| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
|---|
| 06/26/2007 | US7235593 Command-cure adhesives |
| 06/26/2007 | US7235465 Process for producing semiconductor chips having a protective film on the back surface |
| 06/26/2007 | US7235145 Mechanical activation to produce heat and friction; crosslinkable urea-, melamine, phenol-, or resorcinol-formaldehyde resin or polyurethane is converted into duroplastic; heat resistance; curing |
| 06/26/2007 | CA2368206C Hollow fiber membrane module, its potting material and chemical deaeration method |
| 06/20/2007 | CN1985553A Connection method of conductive articles, and electric or electronic component with parts connected by the connection method |
| 06/20/2007 | CN1322580C 胶粘带 Adhesive tape |
| 06/20/2007 | CN1322265C Gas pipe-line composite reinforcement construction and construction method thereof |
| 06/20/2007 | CN1322084C Silicane modified polyurethane cementing sealing glue and method for making same |
| 06/20/2007 | CN1322060C Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |
| 06/19/2007 | CA2093586C Biphasic fusible interfacing and process for manufacturing thereof |
| 06/13/2007 | CN1980963A Epoxy resin additive |
| 06/12/2007 | US7229708 Magnetic encoder |
| 06/07/2007 | US20070128849 Waferless automatic cleaning after barrier removal |
| 06/06/2007 | EP1793421A2 Semiconductor device, substrate for mounting a semiconductor chip, process for their production, adhesive, and double-sided adhesive film |
| 06/06/2007 | DE102005057590A1 Verwendung von 1-(N'-Cyanoguanyl)-Derivaten N-haltiger Fünfringheterozyklen als Härter für Epoxidharzmassen Using 1- (N'-Cyanoguanyl) derivatives N-containing five-membered ring heterocycles as a hardener for epoxide resin |
| 06/06/2007 | CN1977018A Viscous chemical anchoring adhesive |
| 06/06/2007 | CN1974704A Low temperature fast curing adhesive for mounting chip element and device |
| 06/06/2007 | CN1974658A Fire tetardant no-halogen epoxy resin glue and its prepn process and use |
| 06/06/2007 | CN1974546A Diphenol derivative containing aromatic schiff base and ether band structure and its prepn and application |
| 06/06/2007 | CN1320076C Adhesive for sealing organic electroluminescent element and use thereof |
| 06/06/2007 | CN1320075C Heat curable adhesive composition, article, semiconductor apparatus and method |
| 05/31/2007 | WO2007061613A1 Anisotropic conductive adhesive compositions |
| 05/30/2007 | CN1971888A Adhesives and electric devices |
| 05/30/2007 | CN1970671A Adhesives and electric devices |
| 05/30/2007 | CN1970668A Metal salts of quinolinols and quinolinol derivatives as adhesion and conductivity promoters in die attach adhesives |
| 05/30/2007 | CN1318528C Varnish containing polyamide resin and use thereof |
| 05/29/2007 | US7223820 Amine hardener for epoxy resins |
| 05/24/2007 | WO2007057311A1 Flame retardant prepregs and laminates for printed circuit boards |
| 05/24/2007 | WO2007002812A3 Method to bond concrete slab to metal |
| 05/22/2007 | US7220787 Photoreactive hot-melt adhesive composition |
| 05/22/2007 | US7220785 Anisotropically conductive adhesive comprising crushable microcapsules adhered to a surface of conductive particles |
| 05/22/2007 | US7220484 comprising a nano-reinforcing material, a polymer matrix, and an epoxy-functionalized graft polymer compatible with the polymer matrix; barrier films, barrier foams, or other molded or extruded thermoplastic articles |
| 05/16/2007 | EP1785017A1 Connection method of conductive articles, and electric or electronic component with parts connected by the connection method |
| 05/16/2007 | CN1962799A Low-viscosity heat-conductive adhesive and process for preparing same |
| 05/16/2007 | CN1962798A Epoxy resin adhesive composition and optical semiconductor adhesive adopting same |
| 05/16/2007 | CN1962783A Process for preparing amorphous nano-crystalline magnetic powder magnetic-conductive adhesive |
| 05/16/2007 | CN1962753A Phosphorous epoxy resin composition |
| 05/16/2007 | CN1315965C Segmented curable transfer tapes |
| 05/16/2007 | CN1315963C Process for producing electrical apparatus |
| 05/15/2007 | CA2254112C Bonding fibrous batts with thermosetting fiber-binders of certain epoxy resins |
| 05/10/2007 | US20070105983 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 05/10/2007 | US20070104973 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same |
| 05/10/2007 | US20070104958 Epoxy based reinforcing patches with encapsulated physical blowing agents |
| 05/09/2007 | EP1598398B1 Curable composition |
| 05/09/2007 | CN1958707A Damp embedding glue of epoxy resin |
| 05/09/2007 | CN1958705A Low viscosity, fire resistant embedding glue, and method for preparing modified phenol-formaldehyde resin in the glue |
| 05/08/2007 | USRE39615 Blend of a phenolic resole and the product made by reacting a difunctional epoxide and a di- or trifunctional benzene compound, e.g., resorcinol or m-aminophenol; provides both good adhesion as measured by peel strength testing and good heat resistance as measured by solder blister testing. |
