Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
07/2006
07/04/2006US7071243 Heat resistance; waterproofing; adhesives; electrical properties
07/04/2006US7070861 Flame retardant epoxy resin containing phenolic novolak type epoxy resin, a bisphenol type epoxy resin free of halogen, an inorganic filler and an organic phosphorus containing flame retardant
07/04/2006US7070673 Method for repairing loose molded-in bushings
06/2006
06/29/2006WO2006068674A2 Waterborne epoxy coating composition and method
06/29/2006WO2006068493A1 Anticorrosive, surface-tolerant, water-dilutable epoxy mastic primer
06/29/2006WO2006067955A1 Method for producing acid anhydride based epoxy resin curing agent, acid anhydride based epoxy resin curing agent, epoxy resin composition, cured article therefrom and optical semiconductor device
06/29/2006US20060142507 Epoxy resin composition
06/29/2006US20060142438 Flame-retardant polybutylene terephthalate resin composition and formed article
06/29/2006US20060142427 allows for reduced amounts of phosphonate as compared to a composition not containing the filler; optional polybenzoxazine resin, and an optional co-curing agent
06/29/2006US20060141262 a heat treated mixture of epoxy resins, dicyandiamide, curing agents having imidazole rings, fillers and solvents, to enhance compatibility and form a uniform dispersion; electrical insulation and fireproofing
06/29/2006US20060141261 Coatings having low volatile organic compound content
06/29/2006CA2591169A1 Waterborne epoxy coating composition and method
06/28/2006EP1674518A1 Fire-retardant low-density epoxy composition
06/28/2006EP1673411A2 Adhesive compositions
06/28/2006EP1622976B1 Flame-retardant molding compositions
06/28/2006EP0983320B9 Curable sealant composition
06/28/2006CN1795238A 环氧树脂组合物 The epoxy resin composition
06/28/2006CN1793770A Corrosion-resistant agent and heat exchanger with it
06/28/2006CN1793224A Composite of non-halogen flame retarded type epoxy resin and semi-solidified sheet containing same composite and copper foil clad laminated board
06/28/2006CN1793207A Silicomethane coupling agent containing cyanide and secondary amino and its preparation process and application thereof
06/27/2006US7067930 containing core-shell polymers of alkyl (meth)acrylates; glass transition temperature of the core is up to -10 degrees C., of the shell is 80-150 degrees C., with a particle size of 0.1-1.0 mu m; adherent to surfaces of silicon chips, especially polyimide resins; useful as sealant for flip chips
06/27/2006US7067612 for sealing apertures
06/23/2006CA2529233A1 Multicomponent, in situ foaming system for the preparation of interpenetrating polymeric networks and its use
06/22/2006WO2006066021A2 Epoxy resin compositions, methods of preparing, and articles made therefrom
06/22/2006WO2006064736A1 Thermosetting epoxy resin composition and use thereof
06/22/2006US20060135723 Silicon compound containing epoxy group and thermosetting resin composition
06/22/2006US20060135710 Epoxy resin compositions, methods of preparing and articles made therefrom
06/22/2006US20060135706 Moldable poly(arylene ether) thermosetting compositions, methods, and articles
06/22/2006US20060135688 Powder coating compositions
06/22/2006US20060135657 Ion conductive block copolymers
06/22/2006US20060135656 Waterborne epoxy coating composition and method
06/22/2006US20060135633 Porous low-dielectric constant (k) thin film with controlled solvent diffusion
06/21/2006EP1672026A1 Resin composition for protective film
06/21/2006EP1672010A1 Two component stiffening material for outer skin applications
06/21/2006EP1672004A1 Binder resin for toner, method for producing same, and toner for electrophotography using such resin
06/21/2006EP1670860A1 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
06/21/2006EP1530617B1 Epoxy compositions having improved shelf life and articles containing the same
06/21/2006CN1791653A Foamable underfill encapsulant
06/21/2006CN1260292C Formulation for strippable adhesive and coating films and high-performance adhesives
06/20/2006US7064157 Flame retardant resin and flame retardant composition containing the same
06/20/2006CA2405643C Powder coating composition, method for the curing thereof, and articles derived therefrom
06/15/2006US20060125143 Thermoplastic composition, articles thereof, and method of making the articles
06/15/2006US20060125119 B-stageable underfill encapsulant and method for its application
06/14/2006EP1669387A1 Liquid-crystal polyester resin
06/14/2006EP1668078A1 Potting compound, use thereof and components encapsulated in said potting compound
06/14/2006EP1668057A1 Resin formulation, uses thereof, and moulded body produced therefrom
06/14/2006EP1177230B1 Polyolefin compositions, method for the production and use thereof
06/14/2006DE102004059434A1 Strahlungsdetektor Radiation detector
06/14/2006CN1788065A Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same
06/14/2006CN1788053A Flame-retarded epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards
