| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 05/18/2006 | WO2006051820A1 Thermosetting resin composition, thermosetting film, cured product of those, and electronic component |
| 05/18/2006 | WO2006051731A1 Epoxy resin composition |
| 05/18/2006 | WO2005059655A3 A process for the fabrication of optical microstructures |
| 05/18/2006 | WO2005047370A3 Bio-based epoxy, their nanocomposites and methods for making those |
| 05/18/2006 | US20060106166 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 05/18/2006 | US20060106144 Epoxy resin composition |
| 05/18/2006 | US20060106142 Preparation of acrylic polymer sol for coating |
| 05/18/2006 | US20060106135 Halogen free ignition resistant thermoplastic resin compositions |
| 05/18/2006 | US20060105176 Prepreg and laminate and printed wiring board using the same |
| 05/18/2006 | US20060102882 Flame retardant compositions with a phosphorated compound |
| 05/18/2006 | CA2582415A1 Amphiphilic block copolymer-toughened epoxy resins and ambient cure high-solids coatings made therefrom |
| 05/18/2006 | CA2582360A1 Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom |
| 05/18/2006 | CA2582357A1 Amphiphilic block copolymer-toughened epoxy vinyl ester and unsaturated polyester resins |
| 05/18/2006 | CA2582349A1 Amphiphilic block copolymer-toughened epoxy resins |
| 05/17/2006 | EP1657766A1 Reactive polymer-supported porous film for battery separator, method for producing the porous film and electrode/porous film assembly |
| 05/17/2006 | EP1657269A1 Conductive epoxy resin composition and method for producing the same |
| 05/17/2006 | EP1656423A1 Biodegradable polyester mixture |
| 05/17/2006 | EP1347954B1 Methyl propyl ketone peroxide formulations and their use for curing unsaturated polyesters |
| 05/17/2006 | CN1774451A Maleimide-terminated rubber and curable composition produced by using the maleimide terminated rubber |
| 05/17/2006 | CN1772809A Polymer material for seismic physical model and its prepn |
| 05/17/2006 | CN1256373C Preparation technology for composite of epoxy resin nano silicon dioxide |
| 05/16/2006 | US7045562 Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls |
| 05/11/2006 | WO2006049935A1 Self-bonding coating composition |
| 05/11/2006 | WO2006049156A1 Epoxy resin composition and semiconductor device |
| 05/11/2006 | US20060100397 Useful for casting out optoelectronic components; acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak |
| 05/11/2006 | US20060100373 Powder coating composition |
| 05/11/2006 | US20060100315 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 05/11/2006 | US20060099497 Reactive polymer-supported porous film for battery separator, method for producing the porous film, method for producing battery using the porous film, and electrode/porous film assembly |
| 05/11/2006 | US20060099425 Conductive epoxy resin composition and method for producing the same |
| 05/11/2006 | US20060099391 Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same |
| 05/11/2006 | DE102005046136A1 Dielektrische Zusammensetzungen mit geringer Expansion Dielectric compositions with low expansion |
| 05/11/2006 | CA2578530A1 Self-bonding coating composition |
| 05/10/2006 | CN1771460A Liquid crystal sealing agent and liquid crystalline display cell using the same |
| 05/10/2006 | CN1771293A Preformed compositions in shaped form |
| 05/10/2006 | CN1771290A Flame-retardant molding compositions |
| 05/10/2006 | CN1771271A Phenol-blocked polyurethane prepolymers. |
| 05/10/2006 | CN1769364A Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 05/10/2006 | CN1769346A Low expansion dielectric compositions |
| 05/10/2006 | CN1769344A Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same |
| 05/10/2006 | CN1255470C Thermoset materials with improved impact resistance |
| 05/09/2006 | US7041771 Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering |
| 05/09/2006 | US7041749 Dual cure reaction products of self-photoinitiating multifunction acrylates with cycloaliphatic epoxy compounds |
| 05/09/2006 | US7041736 decreasing the volatilization thereby reducing porosity in cured underfills; electronic components |
| 05/09/2006 | US7041399 Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| 05/09/2006 | US7041237 Rigid, hardness adhesive; reliable adhesive; connecting semiconductor chips; heat resistance, waterproofing |
| 05/09/2006 | US7041193 Positioning adhesive; curing; structural beams |
| 05/04/2006 | WO2006047319A1 Coating compositions containing a carbinol functional silicone resin or an anhydride functional silicone resin |
| 05/04/2006 | WO2006047318A1 Moldable compositions containing carbinol functional silicone reisins or anhydride functional silicone resins |
| 05/04/2006 | WO2006046534A1 Heat-resistant composite material |
| 05/04/2006 | WO2006046474A1 Curable composition |
| 05/04/2006 | WO2006046473A1 Curable composition |
| 05/04/2006 | WO2006046472A1 Curable composition |
| 05/04/2006 | WO2006046440A1 Epoxy resin composition for sealing semiconductor and semiconductor device using the same |
