| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 09/12/2006 | US7105594 Conductive carbon filled polyvinyl butyral adhesive |
| 09/10/2006 | CA2599578A1 Comb-like polyetheralkanolamines in inks and coatings |
| 09/08/2006 | WO2006093949A1 Two-component epoxy adhesive composition |
| 09/08/2006 | CA2599400A1 Two-component epoxy adhesive composition |
| 09/07/2006 | US20060199923 Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device |
| 09/07/2006 | DE10196240B4 Flammschutzmittel für Epoxyharze auf Basis von rotem Phosphor und Verfahren zur Herstellung derselben Flame retardants for epoxy resins based on red phosphorus, and methods for making same |
| 09/06/2006 | EP1698670A1 Thermosetting resin composition, material for substrate and film for substrate |
| 09/06/2006 | EP1698665A1 Method for making biodegradable polyhydroxyalkanoate copolymers having improved crystallization properties |
| 09/06/2006 | EP1698625A1 Epoxy compounds and cured epoxy resins obtained by curing the compounds |
| 09/06/2006 | EP1697985A1 Combinations of resin compositions and methods of use thereof |
| 09/06/2006 | EP1697771A2 A process for the fabrication of optical microstructures |
| 09/06/2006 | EP1697479A1 Method for producing acrylic fusible adhesives |
| 09/06/2006 | EP1697460A1 Method and system for making high performance epoxies, and high performance epoxies obtained therewith |
| 09/06/2006 | CN1827691A Buoyancy material with micro bubble and cell composite structure |
| 09/06/2006 | CN1827684A Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same |
| 09/06/2006 | CN1827683A Filtering layer resin materials and method for preparing same |
| 09/06/2006 | CN1273870C Composition for forming antireflection film for lithography |
| 09/06/2006 | CN1273537C Wavelength exchange pouring material, its application and preparation method |
| 09/06/2006 | CN1273536C Macromolecule composite for manhole cover |
| 09/06/2006 | CN1273535C High-temp. under mould-filling material with low heat generating in use |
| 09/05/2006 | US7101933 reacting polyphenylene ether (PPE) with an epoxy resin that has low bromine content in a non-polar solvent in the presence of a catalyst in a reactor; PPE needs not to be cleaved into small molecules and instead mixes and react directly reducing reaction time |
| 09/05/2006 | US7101596 Liquid crystal sealant, liquid crystal display device using the same and method for producing the device |
| 09/05/2006 | US7101590 Extrusion coating compositions and method |
| 09/05/2006 | CA2219657C Reactivity stabilization of polymethylene poly(phenylisocyanates) |
| 08/31/2006 | WO2006090911A1 Cellulose ester film, polarizing plate and liquid-crystal display device |
| 08/31/2006 | WO2006090794A1 Latent hardener for epoxy resin and epoxy resin composition |
| 08/31/2006 | US20060194933 Thermosetting epoxy resin composition and transparent material |
| 08/31/2006 | US20060194931 Use of diazepine derivatives as latent hardening components |
| 08/31/2006 | US20060194923 Curable composition |
| 08/31/2006 | US20060194064 Underfill encapsulant for wafer packaging and method for its application |
| 08/31/2006 | US20060194063 Alicyclic epoxy resins, their preparation process, their compositions, epoxy resin cured product, and uses of alicyclic epoxy resin compositions |
| 08/31/2006 | US20060194062 fibre composite impregnated with an epoxy resin matrix and comprising a benzylidenamine compound; an aliphatic or cycloaliphatic primary monoamine and/or disecondary diamine |
| 08/31/2006 | DE102005012457B3 New oligomer and polymer containing epoxy and silane groups (obtained by reacting epoxy group containing low-molecular oligomer or polymer compound with a silane group) useful for preparing anhydrous hardenable mixture |
| 08/30/2006 | EP1695990A1 Two-component epoxy adhesive composition |
| 08/30/2006 | EP1695989A1 Curable composition |
| 08/30/2006 | EP1694769A1 Dual-stage wafer applied underfills |
| 08/30/2006 | EP1694479A2 Polymer ceramic slip and method of manufacturing ceramic green bodies therefrom |
