Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09J - Adhesives; Non-mechanical aspects of adhesive processes in general; Adhesive processes not provided for elsewhere; Use of materials as adhesives › C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
11/2013
11/13/2013CN102618200B Organosilicone-epoxy-polyimide adhesive and preparation method thereof
11/13/2013CN102329592B Metal adhesive with multiple components and preparation method thereof
11/13/2013CN102079958B Diamond-filled isotropical high-performance heat-conductive adhesive and preparation method thereof
11/07/2013WO2013166414A2 Adhesive compositions containing graphenic carbon particles
11/07/2013US20130295388 Epoxy resin composition and copper clad laminate manufactured by using same
11/07/2013US20130295381 Latent hardener with improved barrier properties and compatibility
11/06/2013CN103382378A Weather-resistant epoxy adhesive
11/06/2013CN103382377A Quick-drying insulative glue
11/06/2013CN102838960B Low-viscosity epoxy structure adhesive and preparation method thereof
11/06/2013CN102719201B Method for fabricating adhesive sheet
11/06/2013CN102627933B Thixotrope for high-power wind turbine blade and preparation method thereof
11/06/2013CN102618199B Anti-cracking green adhesive for ceiling decoration seams
11/06/2013CN102559120B Temperature-resistant, corrosion-resistant and high-adhesion adhesive and preparation method thereof
11/06/2013CN102504743B Single-component underfill capable of being stored at room temperature and preparation method thereof
11/06/2013CN102459488B Aqueous adhesive agent composition
11/06/2013CN102329586B Epoxy structure adhesive for rotor blades and preparation method thereof
11/06/2013CN102311714B High thermal and electric conducting adhesive filled with nanometer silver and preparation method thereof
11/06/2013CN102307925B Room temperature curing epoxy adhesive
11/06/2013CN102153977B Anti-seepage leak-stopping epoxy adhesive and preparation method thereof
11/06/2013CN102137723B Method for gluing components in forming a temperature resistant adhesive layer
10/2013
10/31/2013WO2013162840A1 Epoxy adhesive composition
10/31/2013WO2013161864A1 Composition for film adhesives, method for producing same, film adhesive, semiconductor package using film adhesive and method for manufacturing semiconductor package using film adhesive
10/31/2013WO2013161826A1 Radiation-curing composition, adhesive and polarizing plate
10/31/2013WO2013161481A1 Epoxy resin curing agent, epoxy resin composition, gas barrier adhesive agent, and gas barrier laminate body
10/31/2013WO2013161480A1 Epoxy resin curing agent, epoxy resin composition, gas barrier adhesive agent, and gas barrier laminate body
10/31/2013WO2013159277A1 Epoxy resin composition for marine maintenance and repair coatings with improved overcoatability
10/30/2013EP2655535A2 Heat-curing sealant compositions having fast skin formation and high tensile strength
10/30/2013EP2655470A1 Storage-stable heat-curable granular material mixture
10/30/2013EP2655469A1 Curable adhesive composition
10/30/2013CN103380188A Thermally conductive adhesive
10/30/2013CN103380185A Double-coated adhesive tape
10/30/2013CN103374320A Method for toughening and curing epoxy resin adhesive by using amino-terminated liquid nitrile rubber
10/30/2013CN103374319A Modified low-temperature structural adhesive and preparation method thereof
10/30/2013CN103374312A Polyolefin bonding resin for ultra-high molecular weight polyethylene (UHMWPE) composite
10/30/2013CN103374204A Epoxy resin composite material, film and circuit substrate
10/30/2013CN103374202A Epoxy resin composite material, film and circuit board
10/30/2013CN102492386B Application of epoxy resin adhesive
10/30/2013CN102433098B Graphene-filled isotropic high-performance heat-conducting adhesive and preparation method
10/30/2013CN102382606B Graphene filling isotropic high-performance conducting adhesive and preparation method thereof
10/30/2013CN102131882B Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component
10/30/2013CN101679829B Photocurable pressure-sensitive adhesive composition
10/24/2013WO2013157567A1 Adhesive composition, adhesive sheet and method for manufacturing semiconductor device
10/24/2013WO2013156337A1 Reinforced epoxy resin adhesive
10/24/2013US20130281559 Adhesive composition for semiconductor and adhesive film comprising the same
10/24/2013US20130280526 Heat-curing sealing compound compositions having fast skin formation and good storage stability
10/24/2013US20130277092 Joining sheet, electronic component, and producing method thereof
10/23/2013EP2654389A1 Joining sheet, electronic component, and producing method thereof