| 05/04/2006 | WO2006046411A1 Actinic-light-curable composition, actinic-light-curable inkjet ink, method of forming image with the actinic-light-curable inkjet ink, and inkjet recording apparatus |
| 05/04/2006 | WO2005123825A3 High thermal conductivity materials with grafted surface functional groups |
| 05/04/2006 | US20060094798 Method of emulsifying substituted cyclic dicarboxylic acid anhydride sizing agents and emulsion for papermaking |
| 05/04/2006 | US20060094797 Epoxy resin composition and semiconductor device |
| 05/04/2006 | US20060091019 Method of adhesion of conductive materials, laminate, and adhesive composition |
| 05/03/2006 | EP1651734A1 Coating compositions comprising epoxy resins and aminofunctional silicone resins |
| 05/03/2006 | EP1651731A1 Solventless, non-polluting radiation or thermally curable coatings |
| 05/03/2006 | EP1651432A1 A metal-polyamide/polyethylene-metal laminate |
| 05/03/2006 | EP1345984B1 Method for making biodegradable polyhydroxyalkanoate copolymers having improved crystallization properties |
| 05/03/2006 | EP1219693B1 Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same |
| 05/03/2006 | EP1153972B1 Rubber composition |
| 05/03/2006 | CN1768112A Epoxy resin molding material for sealing use and semiconductor device |
| 05/03/2006 | CN1768089A Thermosetting resin composition, multilayer body using same, and circuit board |
| 05/03/2006 | CN1768086A Coloring resin composition, color filter, and liquid-crystal display |
| 05/03/2006 | CN1254508C Method for improving antigen oxygen peeling of aircraft by adding nanometer particle material |
| 05/03/2006 | CN1254507C Adhesive composition and adhesive sheet for semiconductor device |
| 05/03/2006 | CN1254506C Phenol resin composition and phenol resin copper-clad laminate |
| 05/02/2006 | US7037958 Epoxy coating |
| 05/02/2006 | US7037586 Film for circuit board |
| 05/02/2006 | US7037584 Coatings having low volatile organic compound content |
| 04/29/2006 | CA2486314A1 Gasoline-impermeable coatings |
| 04/27/2006 | WO2006043019A1 Fibre reinforced assembly |
| 04/27/2006 | US20060089466 Epoxy resin composition |
| 04/27/2006 | US20060089465 Adhesive tape composition for electronic components |
| 04/27/2006 | US20060088715 Method for gluing fpcb's |
| 04/26/2006 | EP1650248A1 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 04/26/2006 | EP1567589B1 Hardener composition for epoxy resins |
| 04/26/2006 | CN1764692A Epoxy resin compositions containing mannich bases, suitable for high-temperature applications |
| 04/26/2006 | CN1764690A Halogen-free flame-retardant resin composition and prepreg and laminate using the same |
| 04/26/2006 | CN1763120A Oxyalkylated epoxide-amine adduct and its use |
| 04/25/2006 | US7034405 Blend of magnetic and silica powder in polymer; electromagnetic wave shield; enhancing dielectrics |
| 04/25/2006 | US7034404 Waterproofing; storage stability; blend of epoxy resin and phenolic resin, lacency curing agent and inorganic filler |
| 04/25/2006 | US7033670 LCT-epoxy polymers with HTC-oligomers and method for making the same |
| 04/20/2006 | WO2006040965A1 Gas barrier resin composition and gas barrier film |
| 04/20/2006 | WO2006040336A1 Polymeric compositions with modified siloxane networks, corresponding production and uses thereof |
| 04/20/2006 | US20060084727 comprising borosilicate glass particle fillers, hardeners, accelerators, and ternary epoxy mixture consisting of bisphenol-A epoxy resins, cyclo-aliphatic epoxy resins and triglycidyl isocyanurate resins, used for encapsulation of optoelectronic device or optical components |
| 04/20/2006 | US20060084726 Highly branched neutralized water-reducible polyester reaction product of a hydroxy cyclic carbonate; an aliphatic polycarboxylic anhydride; optionally a monofunctional epoxy resin; a polyisocyanate bridging agent; a compound having one free tertiary amine and one primary or secondary amine group; |
| 04/20/2006 | US20060084725 Highly branched neutralized water-reducible polyester reaction product of a hydroxy cyclic carbonate; an aliphatic polycarboxylic anhydride; optionally a monofunctional epoxy resin; a polyisocyanate bridging agent; a compound having one free tertiary amine and one primary or secondary amine group; |
| 04/20/2006 | US20060084723 Nanocomposites, method of production, and method of use |
| 04/20/2006 | US20060083928 Resin composition |
| 04/19/2006 | EP1647576A1 Composition comprising benzoxazine and epoxy resin |
| 04/19/2006 | EP1646698A1 Adhesive epoxy composition and process for applying it |
| 04/19/2006 | CN1761715A Mannich bases and method for the production of mannich bases |
| 04/19/2006 | CN1761714A Molding compositions containing quaternary organophosphonium salts |
| 04/19/2006 | CN1760264A Nano composite fire retardant parent material, preparation method and application |
| 04/19/2006 | CN1760263A Parts and component made from Nano plastic alloy for watering apparatus, and preparing method |
| 04/19/2006 | CN1252204C Method for adhering substrates using light activatable adhesive film |