| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 07/19/2001 | WO2001051562A1 Epoxy resin composition and electronic part |
| 07/19/2001 | WO2001051542A1 S-b-s compositions |
| 07/19/2001 | US20010008924 Reacting urethane linked, cyclocarbonate-containing, hydroxyl-containing intermediate molecules with diamine molecules |
| 07/19/2001 | US20010008907 Enables formation of a high quality, coating film excellent in hardness and smoothness, liquid repellent, and adhesion |
| 07/19/2001 | US20010008168 Resins for the vacuum infusion of vehicle parts |
| 07/19/2001 | DE19952364A1 Lagerstabile Prepregs auf Basis duroplastischer, oleochemischer Matrices Storage-stable prepregs based thermoset, oleochemical matrices |
| 07/18/2001 | EP1116774A2 Flame-retardant resin composition, and prepregs and laminates using such composition |
| 07/18/2001 | EP1116742A1 S-B-S compositions |
| 07/18/2001 | EP1115793A1 Bitumen and filled resin emulsion for road surfacing emulsion |
| 07/18/2001 | EP1115768A1 Epoxy curing agent of phenol-aldehyde reacted with polyamine |
| 07/18/2001 | EP1115563A1 Phenol-novolacs with improved optical properties |
| 07/17/2001 | US6262162 Can be used as organoclays for sorption of organic materials, or can be dispersed uniformly into solvents to increase viscosity of organic liquids |
| 07/17/2001 | US6262147 As top coats to automobiles |
| 07/17/2001 | US6261685 Thermosetting adhesive and adhesive sheet thereof |
| 07/17/2001 | US6260949 Resoles, novolaks, polyphenylene ethers; photoreactive epoxy resin |
| 07/17/2001 | CA2022349C Peroxide masterbatches using polycaprolactone as the carrier |
| 07/12/2001 | US20010007881 Polymeric modifying agents |
| 07/11/2001 | EP1114845A1 Paste composition, and protective film and semiconductor device both obtained with the same |
| 07/11/2001 | EP1114108A1 Method of bonding a chrome steel to a fibre composite |
| 07/11/2001 | EP1114078A1 Thermoplastic copolyester compositions modified with epoxide compounds |
| 07/11/2001 | EP0932635B1 Crosslinkable polymers |
| 07/11/2001 | CN1068350C Epoxy resin mixture for prepregs and composites |
| 07/11/2001 | CN1068349C Epoxy resin mixture for prepregs and composities |
| 07/11/2001 | CN1068348C Epoxy resin mixtures for prepregs and composites |
| 07/10/2001 | CA2020049C Epoxy prepreg |
| 07/05/2001 | WO2001048073A1 Reactive particles, curable composition comprising the same and cured products |
| 07/05/2001 | WO2001047852A1 Onium salt compound, energy-ray-curable composition containing the same, and cured article thereof |
| 07/04/2001 | EP1112312A1 Polymer compound with improved gloss properties |
| 07/04/2001 | EP0932648A4 Epoxy curing agent |
| 07/03/2001 | US6255423 Pressure sensitive adhesive sheet and use thereof |
| 07/03/2001 | US6255409 Epoxy resin composition and resin-encapsulated semiconductor device |
| 07/03/2001 | US6255367 Crosslinkable thermosetting polyester resin matrix in which is dispersed a solid particle modifying agent comprising a crystalline polymer bearing ionically bound polymerization catalyst moieties |
| 07/03/2001 | US6255365 Rapid curability and fluidity, solder crack resistance |
| 07/03/2001 | US6255364 Crosslinkable waterborne dispersions of epoxidized polydiene block copolymers and amino resins |
| 07/03/2001 | US6254954 Pressure-sensitive adhesive tape |
| 06/28/2001 | WO2001046523A2 Hydroxy-phenoxyether polymers in papermaking |
| 06/28/2001 | WO2001046305A2 Recycling of articles comprising hydroxy-phenoxyether polymers |
| 06/28/2001 | WO2001046303A2 Hydroxy-phenoxyether polymer/fiber composites and foams |
| 06/28/2001 | WO2001046288A1 Resin composition curable with actinic energy ray |
| 06/28/2001 | WO2001045941A2 Laminates and coated materials comprising hydroxy-phenoxyether polymers |
| 06/27/2001 | EP1109870A1 Selective deposition modeling material |
| 06/27/2001 | EP1109862A1 Thermosetting compositions containing carboxylic acid functional polymers prepared by atom transfer radical polymerization |
| 06/27/2001 | EP0897408B1 Water-dispersible epoxy resins modified with vinyl acetate copolymers and their use in electrophoretic paint |
| 06/27/2001 | EP0787161B1 Low voc laminating formulations |
| 06/26/2001 | US6252012 Method for producing a diffusion barrier and polymeric article having a diffusion barrier |
| 06/26/2001 | US6252010 Siloxane-modified polyamideimide resin composition, adhesive film, adhesive sheet and semiconductor device |
| 06/26/2001 | US6251980 Nanocomposites formed by onium ion-intercalated clay and rigid anhydride-cured epoxy resins |
| 06/26/2001 | US6251308 Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds |
| 06/21/2001 | WO2001044369A1 Epoxy resin composition |
| 06/21/2001 | WO2001044344A1 Curable resin composition, process for producing the same, and coated object made with the same |
| 06/21/2001 | WO2001044342A1 Sealing agent for liquid-crystal display cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element |
| 06/21/2001 | US20010004651 Comprising an epoxy resin, a curing agent, and an inorganic filler in the form of porous silica having a specific surface area of 6 to 200 m2/g, a true specific gravity of 2.0 to 2.2, and a mean particle size of 2-50 micro m |