| 08/30/2006 | EP1490451B1 Activatable material |
| 08/30/2006 | CN1826376A Heat curable compositions comprising a benzoxazine component and an acrylonitrile-butadiene copolymer having secondary amine terminal groups as a toughener |
| 08/30/2006 | CN1826372A Method for production of objects from thermosetting resins |
| 08/30/2006 | CN1826365A Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 08/30/2006 | CN1824702A Nano-inorganic particle filled epoxy resin friction reducing abrasion resistant material and its preparation method |
| 08/29/2006 | US7098276 Flame-retardant epoxy resin composition and semiconductor device made using the same |
| 08/29/2006 | US7098258 epoxy resin and a curing agent of cyclohexanetricarboxylic acid and/or an anhydride; adhesives, shaped articles, protective films of color filters, sealants for photoelectric transducers, blue LED and white LED; excellent curability without accelerators; colorless, transparent, heat resistant |
| 08/24/2006 | WO2006088230A1 Thermosetting composition for solder resist and cured product thereof |
| 08/24/2006 | WO2006088127A1 Electromagnetic-wave-shielding adhesive film, process for producing the same, and method of shielding adherend from electromagnetic wave |
| 08/24/2006 | WO2006087979A1 Resin composition for sealing material, sealing material, sealing method and electroluminescent display |
| 08/24/2006 | WO2006087111A1 Low shrinkage amine-curing epoxy resin compositions comprising a lactone |
| 08/24/2006 | US20060189722 Use of aramid fiber conjunction with thermoplastic to improve wash-off resistance and physical properties such as impact and expansion |
| 08/24/2006 | US20060189721 retarding the curing of the epoxy resin by adjusting an amount of the retarder while curing in presence of a curing accelerator cation phosphorus compound; used for semiconductor encapsulation; providing latency; storage stability; resist to soldering without forming cracks by the soldering |
| 08/24/2006 | US20060189720 Rubber composition, crosslinkable rubber compositions, and crosslinked articles |
| 08/24/2006 | US20060188727 Thermally conductive resin sheet and power module using the same |
| 08/24/2006 | US20060188726 Heat curable, thermally expandable composition with high degree of expansion |
| 08/23/2006 | EP1693419A1 Composition and method for forming an article having improved properties |
| 08/23/2006 | EP1692081A2 Piezoelectric device and method of manufacturing same |
| 08/23/2006 | EP1578838B1 Thermally cuarble epoxy resin composition having an improved impact resistance at low temperatures |
| 08/23/2006 | EP1425358B1 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus. |
| 08/23/2006 | CN1823050A Epoxy-capped polythioethers |
| 08/23/2006 | CN1822949A A metal-cured polyethylene-metal laminate |
| 08/23/2006 | CN1821302A Resin composition and ceramic/polymer composite for embedded capacitors |
| 08/22/2006 | US7095125 Mixtures of polyepoxides, phenolic resin curing agent, zinc molybdate, polysiloxanes, polyethersiloxane copolymers and fillers, used as flameproofing casings for electronics |
| 08/22/2006 | US7094845 Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same |
| 08/22/2006 | US7094844 Waterproof, heat resistance, shockproof; undercoating for semiconductor, flip chips |
| 08/22/2006 | US7094843 Containing a hydroxyl-containing aromatic compound, such as a phenol-formaldehyde condensate |
| 08/22/2006 | US7094816 Water-based coating compositions containing epoxy resin(s) and (meth)acrylate(s), and methods of using the same |
| 08/22/2006 | US7094468 contains a compound having one epoxy group per molecule (Bisphenol A type epoxy resin), an anionic surfactant having an ammonium ion as the counter ion (sulfate ester ammonium salt), and a nonionic surfactant (isostearyl alcohol ethylene adduct); emulsification stability |
| 08/17/2006 | WO2006085839A1 Solventless, non-polluting radiation curable coatings |
