| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 01/16/2001 | US6174967 Composition of epoxy resin and (cyclo)alkoxy-substituted organosilane |
| 01/16/2001 | US6174932 Curable sealant composition |
| 01/16/2001 | US6174928 Process for producing fluorinated oligomer having COOH groups at both ends |
| 01/16/2001 | US6174640 Epoxy based liquid toner formulations |
| 01/16/2001 | CA2074899C Toughened, fiber-reinforced thermosetting resin matrix prepregs and composites made therefrom |
| 01/11/2001 | WO2001002491A1 Bitumen and filled resin emulsion for road surfacing emulsion |
| 01/11/2001 | WO2001002486A1 Liquid thermosetting resin composition and method of permanent hole-filling for printed wiring board using the same |
| 01/11/2001 | WO2001002454A1 Phenol-novolacs with improved optical properties |
| 01/11/2001 | CA2346238A1 Phenol-novolacs with improved optical properties |
| 01/11/2001 | CA2342713A1 Bitumen and filled resin emulsion for road surfacing emulsion |
| 01/10/2001 | EP1066356A1 Coating composition |
| 01/10/2001 | CN1279257A Polysiloxane modified epoxy resin composition |
| 01/09/2001 | US6172143 Comprising epoxy compound, polycarbodiimide resin in 0.1 to 10 parts by weight relative to 100 parts by weight of the epoxy compound, and epoxy resin curing agent comprising one of an acid anhydride, imidazole, dicyandiamide and phenol |
| 01/09/2001 | CA2134260C Curable resin composition for coating uses |
| 01/09/2001 | CA2010671C Thermoplastic molding compositions |
| 01/04/2001 | WO2001000405A2 Manufacture of void-free laminates and use thereof |
| 01/03/2001 | EP0981661A4 Nonaqueous sizing for glass and carbon fibers |
| 01/03/2001 | CN1278844A Water compatible curing agents for epoxy resins |
| 01/02/2001 | US6169159 Alcohol-blocked brominated bisphenol a epoxy resin flame retardants for carbonyl-containing thermoplastic resins |
| 01/02/2001 | US6168872 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 01/02/2001 | CA2183187C Aqueous colored base coating composition and method for forming topcoat |
| 12/28/2000 | WO2000079582A1 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| 12/28/2000 | WO2000079156A1 Gasket and method for producing a gasket |
| 12/28/2000 | WO2000078887A1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 12/28/2000 | WO2000078867A1 Thermoplastic polyester resin composition |
| 12/28/2000 | CA2374187A1 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| 12/27/2000 | EP1063260A1 Polyolefin resin composition, laminate thereof, and process for producing the same |
| 12/27/2000 | EP1063247A1 Curable resin composition, modified copolymer and resin composition, and alkali development type photocurable glass paste |
| 12/27/2000 | CN1277981A Liquid crystal display sealing material using plastic substrate |
| 12/26/2000 | US6166131 Highly reactive modified phenolic resin and molding material for electrical/electronic parts and semiconductor sealing material |
| 12/26/2000 | US6165617 Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil |
| 12/21/2000 | WO2000077067A1 Epoxy resin hardener compositions |
| 12/21/2000 | WO2000076764A1 Epoxy resin, styrene-maleic anhydride copolymer and flexibilizer |
| 12/21/2000 | DE19927949A1 Kationisch härtende Masse, ihre Verwendung sowie Verfahren zur Herstellung gehärteter Polymermassen Cationic curing compound, use thereof and processes for the production of cured polymer masses |
| 12/20/2000 | EP1061402A2 Sealing material for liquid crystal display using plastic substrate |
| 12/20/2000 | EP1061101A2 Cationally hardenable compositions and polymers therefrom |
| 12/20/2000 | EP1060213A1 Hybrid materials employing ppe/polystyrene/curable epoxy mixtures |
| 12/20/2000 | CN1277227A Composite aqueous epoxy resin-inorganic matter dispersion system and its preparation |
| 12/20/2000 | CN1277226A Epoxy resin composite and its preparation |
| 12/20/2000 | CN1277225A Epoxy resin composition flexibilized with liquid and hydroxyl rubber |
| 12/20/2000 | CN1059686C Artificial metal composite material and its producing process |
| 12/19/2000 | US6162878 (a) a biphenyl skeleton-bearing epoxy resin, (b) a biphenyl skeleton-bearing phenolic resin as a curing agent, (c) an organosiloxane containing phenyl and organooxy groups, and (d) an inorganic filler |
| 12/19/2000 | US6162510 Method of manufacturing a color filter |
| 12/14/2000 | DE19926629A1 Epoxidharzhärter-Zusammensetzungen Epoxy resin hardener compositions |
| 12/13/2000 | EP1059335A2 Non-crystalline polyester resin composition |
| 12/13/2000 | EP1059334A2 Epoxy resin-vinyl acetate polymer blends |
| 12/13/2000 | EP1059323A1 Thermosetting composition containing polyhemiacetal ester resin and powdery thermosetting composition |
| 12/13/2000 | EP1058702A1 Curable composition comprising epoxidised natural oils |
| 12/12/2000 | US6160078 Composition comprising an epoxy resin, a phenolic resin, and an inorganic filler; improved flame retardance, reflow crack resistance and dielectric properties |
| 12/12/2000 | US6159537 Applying to retroreflective layer and curing a prebinder comprising epoxy resin and an alkoxysilane terminated polymer |
| 12/06/2000 | EP1057817A1 Novel compounds, hardening accelerator, resin composition, and electronic part device |
