Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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04/19/2006 | CN1252177C Polymer and epoxy resin compsns |
04/19/2006 | CN1252124C Nano SiO2 polyester composite materials and industrial yarn preparation process |
04/19/2006 | CN1252096C Phenol-novolacs with improved optical properties |
04/18/2006 | US7031652 Wireless local loop antenna |
04/18/2006 | US7030198 Curable compositions comprising an epoxidised unsaturated polyester and mineral fillers |
04/18/2006 | US7030049 Barcol hardness, measured using a GYZJ-935 meter, of at least 10 within 30 minutes following initiation of polymerization |
04/18/2006 | US7030007 Via-filling material and process for fabricating semiconductor integrated circuit using the material |
04/13/2006 | US20060079643 Tyre for a vehicle and/or a vehicle wheel |
04/13/2006 | US20060079609 Heat curable resin composition having a low elastic modulus, heat curable film using same, and cured products |
04/13/2006 | DE10226789B4 Aminoharz-Dispersionen, deren Verwendung und Verfahren zu ihrer Herstellung sowie gehärteter Aminoplast Amino resin dispersions, their use and processes for their preparation and hardened amino |
04/12/2006 | EP1644348A1 Epoxy-capped polythioethers |
04/12/2006 | CN1757671A Modified epoxy with high fire resistance and UV separation |
04/12/2006 | CN1250665C Impact-resistant epoxy resin compositions |
04/12/2006 | CN1250663C Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using same |
04/12/2006 | CN1250652C 热塑性树脂组合物 The thermoplastic resin composition |
04/12/2006 | CN1250599C Epoxy resin compositions and semiconductor devices |
04/11/2006 | US7026411 Variable temperature curable composition |
04/11/2006 | US7026382 Bonding semiconductor chips |
04/06/2006 | WO2006035709A1 Epoxy resin composition and article |
04/06/2006 | WO2006035641A1 Modified epoxy resin composition |
04/06/2006 | WO2006034653A1 Carbon fiber composite for repairing and reinforcing pipelines having defects and the method of application |
04/06/2006 | US20060074199 Curable resin composition |
04/06/2006 | US20060074151 Low expansion dielectric compositions |
04/06/2006 | US20060074150 molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids; |
04/06/2006 | US20060074149 Process for manufacturing an alpha-dihydroxy derivative and epoxy resins prepared therefrom |
04/06/2006 | US20060073344 Thermally cleavable compound that releases sulfonic acid; thermosetting epoxy resin; curing agents and promoters including an anhydride, a maleamide, a vinyl ether, a cyanate, a phenolic, and/or an amine; thermally activatable fluxes with relatively low vapor pressures at elevated temperatures |
04/06/2006 | US20060073342 Hydraulic transfer film and process for producing hydraulic transfer product therewith |
04/05/2006 | EP1642917A1 Epoxy resin composition |
04/05/2006 | EP1120432B1 Process for the production of polyester block copolymers, polyester block copolymer compositions and process for the preparation thereof |
04/05/2006 | CN1756816A Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby |
04/05/2006 | CN1754913A Flame retardant compositions |
04/05/2006 | CN1754910A High temperature resistant, antistatic, high-tensioned composite material |
04/05/2006 | CN1249195C Color-changing material composition and color-changing membranes made by using the same |
04/05/2006 | CN1249177C Solid phase intercalation preparation method of nano montmorillonite and its prepared nano montmorillonite base material |
04/05/2006 | CN1249168C Semiconductor sealing resin composition, semiconductor device using same, and process for preparing semiconductor device |
04/05/2006 | CN1249161C Cast composite based on thermosetting epoxy resin |
04/05/2006 | CN1249145C 橡胶组合物 The rubber composition of |
04/05/2006 | CN1249138C Epoxide resin composition for SF6 gas insulation equipment and its forming article |
04/05/2006 | CN1249131C Method for preparing polymer/laminated silicate nano composite materials |
04/05/2006 | CN1249118C Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition |
04/05/2006 | CN1249049C Cyclic disulfide, producing process thereof and optical products containing the same |
04/04/2006 | US7023098 containing an epoxy resin, a phenolic resin, an inorganic filler and a curing accelerator as main components, and further containing a silane coupling agent in 0.01 wt; for encapsulating a semiconductor chip; improved flowability |
04/04/2006 | US7022779 Vinyl carboxylates, epoxy-containing silyl compounds, ketimines and oxazolidines, and an epoxy resin |
04/04/2006 | US7022777 Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
04/04/2006 | US7022410 Combinations of resin compositions and methods of use thereof |
04/04/2006 | US7022206 Comprises silane compound with isocyante groups for bonding elastomers to metals, ceramics, fiberglass, and polymers in dry and wet applications |
03/30/2006 | US20060069185 Flame retardant compositions |