06/14/2006CN1788044A Stabilized flame retardant additives and their use
06/14/2006CN1788032A Powdered epoxy composition
06/14/2006CN1786071A Nano-composite material containing organic sepiolite and its preparation method
06/13/2006US7060786 Heat resistant resin composition and adhesive film
06/13/2006US7060761 Epoxy resin compositions
06/08/2006WO2006059606A1 Biodegradable resin composition
06/08/2006WO2006059542A1 Epoxy resin composition and semiconductor devices
06/08/2006US20060121200 Electroless plating of piezoelectric ceramic
06/08/2006DE102005051611A1 Wärmehärtende Harzzusammensetzung, und Prepreg, metallbeschichtete, laminierte Platte und Platine mit gedruckter Schaltung unter Verwendung desselben A thermosetting resin composition and prepreg, metal-coated, of the same laminated board and printed circuit board using
06/07/2006EP1666515A1 Alicyclic epoxy resin, process for producing the same, composition thereof, cured epoxy resin, and use of alicyclic epoxy resin composition
06/07/2006EP1665376A1 SOLVENT-MODIFIED RESIN SYSTEM CONTAINING FILLER THAT HAS HIGH Tg, TRANSPARENCY AND GOOD RELIABILITY IN WAFER LEVEL UNDERFILL APPLICATIONS
06/07/2006EP1665375A1 Solvent-modified resin compositions and methods of use thereof
06/07/2006EP1664192A1 No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
06/07/2006EP1664160A1 Method for production of objects from thermosetting resins
06/07/2006EP1055714B1 Fire-resistant coating material
06/07/2006CN1784444A Polymeric epoxy resin composition
06/07/2006CN1783543A Porous film and its producing method, battery producing method and electrode/porous film assembly
06/07/2006CN1781987A Polyester block copolymer composition
06/07/2006CN1781986A Polyester block copolymers and process for the preparation thereof
06/07/2006CN1781985A Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof
06/07/2006CN1258573C Solidified composition forming as protective membrane, forming method of the membrane and the membrane
06/07/2006CN1258560C Hot curable epoxy composition in a separated container
06/06/2006US7056978 Toughened epoxy-anhydride no-flow underfill encapsulant
06/01/2006WO2006057498A1 Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
06/01/2006US20060116476 Hybrid thermosetting composition
06/01/2006US20060116445 Cationically curing two component materials containing a noble metal catalyst
06/01/2006US20060116444 Resin compositions for press-cured mica tapes for high voltage insulation
06/01/2006DE102005043928A1 Optische Halbleitervorrichtung und Verfahren zu deren Herstellung, Leiterrahmen und elektronische Einrichtung An optical semiconductor device and process for their preparation, leadframe and electronic device
05/2006
05/31/2006EP1661930A1 Photo-curable resin composition and sealing agent for flat panel display using the same
05/31/2006EP1660579A2 Low odor binders curable at room temperature
05/31/2006EP1485437B1 Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby
05/31/2006EP1342025B1 Form-in-place gasket for electronic applications
05/31/2006CN1257910C Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins made by using the derivatives, flame-retardant resin compositions, sealing media and it
05/30/2006US7053138 For thermoplastic, thermosetting resin; using phosphinic compound
05/30/2006US7053133 High room temperature storage stability and no catalytic action before activation by ultraviolet rays; thermal press bonding; epoxy resin, an ultraviolet activatable cationic polymerization catalyst, a polymerization inhibitor and water
05/25/2006US20060111477 difunctional polymer (polyepoxide); photoinitiator; nonphotoreactive solvent; and polymeric flexibilizer, e.g., polytetramethylene ether glycol, diethylene glycol initiated caprolactone, polybutadiene adipate glycol, or polyethylene adipate glycol; ink jet print heads
05/25/2006US20060110600 Anisotropic conductive adhesive composition
05/24/2006EP1659138A2 Polyolefin compositions, process for their preparation and use thereof
05/24/2006EP1545872A4 Method of producing laminates, and laminates
05/24/2006EP1448733B1 Thermally curable binding agents
05/24/2006DE102005046132A1 Flammhemmende Zusammensetzungen The flame-retardant compositions
05/24/2006CN1777970A Inorganic particle containing composition for plasma display panel, transfer film and process for producing plasma display panel
05/24/2006CN1257237C Radiaton curable powder coating compositions
05/23/2006US7049354 Oxazolidone ring-containing epoxy resin
05/18/2006WO2006052730A1 Amphiphilic block copolymer-toughened epoxy resins and powder coatings made therefrom
05/18/2006WO2006052729A1 Amphiphilic block copolymer-toughened epoxy resins
05/18/2006WO2006052728A1 Amphiphilic block copolymer-toughened epoxy vinyl ester and unsaturated polyester resins
05/18/2006WO2006052727A1 Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom
05/18/2006WO2006052726A1 Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom
05/18/2006WO2006052725A1 Amphiphilic block copolymer-toughened epoxy resins and ambient cure high-solids coatings made therefrom