Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
03/2001
03/27/2001US6207730 Epoxy and microsphere adhesive composition
03/27/2001US6207296 Inorganic filler, epoxy resin composition, and semiconductor device
03/22/2001WO2001019911A1 Crosslinkable compositions of functionalised polyolefin powders
03/22/2001CA2383478A1 Crosslinkable compositions of functionalised polyolefin powders
03/21/2001EP1085318A2 Membrane for chloride ion selective electrode
03/21/2001EP1085068A2 Connecting material
03/21/2001EP1084185A1 Conductive sheet molding compound
03/21/2001EP0928316B1 Two-phase polymer combination soluble in an aqueous alkali
03/21/2001EP0799257B1 Crosslinkable composition for coating substrates and coating method using the same
03/20/2001US6204456 Filling open through holes in a multilayer board
03/20/2001US6204305 Polymer blend of (i) a high surface energy polymer and (ii) a low surface energy organosilicon polymer; surface of the article is exposed to ozone and ultraviolet radiation to form a diffusion barrier.
03/15/2001WO2001018115A1 Epoxy resin composition and semiconductor device
03/15/2001WO2000079582A9 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent
03/14/2001EP1083198A2 Curable epoxy resin compositions with brominated triazine flame retardants
03/14/2001EP1082391A1 Thermosetting resinous binder compositions, their preparation and use as coating materials
03/13/2001US6201094 Phenol-novolacs with improved optical properties
03/13/2001US6201074 Phosphorous diepoxides for epoxy resins
03/13/2001US6201066 Extrusion lamination to substrates with group reactive with epoxy group and polyolefins
03/13/2001US6200408 Method for cementing a component to a surface
03/08/2001WO2001016207A1 High performance polyetherester containing laminating resin compositions
03/07/2001EP1081179A2 Photocurable resin compound and method of curing the same
03/07/2001CN1286701A Phenol-novolacs with improved optical properties
03/07/2001CN1062876C Method for preparing reduced monomer amission polyester resin
03/07/2001CN1062874C Allyl-contg. epoxy resin composition comprising copolymer of ethylenically unsaturated anhydride and vinyl compound
03/06/2001US6197898 Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent
03/06/2001US6197882 Curable resin composition and adhesive
03/06/2001US6197873 Aromatic polycarbonate, aromatic polyester, epoxidized conjugated diene-vinylaromatic block polymer that may be hydrogenated, reaction accelerator for epoxy groups
03/01/2001WO2001014485A1 Bonding of concrete parts
03/01/2001WO2001014470A1 Process for producing tyres, tyres thus obtained and elastomeric compositions used therein
03/01/2001DE19955839C1 Sealant, for use in building industry for sealing outside connecting openings carrying pipes and cables etc. through walls, comprises plastic foam, containing a water-swellable, preferably polymeric, filler
03/01/2001CA2369003A1 Bonding of concrete parts
02/2001
02/28/2001CN1285783A Sealant composition, article, including same, and method of using same
02/27/2001US6194496 Fireproofing mixtures with polyphenylene ether, vinylaromatic polymers with oligophosphorus compounds
02/27/2001US6194491 Biphenyl epoxy resin, naphthalene-containing phenolic resin and accelerator triphenylphosphine/p-benzoquinone
02/27/2001US6194490 Curable composition comprising epoxidized natural oils
02/27/2001US6194482 Casting resin of epoxy resin, isocyanurate siloxane, fillers, photo initiators and thermal initiators
02/22/2001WO2001012745A1 Photocurable resin composition for sealing material and method of sealing
02/22/2001WO2001012695A1 Phenolic resin, epoxy resin, and processes for producing these
02/22/2001WO2001012694A1 Adhesive composition
02/22/2001WO2001012689A1 Semi-interpenetrating networks comprising polyepoxides
02/22/2001DE19955379A1 Self-emulsified aqueous epoxy resin dispersion, e.g. for coating or adhesive uses, obtained by half-esterification of dicarboxylic anhydride with hydroxyl groups in the resin, followed by neutralization with tert. amine
02/21/2001EP0751982B1 Method of making liquid crystal composite
02/21/2001CN1284977A Cross-linded polyamide binders for ceramics manufacture
02/20/2001US6190773 Hydrophobic core material encapsulated therein excellent in gradual releasability such as pesticide
02/20/2001US6190759 Electronic package comprising dielectric layer and conductive layer, said dielectric layer including reinforcing material, resin material selected from epoxy, cyanate and bismaleimide resins, coloring agent, and fluorescing agent
02/20/2001CA2022811C Phosphorus compounds
02/15/2001WO2001010955A1 Epoxy resin composition and semiconductor device
02/15/2001WO2001010954A1 Polymerizable compositions
02/15/2001WO2001010927A1 Process for the production of polyester block copolymers, polyester block copolymer compositions and process for the preparation thereof
02/14/2001EP1076078A1 Polysiloxane compositions for wool treatment
02/14/2001EP1075498A1 Energy cured sealant composition
