| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 10/31/2000 | US6140025 Photoresists pattern films, curing in laser light and photosensitive films, development |
| 10/31/2000 | US6139920 Photoresist compositions |
| 10/28/2000 | CA2306727A1 Thermosetting resin composition for prestressed concrete tendon, its use and prestressed concrete tendon using the composition |
| 10/25/2000 | EP0948554B1 Material containing polyreactions products and method for the production thereof |
| 10/25/2000 | EP0868485B1 Compositions comprising hydroxy-functional polymers |
| 10/25/2000 | EP0835892B1 Epoxy resin composition for printed wiring board and laminated board produced with the use of the same |
| 10/25/2000 | EP0835287B1 Use of silicone-modified epoxy resins as potting compound |
| 10/25/2000 | CN1270979A Organic silicon/epoxy resin packing material modified with nanometer-level silicon-base oxide |
| 10/24/2000 | US6136944 Adhesive of epoxy resin, amine-terminated polyamide and polyamine |
| 10/24/2000 | US6136928 Curable compositions based on functional polysiloxanes |
| 10/24/2000 | US6136922 Curable; hard, weatherproof, solvent resistant coatings |
| 10/24/2000 | US6136921 Alkali metal-terminated polymer reacted with diglycidyl ether derivative coupling agent; corrosion and wear resistance; radiation transparent |
| 10/24/2000 | US6136894 Aqueous epoxy resin system with curing agent from reacting acid-terminated polyalkylene glycol with epoxy-amine adduct |
| 10/24/2000 | US6136427 Glass panel assembly |
| 10/24/2000 | US6136398 A curable formulation for a film is formed by mixing a curable epoxy resin, a curing agent for epoxy reins, a thermoplastic ethylene-vinyl acetate copolymer and a thermoplstic polyester compatibilizing resin, a release liner |
| 10/24/2000 | US6136384 Epoxy/thermoplastic photocurable adhesive composition |
| 10/24/2000 | US6134772 Via fill compositions for direct attach of devices and methods of applying same |
| 10/18/2000 | EP1044777A1 Molding method for corrosion-resistant FRP |
| 10/18/2000 | EP0771334B1 Epoxidized low viscosity rubber toughening modifiers for epoxy resins |
| 10/18/2000 | EP0646143B1 Macromonomers having reactive side groups |
| 10/17/2000 | US6133383 Adding a catalytic curing agent to a difunctional epoxy resin, increasing the temperature of the resin to get a prefered viscosity, increasing the temperature to reduce the viscosity, increasing the temperature to cure the resin |
| 10/17/2000 | US6133377 Compostion of epoxy resin, phenol-triazine-aldehyde condensate and rubber |
| 10/17/2000 | US6133357 Mixtures of thermosets and oxidized polyarylene sulfides |
| 10/17/2000 | CA1341122C Reactive hot-melt adhesive |
| 10/12/2000 | WO2000060614A1 Anisotropically conductive paste |
| 10/12/2000 | WO2000060005A1 Sealing material composition for liquid crystal |
| 10/11/2000 | CN1269813A Laminar preprey |
| 10/11/2000 | CN1269809A Epoxy resin composition |
| 10/05/2000 | WO2000058086A1 Protective coating of metal and product therefrom |
| 10/05/2000 | DE10016120A1 Rubber material for production of tubing, rubber-metal composites and other products contains rubber, 6-substituted 2,4-dimercapto-1,3,5-triazine and epoxide-containing polymer which is crosslinkable with the rubber |
| 10/05/2000 | DE10016118A1 Rubber material, e.g. for tires, belts and rollers, contains hydrogenated nitrile-diene copolymer rubber, organic peroxide, 2,4,6-trimercapto-1,3,5-triazine and a peroxide-crosslinkable polymer with epoxy groups |
| 10/05/2000 | CA2366516A1 Protective coating of metal and product therefrom |
| 10/04/2000 | EP1041116A2 Compositions comprising hydroxy-functional polymers |
| 10/04/2000 | EP1040150A1 Novolaks as water-unaffected accelerators for epoxy resin hardeners |
| 10/04/2000 | EP0788344B1 Photopolymerizable composition |
| 10/03/2000 | US6127508 Epoxy resin and amine-terminated polyamide from aminoalkylpiperazine |
| 10/03/2000 | US6127491 Phenolic resin polyols and polymers derived from the polyols |
| 10/03/2000 | US6127460 Liquid epoxy resin potting material |
| 10/03/2000 | US6127459 Prepared by reacting polyamine having at least 3 active amine hydrogen atoms per molecule and at least one epoxy resin to obtain an amine-terminated intermediate, reacting intermediate with acid terminated polyoxyalkylene glycol |
| 10/03/2000 | US6127085 Photo-curable resin composition |
| 10/03/2000 | CA1341109C Slurry mixing of bismaleimide resins |
| 10/03/2000 | CA1341104C Antistat plastic materials containing epihalohydrin polymers |
| 09/28/2000 | WO2000057506A1 Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds |
| 09/28/2000 | WO2000056799A1 Reworkable thermosetting resin compositions |
| 09/28/2000 | WO2000056798A1 Urethane oligomer, resin compositions thereof, and cured article thereof |
| 09/28/2000 | WO2000043131A3 Autodepositable adhesive |
| 09/28/2000 | DE19913431A1 Modifying toughness of hardened resins, useful e.g. as matrix for fiber-bonded materials, by incorporation of polyurethane that has been degraded by hydrothermal treatment |
| 09/28/2000 | CA2365144A1 Urethane oligomer, resin compositions thereof, and cured article thereof |
| 09/28/2000 | CA2331790A1 Reworkable thermosetting resin compositions |