03/30/2006 | DE102004040380A1 Molded parts, useful e.g. as support elements, comprises coating granular natural stones with polyurethane-/epoxy resin and connecting both at their contact points with basic element by polyurethane-/epoxy resin |
03/29/2006 | EP1640396A1 Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
03/29/2006 | EP1639045A2 Asphalt-epoxy resin compositions |
03/29/2006 | EP1639043A2 Curable flame retardant epoxy resin compositions |
03/29/2006 | EP1172424B1 Primer composition |
03/29/2006 | CN1753959A Compliant overprint varnishes |
03/29/2006 | CN1753947A Curable composition |
03/29/2006 | CN1247724C Adhesive and electric device |
03/29/2006 | CN1247701C Waste and old asphalt modifier |
03/29/2006 | CN1247698C Resin composition |
03/29/2006 | CN1247652C Epoxy resin containing double bonds and curing system |
03/29/2006 | CN1247651C Resin composition for optical-semiconductor encapsulation |
03/29/2006 | CN1247634C Solidified composition excellent in optical characteristics |
03/28/2006 | US7019041 Radiation-curable compositions containing alternating copolymers of isobutylene-type monomers |
03/28/2006 | US7018718 Adhesive film for underfill and semiconductor device using the same |
03/28/2006 | US7017490 water and a nonionic surfactant which is the reaction product of epichlorohydrin or a trichloroalkyl with an alkoxylated alcohol; good wetting properties, low foaming |
03/23/2006 | WO2006031434A1 Anhydride-functional silsesquioxane resins |
03/23/2006 | US20060063862 E.g., Resydrol" alkyd resin and a binder obtained by polymerizing one or more unsaturated monomers in the presence of a polyurethane resin to form a graft polymer; basecoat-clearcoat systems for automotive paints; prevents change in shade of paints on storage and/or shearing exposure |
03/23/2006 | DE102004045844A1 Preparation of fiber-strengthened product based on epoxy resin, useful e.g. to form flat plastic parts, comprises providing fiber material in unhardened resin mixture based on epoxide resin, maturing the mixture and hardening the mixture |
03/23/2006 | DE102004037472A1 Additive für Epoxid-Harze Additives for epoxy resins |
03/22/2006 | EP1636024A1 A metal-cured polyethylene-metal laminate |
03/22/2006 | EP1328602B1 Two component thermosettable compositions useful for producing structural reinforcing adhesives |
03/22/2006 | CN1749306A Hard asphalt used as high molecular material addition modified |
03/22/2006 | CN1246386C Flame-retardant polyethylene terephthalate resin composition |
03/22/2006 | CN1246384C Phosphorus-containing flame retardant epoxy resin and its composition |
03/22/2006 | CN1246382C Rubber-modified styrene resin composition |
03/21/2006 | US7014699 reacting polyepoxides with amines to form surfactants used as dispersants for oragnic or inorganic pigments |
03/16/2006 | WO2006028205A1 Conductive paste and flexible printed wiring board obtained by using the conductive paste |
03/16/2006 | WO2005123271A3 Method of producing an epoxy composition |
03/16/2006 | WO2005118276A3 Low heat release and low smoke reinforcing fiber/epoxy composites |
03/16/2006 | US20060058473 Epoxy resin composition for sealing optical semiconductor |
03/16/2006 | US20060058469 Flame retardant epoxy resin composition and cured object obtained therefrom |
03/16/2006 | US20060058428 Fluorinated compounds having epoxy and vinyl ether functional groups |
03/16/2006 | US20060057331 Self-adhesive prepreg |
03/16/2006 | DE102005029879A1 Härtbare Epoxyharzzusammensetzung Curable epoxy resin |
03/15/2006 | EP1634124A1 Photocurable resin composition |
03/15/2006 | EP0929592B1 Thermosetting resin compositions useful as underfill sealants |
03/15/2006 | CN1748045A Flat rolled magnetic steel sheet or strip having its surface coated for bonding |
03/15/2006 | CN1748001A Halogen free ignition resistant thermoplastic resin compositions |
03/15/2006 | CN1747996A Rubber composition, crosslinkable rubber compositions, and crosslinked articles |
03/15/2006 | CN1747985A Silicon compound containing epoxy group and thermosetting resin composition |
03/15/2006 | CN1746205A Organic titanium epoxy resin catalytic ester cyanate system |
03/15/2006 | CN1245431C Epoxy resin and resin sealed semiconductor device |
03/14/2006 | US7012120 Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent |
03/14/2006 | US7012112 Thermoplastic resin and a polyol; or a thermoplastic resin, a halogenated aromatic compound, and a double salt of antimony oxide (Sb2O5) and an alkali metal oxide or Sb2O5 and alkaline earth metal oxide |
03/14/2006 | US7011891 Liquid solution containing hydrogen peroxide; epoxidation |
03/14/2006 | CA2236806C Powderable reactive resin compositions |
03/09/2006 | WO2006026492A1 Powder coating compositions |
03/09/2006 | WO2005076376A3 Adhesive sheet for light-emitting diode device and light-emitting diode device |
03/09/2006 | WO2005069733A3 Reactive fine particles |
03/09/2006 | WO2004099283A8 Method for production of prepolymers made from polysulphides and polyepoxides |
03/09/2006 | US20060052232 Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same |
03/09/2006 | US20060051587 Thermosetting resin composition and adhesive film |