Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
04/2006
04/19/2006CN1252177C Polymer and epoxy resin compsns
04/19/2006CN1252124C Nano SiO2 polyester composite materials and industrial yarn preparation process
04/19/2006CN1252096C Phenol-novolacs with improved optical properties
04/18/2006US7031652 Wireless local loop antenna
04/18/2006US7030198 Curable compositions comprising an epoxidised unsaturated polyester and mineral fillers
04/18/2006US7030049 Barcol hardness, measured using a GYZJ-935 meter, of at least 10 within 30 minutes following initiation of polymerization
04/18/2006US7030007 Via-filling material and process for fabricating semiconductor integrated circuit using the material
04/13/2006US20060079643 Tyre for a vehicle and/or a vehicle wheel
04/13/2006US20060079609 Heat curable resin composition having a low elastic modulus, heat curable film using same, and cured products
04/13/2006DE10226789B4 Aminoharz-Dispersionen, deren Verwendung und Verfahren zu ihrer Herstellung sowie gehärteter Aminoplast Amino resin dispersions, their use and processes for their preparation and hardened amino
04/12/2006EP1644348A1 Epoxy-capped polythioethers
04/12/2006CN1757671A Modified epoxy with high fire resistance and UV separation
04/12/2006CN1250665C Impact-resistant epoxy resin compositions
04/12/2006CN1250663C Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using same
04/12/2006CN1250652C 热塑性树脂组合物 The thermoplastic resin composition
04/12/2006CN1250599C Epoxy resin compositions and semiconductor devices
04/11/2006US7026411 Variable temperature curable composition
04/11/2006US7026382 Bonding semiconductor chips
04/06/2006WO2006035709A1 Epoxy resin composition and article
04/06/2006WO2006035641A1 Modified epoxy resin composition
04/06/2006WO2006034653A1 Carbon fiber composite for repairing and reinforcing pipelines having defects and the method of application
04/06/2006US20060074199 Curable resin composition
04/06/2006US20060074151 Low expansion dielectric compositions
04/06/2006US20060074150 molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids;
04/06/2006US20060074149 Process for manufacturing an alpha-dihydroxy derivative and epoxy resins prepared therefrom
04/06/2006US20060073344 Thermally cleavable compound that releases sulfonic acid; thermosetting epoxy resin; curing agents and promoters including an anhydride, a maleamide, a vinyl ether, a cyanate, a phenolic, and/or an amine; thermally activatable fluxes with relatively low vapor pressures at elevated temperatures
04/06/2006US20060073342 Hydraulic transfer film and process for producing hydraulic transfer product therewith
04/05/2006EP1642917A1 Epoxy resin composition
04/05/2006EP1120432B1 Process for the production of polyester block copolymers, polyester block copolymer compositions and process for the preparation thereof
04/05/2006CN1756816A Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby
04/05/2006CN1754913A Flame retardant compositions
04/05/2006CN1754910A High temperature resistant, antistatic, high-tensioned composite material
04/05/2006CN1249195C Color-changing material composition and color-changing membranes made by using the same
04/05/2006CN1249177C Solid phase intercalation preparation method of nano montmorillonite and its prepared nano montmorillonite base material
04/05/2006CN1249168C Semiconductor sealing resin composition, semiconductor device using same, and process for preparing semiconductor device
04/05/2006CN1249161C Cast composite based on thermosetting epoxy resin
04/05/2006CN1249145C 橡胶组合物 The rubber composition of
04/05/2006CN1249138C Epoxide resin composition for SF6 gas insulation equipment and its forming article
04/05/2006CN1249131C Method for preparing polymer/laminated silicate nano composite materials
04/05/2006CN1249118C Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition
04/05/2006CN1249049C Cyclic disulfide, producing process thereof and optical products containing the same
04/04/2006US7023098 containing an epoxy resin, a phenolic resin, an inorganic filler and a curing accelerator as main components, and further containing a silane coupling agent in 0.01 wt; for encapsulating a semiconductor chip; improved flowability
04/04/2006US7022779 Vinyl carboxylates, epoxy-containing silyl compounds, ketimines and oxazolidines, and an epoxy resin
04/04/2006US7022777 Moldable poly(arylene ether) thermosetting compositions, methods, and articles
04/04/2006US7022410 Combinations of resin compositions and methods of use thereof
04/04/2006US7022206 Comprises silane compound with isocyante groups for bonding elastomers to metals, ceramics, fiberglass, and polymers in dry and wet applications
03/2006
03/30/2006US20060069185 Flame retardant compositions
