| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 08/24/2000 | WO2000049061A1 Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 08/24/2000 | DE19903707A1 Flammwidrige duroplastische Massen Flame retardant thermoset composition |
| 08/23/2000 | EP1029893A2 Resin composition |
| 08/23/2000 | EP1029000A1 Crystallization resistant amidoamine compositions |
| 08/23/2000 | EP0906352B1 Novolak compounds useful as adhesion promoters for epoxy resins |
| 08/23/2000 | CN1263909A Polyetherimide modified epoxy resin |
| 08/22/2000 | US6107362 Consists of acrylic or mathacrylic compounds of epoxide(meth) acrylates, obtained by reacting acrylic acid or methacrylic acid with an epoxide in presence of an esterification product of hydroxy compound with same acrylic or methacrylic acid |
| 08/22/2000 | US6106891 Applying a curable fill to an aperture, peeling a layer of polymer, applying heat and pressure |
| 08/17/2000 | WO2000047686A1 Soluble adhesives |
| 08/17/2000 | WO2000047654A1 Highly resistant polymeric resin |
| 08/17/2000 | DE19905877A1 Hochfestes Polymerharz High-strength polymer resin |
| 08/17/2000 | DE19905800A1 Haft- und Strukturklebstoff zur aggressiven Fixierung von Fügeteilen mit anschließender Aushärtung in der Klebefuge mittels thermischer Energiezufuhr Adhesion and structural adhesive for fixing aggressive adherends followed by curing in the joint by means of thermal energy supply |
| 08/17/2000 | CA2362502A1 Soluble adhesives |
| 08/16/2000 | EP1028151A1 Pressure sensitive adhesive and structural adhesive for the aggressive fixation of joint parts followed by curing in the glue joint adding thermal energy |
| 08/16/2000 | CN1263546A Resin compositions for coatings |
| 08/16/2000 | CN1263541A Powder coatings or adhesives employing silanes or silane treated fillers |
| 08/15/2000 | US6103838 Curable compositions based on functional polysiloxanes |
| 08/15/2000 | US6103824 A polysiloxane protective coatings compositions which are curable at both ambient and thermal cure conditions with increased pot-life, improved tack-time, adhesion, wear resistance and acid etch resistance |
| 08/15/2000 | US6103784 Corrosion resistant structural foam |
| 08/15/2000 | US6103157 Process for impregnating electrical coils |
| 08/10/2000 | WO2000046300A1 Curable resin composition |
| 08/10/2000 | WO2000046299A1 Aromatic polycarbonate resin composition |
| 08/10/2000 | WO2000046296A1 Polyester molding composition |
| 08/10/2000 | DE19904835A1 Lösbare Klebstoffe Releasable adhesives |
| 08/10/2000 | CA2361829A1 Curable resin composition |
| 08/09/2000 | EP1026204A2 Flame retardant resin compositions |
| 08/09/2000 | EP1025141A1 Epoxy resin mixture, composites produced therefrom and the use thereof |
| 08/09/2000 | EP0751981B1 Liquid crystal composite and method of making |
| 08/09/2000 | CN1262289A Single-component thermosetting epoxy resin system |
| 08/08/2000 | US6101308 Composition for encapsulating signal transmission devices |
| 08/08/2000 | US6099685 Food packaging, it reacts with the epoxy compound in the process of oxidation, epoxy compound is first grafted to the polyethylene and then the unreacted epoxy groups react with the functional groups (e.g., amino groups, carboxyl groups, |
| 08/03/2000 | WO2000044805A1 Flame-retardant vinyl esters, resins and resin compositions containing the same, and cured products thereof |
| 08/03/2000 | WO2000044669A1 Melamine-modified phyllosilicates |
| 08/02/2000 | EP1024168A1 Flameretardant duroplastic masses |
| 08/01/2000 | US6096806 Composition comprising water, film forming polymer molecules having specified particle size distribution, emulsifying agent, dissolved accelerator |
| 08/01/2000 | US6096796 Composition comprising cycloaliphatic diepoxide, compound having cyclohexene oxide structure, cationic photoinitiator, unsaturated monomer, radical photoinitiator, polyol having three or more hydroxyl groups |
| 08/01/2000 | US6096411 Comprising 70-90 wt % of copper particles of an average particle size of 0.5-8 mu m, 0.5-15 wt % of insulating particles of an average particle size of 10-20 mu m, 6-17 wt % of thermosetting type liquid epoxy resin |
| 08/01/2000 | CA2081629C Electrically conductive polymer composition |
| 07/27/2000 | WO2000043131A2 Autodepositable adhesive |
| 07/26/2000 | EP1021482A1 Laminar prepreg |
| 07/26/2000 | EP0858615B1 Thermosetting anti-reflective coatings and method for making same |
| 07/26/2000 | CN1261081A Drip resin similar to crystal |
| 07/25/2000 | CA2056360C Curable blends of hydrolysable polyoxypropylenes and epoxy resins |
| 07/25/2000 | CA2014539C Water borne metallic coating composition |
| 07/19/2000 | EP1019247A1 Sealant composition, article including same, and method of using same |
| 07/19/2000 | CN1260362A Epoxy resin and resin sealed semiconductor device |
| 07/18/2000 | US6090891 Carboxyl-containing polymer(s) with (2-oxo-1,3-dioxolan-4-yl)methyl groups-containing compound(s) |
| 07/18/2000 | US6090890 Epoxy-functional branched organopolysiloxane and an acrylic resin containing aromatic vinyl monomeric units in an amount of from 5 to 70 wt %, and fluororesins, said compound bearing a functional group reactive with the epoxy group |
