| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 08/08/2006 | US7087664 Resin film and multilayer printed wiring board using thereof |
| 08/08/2006 | US7087663 Adducts of epoxy resins and phosphorus-derived acids and a process for their preparation |
| 08/08/2006 | US7087304 Polysulfide-based toughening agents, compositions containing same and methods for the use thereof |
| 08/08/2006 | US7087294 Multilayer containing adhesive layer |
| 08/08/2006 | CA2367350C Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds |
| 08/03/2006 | WO2006080786A1 Thermally curable resin composition with extended storage stability and good adhesive property |
| 08/03/2006 | WO2006080696A1 Polyoxymethylene resin composition having an excellent heat stability |
| 08/03/2006 | WO2006080297A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 08/03/2006 | US20060173141 Storage stability; polyepoxides and organic polymer containing silicon groups |
| 08/03/2006 | US20060173101 Highly elastic epoxy resin composition |
| 08/02/2006 | EP1685196A1 Oligomers and polymers containing hydrolysates and/or condensates of epoxide groups and silane groups, method for their production and use thereof |
| 08/02/2006 | EP1685193A2 Dual cure reaction products of self-photoinitiating multifunctional acrylates with cycloaliphatic epoxy compounds |
| 08/02/2006 | EP1627017B1 Electric conductor provided with an adherent layer and method for the production of said electric conductor |
| 08/02/2006 | CN1812881A A metal-polyamide/polyethylene-metal laminate |
| 08/02/2006 | CN1811995A Non-mold release agent composite insulator core rod |
| 08/02/2006 | CN1267484C Stabilizer system for display polymer assembly |
| 08/02/2006 | CN1267478C Heat-curable resin composition |
| 08/01/2006 | US7084214 Polyester resin composition for profile extrusion molding and molded article comprising the same |
| 08/01/2006 | US7084213 High temperature curable adhesives; star polymers |
| 08/01/2006 | US7084210 Vehicular reinforcement; polymethyl methacrylate viscosity enhancing agent; small voids and high Young's modulus |
| 08/01/2006 | US7084194 Heat resistance; flame retarders; adhesives; composites; laminated plates; printed circuits |
| 08/01/2006 | US7083855 Continuous filament mat binder system |
| 08/01/2006 | CA2211188C Curable resin composition, coating composition and method for forming coated film |
| 07/27/2006 | WO2006077887A1 Curable composition |
| 07/27/2006 | WO2006077886A1 Hardenable composition |
| 07/27/2006 | WO2006077081A1 Composition containing a hydrogenated bisglycidyl ether and a cross-linking agent |
| 07/27/2006 | WO2006076748A1 Thermosetting powder paint composition and polyester resin that can be used for the production thereof |
| 07/27/2006 | US20060167190 Primer with long cure time for polymeric substrates |
| 07/27/2006 | US20060167189 Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using the same |
| 07/27/2006 | US20060167188 Novel coating compositions for high temperature pipes |
| 07/27/2006 | US20060166003 Fabrication of carbon nanotube reinforced epoxy polymer composites using functionalized carbon nanotubes |
| 07/27/2006 | US20060166002 Decorative composite material and functional elements constructed therefrom |
| 07/27/2006 | US20060166001 Powder coating compositions |
| 07/27/2006 | DE102005003116A1 Zusammensetzung enthaltend einen hydrierten Bisglycidylether und ein Vernetzungsmittel A composition comprising a hydrogenated bisglycidyl ether and a crosslinking agent |
| 07/27/2006 | CA2594514A1 Thermosetting powder paint composition and polyester resin that can be used for the production thereof |
| 07/26/2006 | EP1683816A1 Polyacrylic hydrazide and crosslinking or curing agent for resin |
| 07/26/2006 | EP1682608A2 Two component curable compositions |
| 07/26/2006 | EP1546275A4 Method of adhesion of conductive materials, laminate, and adhesive composition |
| 07/26/2006 | CN1807539A Resin composition for encapsulating semiconductor |
| 07/26/2006 | CN1807503A Halogen-free phosphor-free combustion-proof epoxide resin composition |
| 07/26/2006 | CN1266196C Continuous filament mat binder system |
| 07/26/2006 | CN1266186C One-ingredient moisture-curing epoxy resin composition |
| 07/25/2006 | US7081490 Used for the production of mouldings; mouldings may, in particular, be produced by injection moulding |
| 07/20/2006 | WO2006075971A1 Thermoplastic polymer based nanocomposites |
| 07/20/2006 | WO2006075599A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 07/20/2006 | WO2006075482A1 Curable composition |
| 07/20/2006 | WO2006075415A1 Latent curing agent |
| 07/20/2006 | US20060160932 Heat activated sealants and foamed materials |
| 07/20/2006 | US20060159930 Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same |
| 07/20/2006 | US20060159929 Epoxy compound and cured epoxy resin product |
| 07/20/2006 | US20060159927 Paste composition and dielectric composition using the same |
| 07/20/2006 | US20060156955 Thermosetting resin composition |
| 07/19/2006 | EP1264851B1 Resin composition, molding material, and molded object |
| 07/19/2006 | CN1806326A Dicing/die boding sheet |
| 07/19/2006 | CN1803923A 树脂组合物 Resin composition |