03/30/2006DE102004040380A1 Molded parts, useful e.g. as support elements, comprises coating granular natural stones with polyurethane-/epoxy resin and connecting both at their contact points with basic element by polyurethane-/epoxy resin
03/29/2006EP1640396A1 Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device
03/29/2006EP1639045A2 Asphalt-epoxy resin compositions
03/29/2006EP1639043A2 Curable flame retardant epoxy resin compositions
03/29/2006EP1172424B1 Primer composition
03/29/2006CN1753959A Compliant overprint varnishes
03/29/2006CN1753947A Curable composition
03/29/2006CN1247724C Adhesive and electric device
03/29/2006CN1247701C Waste and old asphalt modifier
03/29/2006CN1247698C Resin composition
03/29/2006CN1247652C Epoxy resin containing double bonds and curing system
03/29/2006CN1247651C Resin composition for optical-semiconductor encapsulation
03/29/2006CN1247634C Solidified composition excellent in optical characteristics
03/28/2006US7019041 Radiation-curable compositions containing alternating copolymers of isobutylene-type monomers
03/28/2006US7018718 Adhesive film for underfill and semiconductor device using the same
03/28/2006US7017490 water and a nonionic surfactant which is the reaction product of epichlorohydrin or a trichloroalkyl with an alkoxylated alcohol; good wetting properties, low foaming
03/23/2006WO2006031434A1 Anhydride-functional silsesquioxane resins
03/23/2006US20060063862 E.g., Resydrol" alkyd resin and a binder obtained by polymerizing one or more unsaturated monomers in the presence of a polyurethane resin to form a graft polymer; basecoat-clearcoat systems for automotive paints; prevents change in shade of paints on storage and/or shearing exposure
03/23/2006DE102004045844A1 Preparation of fiber-strengthened product based on epoxy resin, useful e.g. to form flat plastic parts, comprises providing fiber material in unhardened resin mixture based on epoxide resin, maturing the mixture and hardening the mixture
03/23/2006DE102004037472A1 Additive für Epoxid-Harze Additives for epoxy resins
03/22/2006EP1636024A1 A metal-cured polyethylene-metal laminate
03/22/2006EP1328602B1 Two component thermosettable compositions useful for producing structural reinforcing adhesives
03/22/2006CN1749306A Hard asphalt used as high molecular material addition modified
03/22/2006CN1246386C Flame-retardant polyethylene terephthalate resin composition
03/22/2006CN1246384C Phosphorus-containing flame retardant epoxy resin and its composition
03/22/2006CN1246382C Rubber-modified styrene resin composition
03/21/2006US7014699 reacting polyepoxides with amines to form surfactants used as dispersants for oragnic or inorganic pigments
03/16/2006WO2006028205A1 Conductive paste and flexible printed wiring board obtained by using the conductive paste
03/16/2006WO2005123271A3 Method of producing an epoxy composition
03/16/2006WO2005118276A3 Low heat release and low smoke reinforcing fiber/epoxy composites
03/16/2006US20060058473 Epoxy resin composition for sealing optical semiconductor
03/16/2006US20060058469 Flame retardant epoxy resin composition and cured object obtained therefrom
03/16/2006US20060058428 Fluorinated compounds having epoxy and vinyl ether functional groups
03/16/2006US20060057331 Self-adhesive prepreg
03/16/2006DE102005029879A1 Härtbare Epoxyharzzusammensetzung Curable epoxy resin
03/15/2006EP1634124A1 Photocurable resin composition
03/15/2006EP0929592B1 Thermosetting resin compositions useful as underfill sealants
03/15/2006CN1748045A Flat rolled magnetic steel sheet or strip having its surface coated for bonding
03/15/2006CN1748001A Halogen free ignition resistant thermoplastic resin compositions
03/15/2006CN1747996A Rubber composition, crosslinkable rubber compositions, and crosslinked articles
03/15/2006CN1747985A Silicon compound containing epoxy group and thermosetting resin composition
03/15/2006CN1746205A Organic titanium epoxy resin catalytic ester cyanate system
03/15/2006CN1245431C Epoxy resin and resin sealed semiconductor device
03/14/2006US7012120 Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
03/14/2006US7012112 Thermoplastic resin and a polyol; or a thermoplastic resin, a halogenated aromatic compound, and a double salt of antimony oxide (Sb2O5) and an alkali metal oxide or Sb2O5 and alkaline earth metal oxide
03/14/2006US7011891 Liquid solution containing hydrogen peroxide; epoxidation
03/14/2006CA2236806C Powderable reactive resin compositions
03/09/2006WO2006026492A1 Powder coating compositions
03/09/2006WO2005076376A3 Adhesive sheet for light-emitting diode device and light-emitting diode device
03/09/2006WO2005069733A3 Reactive fine particles
03/09/2006WO2004099283A8 Method for production of prepolymers made from polysulphides and polyepoxides
03/09/2006US20060052232 Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same
03/09/2006US20060051587 Thermosetting resin composition and adhesive film