| 05/03/2007 | WO2007050404A1 Concurrently curable hybrid adhesive composition |
| 05/03/2007 | WO2007024882A3 Customizable carbon frames for bicycle or other vehicles |
| 05/03/2007 | US20070095475 Adhesive material and method of using same |
| 05/03/2007 | DE19905800B4 Haft- und Strukturklebstoff und dessen Verwendung Adhesion and structural adhesive and its use |
| 05/03/2007 | DE102006010231A1 System, useful e.g. as flame-retarding system and as safety walls, and in motor vehicles and furniture, comprises a matrix from a fiber, optionally a heat-resistant and flame-retarding fiber, an additive and optionally a resin |
| 05/03/2007 | DE102005052025A1 Bonding formulation for one-stage treatment of reinforcing inserts, e.g. unactivated polyester tyre cord, comprises an aqueous dispersion containing epoxide, blocked isocyanate and resorcinol-formaldehyde latex |
| 05/02/2007 | EP1780251A1 Adhesive composition for optical disk, cured product and article |
| 05/02/2007 | EP1539825A4 Transformable pressure sensitive adhesive tape and use thereof in display screens |
| 05/02/2007 | EP1485252A4 Epoxy adhesive having improved impact resistance |
| 05/02/2007 | CN1955219A Epoxy composite of semi-solidified sheet and its use |
| 04/26/2007 | WO2006084537A3 Radiation cross-linkable hot-melt contact adhesives |
| 04/25/2007 | EP1777278A1 Adhesive composition and sheet having an adhesive layer of the composition |
| 04/25/2007 | CN1954411A Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 04/25/2007 | CN1312247C Heat-resistant and impact-resistant acrylic/epoxy adhesive |
| 04/25/2007 | CN1312246C Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| 04/24/2007 | US7208062 Method of producing multilayer printed wiring board |
| 04/18/2007 | EP1773955A2 Fire retardant composition |
| 04/18/2007 | EP1456321B1 Multi-phase structural adhesives |
| 04/18/2007 | CN1950912A Adhesive for connecting circuit |
| 04/18/2007 | CN1950453A Polycarboxy-functionalized prepolymers |
| 04/18/2007 | CN1950419A Cationically photopolymerizable composition |
| 04/18/2007 | CN1948417A Sealant and its preparation method |
| 04/18/2007 | CN1948414A Method of preparing high performance conductive glue |
| 04/18/2007 | CN1311722C Method for producing components for electronic devices |
| 04/18/2007 | CN1311042C Thermosetting adhesive composition and adhesive band used said composition for electronic member |
| 04/18/2007 | CN1311038C Protective articles |
| 04/12/2007 | WO2007040090A1 Anisotropic conductive adhesive |
| 04/11/2007 | EP1771522A1 Viscous chemical anchoring adhesive |
| 04/11/2007 | EP1771487A1 Epoxy resin additive |
| 04/11/2007 | CN1309787C Energy-ray curing resin composition |
| 04/10/2007 | US7202286 UV-curable compositions |
| 04/05/2007 | WO2007037378A1 High-stability microencapsulated hardener for epoxy resin and epoxy resin composition |
| 04/05/2007 | WO2007036524A1 Uv-curing adhesive, preparation process, adhesively bonded semiconductor component, and method of adhesive bonding |
| 04/05/2007 | US20070078236 Reactive thermosetting system with long storage life |
| 04/05/2007 | CA2625794A1 High-stability microencapsulated hardener for epoxy resin and epoxy resin composition |
| 04/04/2007 | EP1769041A2 Method for treating and sticking work pieces made of metal or a metal alloy comprising a hydrated oxide and/or hydroxide layer |
| 04/04/2007 | EP1422279B1 Semiconductor package with a die attach adhesive having silane functionality |
| 04/04/2007 | CN1942549A Coating agent aqueous compositions for flexible backgrounds |
| 04/04/2007 | CN1942546A Adhesive sheet, semiconductor device, and method for producing the semiconductor device |
| 04/04/2007 | CN1940000A Antiskid glue for stairs |
| 04/04/2007 | CN1939999A Sliver-powder conducting glue and its production |
| 04/04/2007 | CN1308409C Antiwear epoxy resin adhesive |
| 04/04/2007 | CN1308376C Novel sulfurized phenolic resin, process for producing the same, phenol derivative having thioether structure or disulfide structure, process for producing the same, and epoxy resin composition and ad |
| 03/29/2007 | WO2007034713A1 Epoxy resin composition |
| 03/28/2007 | CN1938356A Hardenable composition |
| 03/28/2007 | CN1935896A Epoxy vesin complex and its use |
| 03/22/2007 | WO2007032463A1 Adhesive composition, adhesive sheet using same, and use of those |
| 03/22/2007 | US20070065703 Durable conductive adhesive bonds for fuel cell separator plates |
| 03/21/2007 | CN1931946A Single-component silver filled conductive glue capable of being stored and transported at normal temperature |
| 03/21/2007 | CN1305991C Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator |
| 03/21/2007 | CN1305990C Interfacial adhesive for steel bridge surface paving |
| 03/15/2007 | DE112005000364T5 Leitfähiger Klebstoff Conductive adhesive |
| 03/14/2007 | EP1763070A1 Adhesive sheet for both dicing and die bonding and semiconductor device manufacturing method using the adhesive sheet |