| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
|---|
| 05/29/2001 | US6239245 Resin additive, curable resin composition, and cured resin |
| 05/29/2001 | US6239232 Polyetherimide or polysulphone with polyepoxide partially reacted with aromatic polyamine |
| 05/29/2001 | US6239189 Combining curable oligomer from alkoxylated polyol, unsaturated carboxylic acid and polycarboxylic acid and acrylate of diepoxide in the presence of a polyamide based on polymerized fatty acid. |
| 05/29/2001 | US6238508 Bonding method using fast hardening UV adhesive and slower hardening adhesive |
| 05/29/2001 | CA2053439C Epoxy resin blend for resin transfer molding and filament winding |
| 05/25/2001 | WO2000058086A8 Protective coating of metal and product therefrom |
| 05/23/2001 | EP1101783A2 Casting resin and process for the fabrication of resin molds |
| 05/23/2001 | EP1100661A1 Rotary trowel for use in the molding of ceramics and method for production thereof |
| 05/23/2001 | CN1296504A Low viscosity compositions of epoxy functions polyester resins |
| 05/23/2001 | CN1296047A Solidifiable compositions |
| 05/23/2001 | CN1296024A Partial esterification products of aromatic hydroxy-carboxylic resin and use thereof |
| 05/22/2001 | US6235850 Epoxy/acrylic terpolymer self-fixturing adhesive |
| 05/22/2001 | US6235842 Phase-separated carboxyl group-containing elastomer modified phoenoxy resin optionally with epoxy resin |
| 05/22/2001 | US6235812 Water-dispersible epoxy resins modified with vinyl acetate copolymers |
| 05/22/2001 | US6235811 Containing isophoronediamine hardener for epoxy resin; stability |
| 05/22/2001 | CA2326462A1 Casting resin and process for the fabrication of resin molds |
| 05/19/2001 | CA2323346A1 The use of plastic foams containing swellable fillers for sealing wall channels |
| 05/16/2001 | EP1099730A1 Curable composition |
| 05/16/2001 | EP1099138A1 Stereolithographic compositions for preparing polyethylene-like articles |
| 05/15/2001 | US6232426 Blend containing a thiol, compound, latent curing agent and borate eater |
| 05/15/2001 | US6232399 Flame retardant |
| 05/15/2001 | US6232398 Alkali or acid corrodible organic or composite particles in resin matrix |
| 05/15/2001 | US6232363 Method for producing a diffusion barrier and polymeric article having a diffusion barrier |
| 05/15/2001 | US6231997 Blend of crystalline epoxy resin, phenolic resin, organicphosphorus curing agent, aminosilane coupling agent and filler |
| 05/15/2001 | US6231800 Charging a curable epoxy resin containing epoxy resin,curing agent,curing metal mold,accelerator,inorganic filler;curing,injection molding in epoxy resin |
| 05/10/2001 | WO2001032755A1 Storage-stable prepregs on the basis of duroplastic, oleochemical matrices |
| 05/10/2001 | CA2389539A1 Storage-stable prepregs on the basis of duroplastic, oleochemical matrices |
| 05/10/2001 | CA2325271A1 Curable composition |
| 05/09/2001 | EP0706544B1 Use of a polyamide-based powder composition for the coating of metal substrates |
| 05/09/2001 | EP0621312B1 Epoxy resin composition and production thereof |
| 05/09/2001 | CN1294616A Thermosetting resinous binder compsns. their prepn. and use as coating materials |
| 05/09/2001 | CN1294613A Polyolefin resin compsn, laminate thereof, and process for producing same |
| 05/09/2001 | CN1294166A Connecting materials |
| 05/09/2001 | CN1294150A Process for preparing epoxy resin and its water-base disperse system for compounding with inorganic substances |
| 05/08/2001 | US6228907 Polymerizing epoxy resins using amine curing agents |
| 05/02/2001 | EP1095978A1 Additiv mixture for improvement of mechanic properties of polymers |
| 05/02/2001 | EP1095087A1 Self-dispersing hardenable epoxy resins |
| 05/02/2001 | CN1293685A Curing agent for epoxy resin, epoxy resin composition, and process for producing silane-modified phenolic resin |
| 05/02/2001 | CN1293218A Epoxy resin composition, adhesive film and preimpregnatel blank and multilayer printing circuit board |
| 05/02/2001 | CN1065259C Epoxy resin molding material for sealing electronic parts and sealed semiconductor device using the same |
| 05/02/2001 | CN1065254C 增塑溶胶组合物 Plastisol compositions |
| 05/01/2001 | US6225434 Film-forming compositions having improved scratch resistance |
| 05/01/2001 | US6225418 Thermosetting resin composition |
| 05/01/2001 | US6225417 One-pack type epoxy resin composition |
| 05/01/2001 | US6225405 Stain resistance, and is suitable for producing molded products undergoing severe adhesion of dirt such as kitchen wares, bathroom wares |
| 05/01/2001 | US6225379 Epoxy resin composition for bonding semiconductor chips |
| 05/01/2001 | US6225377 Producing latently reactive prepolymer epoxy resin mixture powder |
| 05/01/2001 | US6225373 Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin |
| 05/01/2001 | US6224710 Curing epoxy resin in contact with hot melt adhesive using cycloaliphatic amine and polyamide amine curing agents |
| 04/26/2001 | WO2001029134A1 Formulation for strippable adhesive and coating films and high performance adhesives |
| 04/26/2001 | WO2001029109A1 Hardener for epoxy resin and epoxy resin composition |