| 06/21/2001 | US20010004546 Heat conductive mold and manufacturing method thereof |
| 06/20/2001 | EP1109218A2 Heat conducting mold and manufacturing method thereof |
| 06/20/2001 | EP1108532A1 Resin-coated metal foil |
| 06/20/2001 | EP1108259A1 Electrically conductive layer material |
| 06/20/2001 | EP0858472B1 Photosensitive resin composition |
| 06/20/2001 | CN1300301A Reworkable thermosetting resin composition |
| 06/19/2001 | US6248854 Modified epoxysiloxane condensate, process for producing the same and its use as low-stress casting resins in the electronic and electrotechnical industry |
| 06/19/2001 | US6248810 Waterborne dispersions of epoxidized polydiene block copolymers and amino resins |
| 06/19/2001 | US6248204 Structural reinforcement component that includes a hydrophobic fumed silica in an amount of about 5 to about 20 weight percent, based on the epoxy resin component |
| 06/14/2001 | WO2001042360A1 Flame-retardant epoxy resin composition and laminate made with the same |
| 06/14/2001 | WO2001042359A1 Flame retardant phosphorus element-containing epoxy resin compositions |
| 06/14/2001 | WO2001042358A1 Storage stable, foamable, single latex/epoxy emulsion |
| 06/14/2001 | WO2001042345A1 Blister-resistant molded polyurea polymer and method of making a blister-resistant molded polyurea polymer |
| 06/14/2001 | WO2001042330A1 Epoxy resin composition and fiber-reinforced composite material formed with the epoxy resin composition |
| 06/14/2001 | US20010003767 Comprising polyolefins having given melt flow rate and/or olefin polymers having at least one functional group capable of reacting with an epoxy group; and an epoxy compound such as epoxidized soybean oil having at least 2 epoxy groups |
| 06/14/2001 | US20010003759 A photocurable resin consists of an acid modified vinyl group containing epoxy resin, an elastomer, a photopolymerization initiator, a diluent and a curing agent, can give high performance cured film |
| 06/14/2001 | CA2392589A1 Storage stable, foamable, single latex/epoxy emulsion |
| 06/13/2001 | EP1107323A2 High-temperature superconductor device |
| 06/13/2001 | EP1106665A2 Use of plastic foams containing swellable fillers for sealing wall ducts |
| 06/12/2001 | US6245828 Dental adhesive |
| 06/12/2001 | US6245827 Ultraviolet curable resin compositions having enhanced shadow cure properties |
| 06/12/2001 | US6245259 Wavelength-converting casting composition and light-emitting semiconductor component |
| 06/07/2001 | DE19957982A1 Hochtemperatursupraleiteranordnung High-temperature superconductor arrangement |
| 06/06/2001 | EP1104797A1 Adhesive composition |
| 06/06/2001 | EP1104792A1 Rosin-modified epoxy acrylates |
| 06/06/2001 | CN1298424A Polymer composite and a method for its preparation |
| 06/06/2001 | CN1298377A Preparation of polyindanebisphenols and polymers derived therefrom |
| 06/06/2001 | CN1297960A Epoxy resin composition and semi-solidified sheet and multilayer printed circuit board produced therewith |
| 06/06/2001 | CN1066770C Single-component solid thermosetting coating material |
| 06/06/2001 | CN1066764C Epoxy resin composition and resin molding article produced therewith |
| 06/06/2001 | CN1066746C Aromatic hydroxycarboxylic acid resins and their use |
| 06/05/2001 | US6242513 Method of applying a die attach adhesive |
| 06/05/2001 | US6242110 Epoxy resin composition and semiconductor device using the same |
| 06/05/2001 | US6242083 Shapes; epoxy resin and rubber blends |
| 06/05/2001 | US6241915 Epoxy, epoxy system, and method of forming a conductive adhesive connection |
| 06/02/2001 | CA2326058A1 High-temperature superconductor arrangement |
| 05/31/2001 | WO2001038446A1 Rosin-modified epoxy acrylates |
| 05/31/2001 | WO2001038442A1 Resin composition, molded article therefrom, and utilization thereof |
| 05/31/2001 | WO2001038436A1 Thermally stable polyester molding materials |
| 05/31/2001 | WO2001038432A1 Flameproofed thermoplastic polyester molding materials |
| 05/31/2001 | DE19956540A1 Flame-retarded polyester composition, used to manufacture fibers, films and moldings, contains polyethylene terephthalate, halogenated compound, antimony oxide, stabilizer and epoxy resin as additives |
| 05/31/2001 | DE19956539A1 A heat resistant thermoplastic molding material useful for production of fibers, films and profiled bodies, especially in electronics, domestic and medical equipment has long life, ductility, flowability, and melt stability |
| 05/30/2001 | EP1103575A1 Epoxy resin composition, prepreg and multilayer printed-wiring board |
| 05/30/2001 | EP1102804A1 Composite materials on the basis of renewable resources |
| 05/30/2001 | EP1102803A1 Hardener for epoxy resins |
| 05/30/2001 | CN1296994A Resin for moulding and method for making resin mould |
| 05/30/2001 | CN1066474C Heat resistant resin composition, heat resistant film adhesive and process for producing same |
| 05/29/2001 | US6239248 Phenol-novolacs with improved optical properties |