| 12/06/2000 | EP1056699A1 Preparation of polyindanebisphenols and polymers derived therefrom |
| 12/06/2000 | CN1275593A Method for making epoxy resin polymer having low electronic impedance its products and application |
| 12/05/2000 | US6156915 Reacting a first compound with an amine group and a second compound with an epoxide group at a certain ratio and at a certain temperature to form the reactive and durable antistatic agent |
| 12/05/2000 | US6156865 Flame retardant thermosetting resin composition |
| 12/05/2000 | US6156835 Polymer-organoclay-composites and their preparation |
| 11/30/2000 | WO2000071597A1 Photocuring and thermosetting composition |
| 11/29/2000 | EP1055714A1 Fire-resistant coating material |
| 11/29/2000 | EP1055690A1 Process for producing modified phenolic resin |
| 11/29/2000 | EP1054921A1 A polymeric composition for friction elements |
| 11/28/2000 | US6153721 Preparation of polyindanebisphenols and polymers derived therefrom |
| 11/28/2000 | US6153302 Epoxy/thermoplastic photocurable adhesive composition |
| 11/28/2000 | US6153264 Polyester having a weight average molecular weight of 10,000 to 50,000 and optionally a modifying resin, selected from epoxy resins having epoxy equivalent weight of 500 to 15,000, acrylic resins or polyolefin resins; for metal substrates |
| 11/23/2000 | WO2000069960A1 Process for preparing starch and epoxy-based thermoplastic polymer compositions |
| 11/23/2000 | CA2372226A1 Process for preparing starch and epoxy-based thermoplastic polymer compositions |
| 11/22/2000 | EP1053787A1 Improved double metal cyanide complex catalysts |
| 11/22/2000 | EP1053675A2 Improved animal chew |
| 11/22/2000 | CN1274378A Semiconductor sealing epoxy resin compsn. and semiconductor device using same |
| 11/22/2000 | CN1058738C Open-loop polymerized phenolic resin and relevant composite fibre-reinforced material |
| 11/21/2000 | US6150473 Polyetherimide resin/polyester resin blends having improved properties |
| 11/21/2000 | US6150436 Material containing polyreactions products and method for the production thereof |
| 11/21/2000 | US6150435 An epoxy resin copolymer comprising two different molecular weight polyol components; improve the properties of coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity |
| 11/21/2000 | US6150428 Expansion temperature tolerant dry expandable sealant and baffle product and method of preparing same |
| 11/21/2000 | US6150032 Electroactive polymer coatings for corrosion control |
| 11/16/2000 | WO2000069232A1 Thermosetting polymer systems and electronic laminates |
| 11/16/2000 | CA2373154A1 Thermosetting polymer systems and electronic laminates |
| 11/15/2000 | CN1058510C Photodegradation-resistant electrodepositable primer compositions and method for coating bottom material |
| 11/14/2000 | US6146717 Method of impregnating components |
| 11/14/2000 | US6146703 Method of Producing High Solids Coating Composition and Coatings Resulting Therefrom |
| 11/14/2000 | US6146488 Thermosetting epoxy resin, a latent curing agent and as an additive, conductive metal, metal oxide, metal carbide, metal nitride, metal boride, or metal silicide, in powder form |
| 11/14/2000 | CA2049180C High modulus silicones as toughening agents for epoxy resins |
| 11/09/2000 | WO2000066642A1 Polyolefin compositions, method for the production and use thereof |
| 11/09/2000 | WO2000066338A1 Fiber reinforced epoxy resin product and method for the manufacture thereof |
| 11/09/2000 | CA2371616A1 Polyolefin compositions, method for the production and use thereof |
| 11/08/2000 | CN1272308A Improved animal mastax |
| 11/07/2000 | US6143809 Process to prepare aqueous dispersions of epoxy resins |
| 11/07/2000 | US6143423 Comprising epoxy resin, phenolic resin, polyimide, inorganic filler; used to encapsulate semiconductor device |
| 11/07/2000 | US6143363 Ink receiver layer for printing of various products poor in absorption of water-based ink, |
| 11/07/2000 | US6142677 Plastic split optical alignment sleeve for optical connectors and method of fabricating the same |
| 11/07/2000 | CA2079455C Crosslinkable surface coatings and methods for producing same |
| 11/02/2000 | WO2000064960A1 Thermosetting resin composition and flexible-circuit overcoating material comprising the same |
| 11/02/2000 | WO2000064669A1 Phenol-novolacs with improved optical properties |
| 11/02/2000 | WO2000064572A2 Epoxy-functional polymeric microbeads |
| 11/02/2000 | EP1049152A2 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 11/02/2000 | EP1048682A2 Thermosetting resin composition for prestressed concrete tendon, its use and prestressed concrete tendon using the composition |
| 11/02/2000 | EP1047740A1 Curable resin compositions |
| 11/02/2000 | CA2335163A1 Phenol-novolacs with improved optical properties |
| 11/01/2000 | CN1272178A Temp sensor and electronic apparatus containing same |
| 10/31/2000 | US6140454 Comprising an epoxy resin, a phenolic resin and a polycarbodiimide resin; integrated circuit package resin composition |
| 10/31/2000 | US6140421 Flame retardant curable epoxy resin containing a curing agent mixture comprising lower ultraviolet light absorbing phenol-formaldehyde novolak and higher absorbing phenol-glyoxal polycondensate |