat-activable adhesive, useful for gluing and/or production of printed circuit boards, comprises an acrylated copolymer block and a tactifying epoxy, novolak and/or phenolic resins |
07/06/2006 | DE102004063328A1 Heat-activable adhesive, useful for gluing and/or production of printed circuit boards, comprises an acrylated copolymer block and a tactifying epoxy, novolak and/or phenolic resins |