| 09/27/2000 | EP1039537A2 Heat conductive resin substrate and semiconductor package |
| 09/27/2000 | EP1038913A1 Nanooomposities formed by onium ion-iniercalated clay and rigid anhydride-cured epoxy resins |
| 09/27/2000 | EP1038834A1 Surface modified layered silicate material and compositions containing the same |
| 09/27/2000 | CN1267891A Conducting and resistance material with electrical stability using for electronic equipment |
| 09/26/2000 | US6124420 An epoxy resin obtained by using a cresol novolak resin of which the total content of 3 to 6 nucleus bodies is 67 to 90% by weight |
| 09/26/2000 | US6124408 The composite comprises a photosensitive resin and thermoplastic resin forming a quasi-homogeneous compatible structure, wherein photosensitive resin comprsies atleast one of acrylated resin; improved heat resistance/photosensitivity |
| 09/26/2000 | US6124401 Thermoplastic coating compositions and process using same |
| 09/26/2000 | US6124023 Prepreg for laminate and process for producing printed wiring-board using the same |
| 09/21/2000 | WO2000055268A1 Polyester powder coating compositions |
| 09/21/2000 | WO2000055267A1 Extrusion coating polyester compositions |
| 09/21/2000 | WO2000055254A1 Hardenable composition with a particular combination of characteristics |
| 09/21/2000 | WO2000055234A1 Epoxy resin compositions having a long shelf life |
| 09/21/2000 | CA2365510A1 Hardenable composition with a particular combination of characteristics |
| 09/20/2000 | EP1036811A1 Prepreg and laminated board |
| 09/20/2000 | EP1036110A1 Cross-linked polyamide binders for ceramics manufacture |
| 09/20/2000 | CN1267317A Conductive epoxy resin compositions anisotropically conductive adhesive films and electrical connecting methods |
| 09/20/2000 | CN1267314A Flame retardant epoxy resin composition |
| 09/20/2000 | CN1266872A Water surface treatment agent for metal material and furface treated metal plate |
| 09/20/2000 | CN1266866A Curing of butyl rubber |
| 09/20/2000 | CN1266859A Phenol-amino condensation resin, preparing method, epoxy resin composition, prepreg and laminated board thereof |
| 09/20/2000 | CN1056624C Process for preparing adhesive block copolymer |
| 09/19/2000 | US6121405 Method for preparing a high-heat-resistant-epoxy-resin composition comprising pyrazinium salt containing a benzyl group |
| 09/19/2000 | US6121389 An epichlorohydrin-modified polyester based on a dicarboxylic acid and a dihydroxy(tertiary-aliphatic)monocarboxylic acid; coatings; castings; low temperature curing; low viscosity;high epoxy functionality |
| 09/19/2000 | US6121355 Comprising a nullified hydrophilic functional groups of the emulsifier to increase the water dispersion of adhesive; water resistance and adhesive strength |
| 09/19/2000 | US6121348 Powderable reactive resin compositions |
| 09/19/2000 | US6121339 Adhesive |
| 09/19/2000 | US6120716 Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same |
| 09/19/2000 | CA2299705A1 Nanocomposites formed by onium ion-intercalated clay and rigid anhydride-cured epoxy resins |
| 09/19/2000 | CA2081210C Glass-reinforced grafted branched higher alpha-olefins |
| 09/14/2000 | WO2000053645A1 Hydroxy-epoxide thermally cured undercoat for 193 nm lithography |
| 09/13/2000 | EP1035148A1 Aqueous solution of water-soluble epoxy resin, solid obtained therefrom, and processes for producing these |
| 09/13/2000 | EP1034193A1 Phenol-novolacs with improved optical properties |
| 09/13/2000 | EP0929592A4 Thermosetting resin compositions useful as underfill sealants |
| 09/12/2000 | US6117953 Blends |
| 09/12/2000 | US6117950 Modified with epoxy resin |
| 09/12/2000 | US6117551 Impregnated multifilaments with a specific degree of fiber entanglement in thermosetting resin, and thermoplastic particles; tackiness, excellent compression interlaminar shear strength at high temperature |
| 09/08/2000 | WO2000022024A3 High strength epoxy adhesive and uses thereof |
| 09/06/2000 | EP1033382A2 Resin additive, curable resin composition, and cured resin |
| 09/06/2000 | CN1265695A Aqueous dispersions of epoxy resins |
| 09/05/2000 | US6114473 Comprising carboxyl group-containing resin having molecular weight of 1,000 to 20,000, acid value of 5 to 200, glass transition temperature of 30 to 120 degrees c, polymerization inhibitor, tris(beta-methylglycidyl)isocyanurate |
| 09/05/2000 | US6114007 Flame resistant reinforced composites |
| 08/31/2000 | WO2000050512A1 Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device |
| 08/30/2000 | EP1032038A2 Conductive and resitive material with electrical stability for use in electronics devices |
| 08/30/2000 | EP1030886A1 Method for reinforcing thermosetting resins with isobornyl acrylate or methacrylate polymers |
| 08/30/2000 | EP1030885A1 Water compatible curing agents for epoxy resins |
| 08/29/2000 | US6111044 Thermosetting compositions, coating compositions method of coating, and coated articles |
| 08/29/2000 | US6111015 Core/shell polymer toughener suspended in epoxy resin |
| 08/29/2000 | US6110996 Building composition and method for making the same |
| 08/29/2000 | US6110993 Thermosetting epoxy resin composition |
| 08/24/2000 | WO2000049089A1 Polyester molding composition |
| 08/24/2000 | WO2000049087A1 Epoxy resin composition |