| 07/18/2000 | US6090729 Sheet material for core support |
| 07/18/2000 | CA2187371C Mar resistant coating composition |
| 07/18/2000 | CA2009011C Tough epoxy resins |
| 07/13/2000 | WO2000040648A1 Heat debondable adhesive composition and adhesion structure |
| 07/13/2000 | WO2000040641A1 Thermosetting composition containing polyhemiacetal ester resin and powdery thermosetting composition |
| 07/13/2000 | WO2000040632A1 Curable resin composition, modified copolymer and resin composition, and alkali development type photocurable glass paste |
| 07/13/2000 | WO2000020483A3 Impact-resistant epoxide resin compositions |
| 07/13/2000 | DE10000985A1 Cationically polymerizable resin, useful for the coating of electronic components comprises a compound having an oxirane and/or oxetane ring, an onium salt, an organic peroxide and an alkaline filler |
| 07/12/2000 | EP0927213B1 Thermoset resins based on epoxy vinyl ester and urethane vinyl ester resins mixtures |
| 07/12/2000 | EP0880553B1 Increasing the molecular weight of polycondensates |
| 07/12/2000 | EP0880552B1 Increasing the molecular weight of polyamides |
| 07/12/2000 | CN1260049A Retroreflective article having a binder layer contg. an epoxy resin an a silicone cross-linked polymer |
| 07/06/2000 | WO2000039235A1 Sealant compositions and sealant articles using the same |
| 07/06/2000 | WO2000039189A1 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 07/06/2000 | WO2000039188A1 Epoxy resin composition, prepreg, and roll made of resin reinforced with reinforcing fibers |
| 07/06/2000 | CA2353882A1 Sealant compositions and sealant articles using the same |
| 07/05/2000 | EP1016691A1 Curing of butyl rubber with a phenolic resin |
| 07/05/2000 | EP0749450B1 Coating composition and process for forming cured film |
| 07/04/2000 | US6084039 Triglycidyl ether of a (bis(hydroxyaryl)methyl), (hydroxyaryl)-cyclohexane compound of given formula and curing agent forms a polyepoxide having good balance of heat and moisture resistance; use as encapsulant for electronics |
| 07/04/2000 | US6084037 Epoxy resin composition and semiconductor device |
| 07/04/2000 | US6084006 Color filter, liquid crystal using the same, manufacturing methods thereof, and ink for ink jet used in the manufacturing method |
| 07/04/2000 | US6084004 Compositions which undergo light-induced cationic curing and their use |
| 07/04/2000 | CA2170325C Flexible weatherable, acrylic coating powder |
| 06/30/2000 | CA2258472A1 Curing of butyl rubber |
| 06/30/2000 | CA2257707A1 Curing of butyl rubber |
| 06/29/2000 | WO2000037555A1 Process for producing tyres, tyres thus obtained and elastomeric compositions used therein |
| 06/29/2000 | WO2000037527A1 Self-dispersible hardenable epoxide resins |
| 06/29/2000 | DE19961800A1 New novolak epoxy resin, useful for sealing semiconductor components, has high content of binuclear compounds and low viscosity |
| 06/28/2000 | EP1013730A1 Curable composition for coatings, coated articles and resin composition for coatings |
| 06/28/2000 | EP1013684A1 Flame retardant resin material and flame retardant resin composition |
| 06/28/2000 | EP1012200A1 Epoxy resin compositions |
| 06/22/2000 | WO2000036018A1 Polyetherimide resin/polyester resin blends having improved visual clarity |
| 06/22/2000 | WO2000036003A1 Polyetherimide resin/polyester resin blends having improved properties |
| 06/22/2000 | WO2000035986A1 Epoxy resin system |
| 06/22/2000 | WO2000035540A1 Baseball bat |
| 06/21/2000 | DE19858920A1 Self-dispersible, curable epoxy resin for use in coating materials, obtained by reacting epoxy resin with a poly:functional phenol and the adduct of an aromatic poly:epoxide and a polyoxyalkylene-amine |
| 06/21/2000 | CN1257518A Nitrogen-containing epoxy resins for photocurable coating applications |
| 06/21/2000 | CN1257068A Process for preparation of condensed sulfamide |
| 06/21/2000 | CN1053683C Resin curing agent and preparation process thereof |
| 06/20/2000 | US6077905 Polyamide resin and a terpolymer comprising ethylene and an unsaturated epoxide, being obtained by copolymerization or by grafting the epoxide; melt flow index of the composition is less than the melt flow index of the polyamide resin |
| 06/20/2000 | US6077886 Having improved non slump and sag resistance properties |
| 06/20/2000 | US6077884 Nonionically stabilized, solvent-free, low viscosity dispersions |
| 06/20/2000 | US6077879 Curable resin and resin composition |
| 06/20/2000 | US6077382 Mounting method of semiconductor chip |
| 06/20/2000 | CA2125682C Dynamically vulcanized multi-component polymer blend |
| 06/15/2000 | WO2000034406A1 Adhesive powder |
| 06/15/2000 | WO2000034388A1 Hydrophobic epoxide resin system |
| 06/15/2000 | WO2000034387A1 Acrylic terpolymer for the use as a self-fixturing adhesive |
| 06/15/2000 | WO2000034349A1 Process for producing modified phenolic resin |
| 06/15/2000 | WO2000034032A1 Underfill film compositions |
| 06/15/2000 | WO1999025768A8 Water compatible curing agents for epoxy resins |
| 06/15/2000 | CA2351333A1 Hydrophobic epoxide resin system |