10/23/2013CN103370389A Adhesive agent composition and laminated body
10/23/2013CN103370371A Thermosetting resin composition, cured product thereof, and interlayer adhesive film for printed wiring board
10/23/2013CN103365157A Method of manufacturing charging roll, charging roll, charging unit, process cartridge and apparatus
10/23/2013CN103361019A Epoxy resin pouring sealant
10/23/2013CN103361018A Highly sealed LED light
10/23/2013CN103361017A Medical-packaging use paper-plastic lamination adhesive based on waterborne epoxy resin type and preparation method thereof
10/23/2013CN103361016A Underfill adhesive composition
10/23/2013CN103360996A Multi-purpose aqueous adhesive and preparation method thereof
10/23/2013CN103360973A Masking sheet for manufacture of semiconductor device and method for manufacturing semiconductor device
10/23/2013CN103360966A Oil-resistant scotch tape
10/23/2013CN103360578A Synthetic resin and adhesive containing synthetic resin and for fixing during silicon rod cutting
10/23/2013CN103360556A Preparation method of low-viscosity o-cresol formaldehyde resin
10/23/2013CN102703013B Polyester hot-melt adhesive and coating method thereof
10/23/2013CN102627929B Underfill flowable at room temperature and rapidly solidified at low temperature, and preparation method thereof
10/23/2013CN102516915B Preparation method of modified cross-linked bisphenol A reinforcement adhesive for ballastless track mortar defect repair
10/23/2013CN102471495B Aluminum chelate-based latent curing agent
10/23/2013CN102329585B Leak-blocking adhesive and preparation method thereof
10/22/2013US8564391 Paint composition, in particular anti-corrosive paint for rare earth permanent magnets
10/17/2013WO2013154610A1 Pressure sensitive adhesives based on renewable resources, uv curing and related methods
10/17/2013WO2013154314A1 Semi-hardened pressure-sensitive adhesive film
10/17/2013DE102012206273A1 Vernetzbare Klebmasse mit Hart- und Weichblöcken als Permeantenbarriere Crosslinkable adhesive with hard and soft blocks as Permeantenbarriere
10/16/2013EP2650150A1 Bush- and bracket-integrated stabilizer bar
10/16/2013CN103354831A Cationic polymerizable adhesive and polarizing plate obtained using same
10/16/2013CN103351836A COB (Chip on Board) heat conduction adhesive
10/16/2013CN102660211B Modified epoxy adhesive for aramid paper honeycomb
10/16/2013CN102575138B Curable and cured adhesive compositions
10/16/2013CN102559118B High-temperature-resistant conductive adhesive and preparation method thereof
10/16/2013CN102533193B Bi-component epoxy resin construction adhesive and preparation method thereof
10/16/2013CN102199276B Silicon-containing epoxy resin composition for light-emitting diode (LED) package and preparation method thereof
10/16/2013CN101921557B Halogen-free flame-retardant adhesive composition and flexible copper-clad plate using same
10/16/2013CN101689410B Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material
10/16/2013CN101517029B Curable epoxy resin-based adhesive compositions
10/10/2013WO2013151835A1 Epoxy adhesive, manufacture and use thereof
10/10/2013WO2013150907A1 Electroconductive composition
10/10/2013US20130267136 Structural hybrid adhesives
10/10/2013US20130266811 Compositions for production of abhesive coatings
10/10/2013US20130263995 Structural epoxy resin adhesives containing chain-extended elastomeric tougheners capped with phenol, polyphenol or aminophenol compounds
10/09/2013EP2647685A1 Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet
10/09/2013CN103347974A Electrically conductive adhesives comprising at least one metal precursor
10/09/2013CN103347930A Curable resin composition and cured product thereof
10/09/2013CN103342977A Rapid pipeline repair agent and preparation method
10/09/2013CN102618195B Light shading adhesive, laminated plate, preparation method of light shading adhesive, and application of light shading adhesive
10/09/2013CN102076733B Epoxy resin composition
10/08/2013US8551819 Method for surface mounting using cleaning-free activated resinous composition
10/08/2013US8551287 Hybrid adhesive
10/03/2013WO2013146556A1 Polarizing plate
10/03/2013US20130255879 Curable adhesive composition
10/02/2013EP2644677A2 Adhesive composition
10/02/2013CN103339214A Polyurethane adhesive, adhesive for solar cell protective sheet, and backside protective sheet for solar cell
10/02/2013CN103333652A High-strength epoxy resin iron-core glue used for amorphous transformer
10/02/2013CN103333632A Graphite conductive adhesive and preparation method thereof
10/02/2013CN103333623A Hot-pressed adhesive film and preparation method thereof
10/02/2013CN102876275B Adhesive for adhering ceramic and metal
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