02/14/2001CN1283654A Siloxanes compsn. for treating fleece material
02/14/2001CN1061999C Method for preparing epoxy resin curing agent and products therefrom
02/13/2001US6187863 Polyethersiloxane copolymers
02/13/2001US6187698 Thermosetting resin bonded shaped elements
02/13/2001US6187442 Thermosetting resin compositions, electrical laminates obtained therefrom and process of producing these
02/13/2001US6187417 Substrate having high optical contrast and method of making same
02/13/2001US6187416 Resin composition for copper-clad laminate, resin-coated copper foil, multilayered copper-clad laminate, and multilayered printed circuit board
02/13/2001CA2203942C A pyrrolidylthiocarbapenem derivative
02/08/2001WO2001009231A1 Cured coatings having improved scratch resistance, coated substrates and methods related thereto
02/08/2001DE19937477A1 Silikonhaltige Zusammensetzungen für die Behandlung von Wollematerialien Silicone-containing compositions for the treatment of wool materials
02/08/2001DE19928580A1 Flachdichtung und Verfahren zum Herstellen einer Flachdichtung Flat gasket and method of making a flat gasket
02/07/2001EP1074888A1 Aqueous photosolder resist composition
02/07/2001EP1074571A2 Liquid potting composition
02/07/2001EP1073697A1 Epoxy/thermoplastic photocurable adhesive composition
02/07/2001CN1282710A composite material containing organic and/or inorganic material and sized glass fiber bundle
02/06/2001US6184312 Flame retardant resin compositions
02/06/2001US6184311 Corrosion resistance and outdoor-durability
02/01/2001WO2001007500A1 Flame retardants, flame-retarded resin compositions and processes for making the same
01/2001
01/31/2001EP1073319A2 Substrate material for wiring and substrate material for printed circuit using the same
01/31/2001EP1072658A1 Process for improving the adhesiveness of acrylate resins
01/31/2001EP1072647A2 Expandable reinforcing sheet material for vehicle outer panel
01/31/2001EP1072630A1 Water-absorbing composition and its use
01/31/2001EP1071729A1 High temperature resistant coating composition and method of using thereof
01/31/2001CN1282105A Liquid epoxy composite for packaging semiconductor and its application
01/31/2001CN1281869A Water absorption composition and its use
01/31/2001CN1061360C Resin composition for sealing film-made liquid crystal cells
01/30/2001US6180742 Carboxy copolymer, neutralizer and crosslinker
01/30/2001US6180726 High temperature resistant coating composition and method of using thereof
01/30/2001US6180725 Resin compositions for electric circuit boards
01/30/2001US6180719 Molding material of an epoxidized block copolymer of a vinyl aromatic hydrocarbon and conjugated diene, or hydrogenated products thereof, and specified thermoplastic elastomer(s); moldings such as turntable of a cd-rom driver
01/30/2001US6180696 A cured epoxy materials has high glass transition temperature as well as excellent electrical and mechanical properties; soldering interconnected structures for jointing semiconductor devices to substrates
01/30/2001US6180695 Flame-retardant resin composition and semiconductor sealant using the same
01/30/2001US6180693 A toughening agents for epoxy resins, with which having good compatibility; comprising a core elastomer and a shell of a crosslinked graft copolymer
01/30/2001US6180250 Epoxy resin obtained by glycidyl etherifying a condensation product of a phenol and hydroxybenzaldehyde; condensation product of bisphenol a and formaldehyde; and a urea derivative.
01/30/2001US6179196 Apparatus for manufacturing circuit boards
01/25/2001WO2001005862A1 Glycidyl ether group-containing partial alkoxysilane condensate, silane-modified resin, compositions of these, and processes for producing these
01/25/2001DE19933741A1 Verfahren zur Haftungsverbesserung von Acrylatharzen A method for improving adhesion of acrylic resins
01/24/2001EP1029000A4 Crystallization resistant amidoamine compositions
01/24/2001CN1281491A Curable resin compositions
01/24/2001CN1281476A Novolaks as water-unaffected accelerators for epoxy resin hardeners
01/24/2001CN1281008A Thermosetting resin composition used in ink stocking method
01/23/2001US6177541 Process for producing an isocyanurate derivative
01/23/2001US6177490 Liquid thermosetting filling composition and method for permanently filling holes in printed circuit board by the use thereof
01/23/2001US6177489 Blend of epoxy resin, curing agent, silica, and polysiloxane
01/23/2001US6177488 Blend of acrylic resin, melamine resin and acyclic epoxy containing compound
01/23/2001US6176965 Method for producing a bonded structure of aluminum alloy pressed plate
01/23/2001CA2268859C Polymer concrete structures
01/18/2001WO2001004213A1 Curable composition, cured article, and layered product
01/18/2001DE19933095A1 Coating powder for coating plastic, wood and MDF materials consists of heat-cured resin and hardener, thermoplastic resin powder, inorganic filler and additives and-or pigments