| 04/26/2001 | US20010000518 Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof |
| 04/25/2001 | EP1094087A1 Epoxy resin composition, epoxy resin composition for fiber-reinforced composite, and fiber-reinforced composite containing the same |
| 04/25/2001 | CN1292406A Aquo System solidifying resin composition and method for forming film or multilayer film using said composition |
| 04/25/2001 | CN1292401A Resin composition for sealing semiconductor, and semiconductor using it and manufacturing method |
| 04/25/2001 | CN1064983C Silicone rubber/epoxy resin integral composite and method for making |
| 04/24/2001 | US6221934 Blend containing epoxy surfactant |
| 04/24/2001 | US6221510 Blend of epoxy resin, hardener, coupler and release agent |
| 04/24/2001 | US6221509 Containing cristobalite filler |
| 04/19/2001 | WO2001027190A1 Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material |
| 04/18/2001 | EP1092740A1 Ultraviolet curable resin compositions having enhanced shadow cure properties |
| 04/18/2001 | EP1092739A1 Epoxy resin composition and uses thereof |
| 04/17/2001 | US6218480 Both cyclocarbonate and epoxy groups are used to combine with the different diamine molecules by making use of the different reactivities of aliphatic, cycloaliphatic, and aromatic amine groups. |
| 04/17/2001 | US6218442 Foamable composition comprising one or more thermosettable synthetic resins, one or more curatives, one or more blowing agents, and one or more organometallate compounds selected from organic titanates and organic zirconates |
| 04/17/2001 | CA2056034C Prepregs, process for producing the same and laminates produced with the same |
| 04/17/2001 | CA2047408C Decorative laminate having core sheet impregnated with vinyl ester resin |
| 04/12/2001 | WO2001025358A1 Powder coating compositions |
| 04/12/2001 | WO2001025332A1 Flame-retardant polyester resin composition, molded article thereof, and method of molding the same |
| 04/12/2001 | DE19949403A1 Improving mechanical properties of expanded polystyrene molded article comprises using chemically neutral mixture of materials to coat the polystyrene and reinforce it |
| 04/11/2001 | EP1090971A1 Pressure-sensitive adhesive |
| 04/11/2001 | EP1090942A1 Resin composition for semiconductor encapsulation, semiconductor device comprising the same and process for the production of semiconductor device using the same |
| 04/11/2001 | EP1090813A1 Expandable sealant composition containing a grafted olefinic polymer |
| 04/11/2001 | EP1090057A1 Reworkable thermosetting resin compositions |
| 04/10/2001 | US6214905 Encapsulating semiconductors |
| 04/10/2001 | US6214904 Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device |
| 04/10/2001 | US6214468 Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same |
| 04/10/2001 | US6214455 Bisphenol a epoxy resin, novolak epoxy resin, reactive phosphoric acid ester, curing agent of nitrogen-containing phenolic resin prepared by the co-condensation of a phenolic compound, a guanamine compound, and an aldehyde compound |
| 04/10/2001 | US6214418 Thermosetting, high-solids coating composition and method of forming topcoat by using the same |
| 04/10/2001 | US6214159 Curable epoxide composition and its use |
| 04/05/2001 | WO2001023477A1 Flame retardant reinforced composites |
| 04/05/2001 | WO2001023474A2 Polymer blends containing modified polyesters |
| 04/05/2001 | WO2001023467A1 Rubber composition |
| 04/05/2001 | WO2001023466A1 Electrically conductive adhesive containing epoxide-modified polyurethane |
| 04/05/2001 | WO2001023461A1 Expansion temperature tolerant dry expandable sealant and baffle product and method of preparing same |
| 04/05/2001 | WO2000057506A8 Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds |
| 04/05/2001 | CA2385818A1 Polymer blends containing modified polyesters |
| 04/04/2001 | EP1088024A1 Polymer composite and a method for its preparation |
| 04/04/2001 | EP0960159A4 Primer for plastic films |
| 04/04/2001 | CN1064062C Epoxy resin composition used for formation and press molt articles of high voltage apparatus and manufacture thereof |
| 04/04/2001 | CN1063984C Improved double metal cyanide complex catalysts |
| 04/03/2001 | US6211277 Lead on chip structure semiconductor with epoxy resin |
| 04/03/2001 | US6210811 Improved heat resistance, improved moisture resistance, low stress property |
| 04/03/2001 | CA2021016C Acoustic vibrational material from fiber-reinforced polybutadiene-modified epoxy resin |
| 03/29/2001 | DE19946323A1 Polymerblends enthaltend modifizierte Polyester Polymer blends containing modified polyester |
| 03/28/2001 | EP1087262A2 Energy-ray curing resin composition |
| 03/28/2001 | EP1086972A1 Hardener for epoxy resin, epoxy resin composition, and process for producing silane-modified phenolic resin |
| 03/28/2001 | EP1086160A1 Carboxy-functionalized polyphenylene ethers and blends containing them |
| 03/28/2001 | CN1288915A Epoxy resin composite containing organosilicon modifier |
| 03/28/2001 | CN1288914A Epoxy resin composite containing compound inorganic stuffing |
| 03/27/2001 | US6207786 Ternary systems of benzoxazine, epoxy, and phenolic resins |