| 08/17/2006 | US20060183872 Resin composition for embedded capacitors having excellent adhesive strength, heat resistance and flame retardancy |
| 08/17/2006 | US20060183859 Curable perfluoropolyether compositions and rubber or gel articles comprising the cured products of the compositions |
| 08/17/2006 | US20060183818 Coating for a smoothing and/or polishing element, particularly a grinding wheel, grinding wheel provided with said coating, process for obtaining said coating and process for realising said grinding wheel |
| 08/17/2006 | US20060182974 Multi-layer sandwich materials with epoxide-based organic interlayers |
| 08/17/2006 | US20060182973 Resin composition and ceramic/polymer composite for embedded capacitors having excellent TCC property |
| 08/16/2006 | EP1689816A1 Curable silicone composition and cured product thereof |
| 08/16/2006 | CN1817962A Friction-reducing and abrasive composite materials with reactive nanometer inorganic particles/epoxy and production thereof |
| 08/16/2006 | CN1269922C Water paint composition and coated articles |
| 08/16/2006 | CN1269921C Settability resin combination and use thereof |
| 08/15/2006 | US7091286 Low-cure powder coatings and methods for using the same |
| 08/15/2006 | US7090920 laminate comprising thermoplastic substrate, conductive metal foil at least partially disposed on substrate, adhesive disposed between substrate and the metal foil, poly(arylene ether) resin, thermosetting resin, poly(vinyl butyral-co-vinyl acetate) resin toughening agent; circuit board applications |
| 08/15/2006 | US7090895 Epoxy resin encapsulated semiconductor resin and foaming agent for halogen free polymer |
| 08/10/2006 | WO2006083677A1 Use of aramid fiber conjunction with thermoplastics to improve wash-off resistance and physical properties such as impact and expansion |
| 08/10/2006 | WO2006083025A1 Optical semiconductor, sealing material therefor and sealing composition |
| 08/10/2006 | WO2006082902A1 Resin composition for electronic and electric components for high-frequency applications and its molded product |
| 08/10/2006 | WO2006068674A3 Waterborne epoxy coating composition and method |
| 08/10/2006 | US20060178456 Surface improver for reinforced composite compositions |
| 08/10/2006 | US20060178455 comprising a binder comprising a polyepoxide and a polyamine; a micaceous pigment selected from the group consisting of mica and micaceous iron oxide and blends thereof; at least one other pigment |
| 08/10/2006 | US20060178454 Vinyl ether curing composition |
| 08/10/2006 | CA2593675A1 Use of aramid fiber conjunction with thermoplastics to improve wash-off resistance and physical properties such as impact and expansion |
| 08/09/2006 | EP1687375A1 Weather-resistant compositions based on polyalkylene terephthalate/polycarbonate blends with modified impact resistance and moulded-in colour |
| 08/09/2006 | EP1687374A1 Organic fibre based on an epoxy resin and a rheology-controlling agent and corresponding dry goods |
| 08/09/2006 | EP1620485B1 Powdered epoxy composition |
| 08/09/2006 | EP1279709B1 Method of bonding adherend |
| 08/09/2006 | EP1273609B1 Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them |
| 08/09/2006 | CN1816606A Adhesive epoxy composition and process for applying it |
| 08/09/2006 | CN1814680A Fluorescent colourant compositions, colouring process and coloured articles |
| 08/09/2006 | CN1814666A Injection organic material for repairing pipeline and preparing method therefor |
| 08/09/2006 | CN1814665A Composite fiber plate and preparing method |
| 08/09/2006 | CN1814657A Environment-protection type high-performance automobile braking piece and making method |
| 08/09/2006 | CN1269198C Resin packaged semiconductor device and die bonding material and packaging material thereof |
| 08/09/2006 | CN1268664C Resin composition, composition for solder resist, and cured article obtained therefrom |
| 08/08/2006 | US7087684 Chemical intermediate of unsaturated ester and aminopolyalkylene oxide; reacting with epoxide |