| 07/19/2006 | CN1803916A Resin composite and prepreg and laminate materials used thereof |
| 07/19/2006 | CN1264943C Connecting materials |
| 07/19/2006 | CN1264924C Thermosetting polyimide resin composition and method for producing polyimide resin |
| 07/19/2006 | CN1264919C Flame-retarded resin composition and its forming product |
| 07/19/2006 | CN1264665C Fiber reinforced epoxy resin product and method for manufacture thereof |
| 07/18/2006 | US7078451 polyester or vinyl ester thermosetting resin; free radical generating catalyst; mold release agent; filler; zinc oxide; calcium hydroxide; combination of oxides results in freedom from tack at lowered viscosities |
| 07/18/2006 | US7078131 Polymeric sol electrolyte and lithium battery using the same |
| 07/18/2006 | US7078106 Thermosetting resin composition and use thereof |
| 07/18/2006 | US7077941 Cationic electrodeposition coating composition containing at least two emulsions to an electrodeposition coating, said cationic electrodeposition coating composition being such that a difference in an electrical quantity (a) required for |
| 07/18/2006 | CA2274818C Material containing polyreactions products and method for the production thereof |
| 07/13/2006 | US20060154091 Liquid-repellent, alkali-resistant coating composition and coating suitable for pattern forming |
| 07/13/2006 | US20060154080 Anhydride polymers for use as curing agents in epoxy resin-based underfill material |
| 07/13/2006 | US20060154079 Epoxy resin composition and semiconductor device |
| 07/13/2006 | US20060154078 Curable high-molecular weight epoxy resin based on multicylcic monomer, dicylopentadiene dioxide, a glycidyl acrylate and a curing agent; no phase separation in matrix when dyed with a heavy metal; high adhesion and conduction accuracy; strength, heat/moisture resistance, flexibility; semiconductors |
| 07/12/2006 | EP1679328A1 Photocuring resin composition containing organic polymer having epoxy group and/or oxethane group-containing silicon group at end, and method for producing same |
| 07/12/2006 | EP1678246A1 Unsaturated polyester resin or vinyl ester resin compositions having reduced gel-time drift tendency |
| 07/12/2006 | CN1802415A Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 07/12/2006 | CN1802406A Pasty heat-expandable filler composition and method of sound insulation by filling closed section of car body member |
| 07/12/2006 | CN1802398A Method for production of prepolymers made from polysulphides and polyepoxides |
| 07/12/2006 | CN1800260A Plymer base montmorillonite agglomerate and its preparation method |
| 07/11/2006 | US7074847 High refractive index; wear resistance; bonding strength; lenses; photopolymerization (meth)acrylate |
| 07/11/2006 | US7074738 The epoxy resin includes a compound having two or more epoxy groups in one molecule, a compound having two or more phenolic hydroxy groups, in a molecule, and a trisubstituted phosphoniophenolate or salt as a curing accelerator |
| 07/11/2006 | US7074481 Adhesive for joining surface of semiconductor |
| 07/11/2006 | CA2467924C Instant pothole repair |
| 07/11/2006 | CA2353757C Epoxy resin composition, prepreg and metal-clad laminate |
| 07/11/2006 | CA2236819C Reactive resin manufacture |
| 07/06/2006 | WO2006071820A1 Fire-retardant low-density epoxy composition |
| 07/06/2006 | WO2006070903A1 Bonded composite of silicone resin and epoxy resin and a method for manufacturing thereof |
| 07/06/2006 | US20060148948 Flame-retardant for engineering thermoplastic applications |
| 07/06/2006 | US20060147720 Aqueous phenoxy adhesives |
| 07/06/2006 | US20060147718 Optoelectronic molding compound that transmits visible light and blocks infrared light |
| 07/06/2006 | US20060145125 spherical silver-coated copper powder, fatty acid coating; epoxy resins; adhesives; reduced silver electroplating; migration resistance; electronics |
| 07/06/2006 | US20060144513 Method of adhering members and an assembly formed thereby |
| 07/06/2006 | CA2592305A1 Fire-retardant low-density epoxy composition |
| 07/05/2006 | EP1675806A1 Uv hardening glass printing ink and uv hardening glass printing lacquer and method for printing a glass substrate |
| 07/05/2006 | CN1798820A Activatable material for sealing,Baffling or reinforcing and method of forming same |
| 07/05/2006 | CN1798805A Process for producing modified epoxy resin |
| 07/05/2006 | CN1796455A Epoxidation silicon oil modified three kinds of composite material of epoxy resin |
| 07/05/2006 | CN1262601C High temperature resistant epoxy resin composite with lasting storage stability and temperature thixotropy |
| 07/05/2006 | CN1262600C Filling material composition for printing distributing board |
| 07/05/2006 | CN1262599C Thermosetting resin composition and semiconductor device obtained therefrom |
| 07/05/2006 | CN1262598C Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device |
| 07/05/2006 | CN1262582C Cured coatings having improved scratch resistance, coated substrates and methods related thereto |
| 07/04/2006 | US7071268 Electro-optic polymers with tunable refractive index for optical waveguides |
| 07/04/2006 | US7071263 Epoxy adhesives and bonded substrates |