| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 10/11/2006 | CN1844236A Workable solid buoyancy material for deep sea and method for preparing same |
| 10/11/2006 | CN1844235A Nano vacuum restoration agent and its preparation and application |
| 10/11/2006 | CN1844234A Joint prepreg for fuel cell |
| 10/11/2006 | CN1844209A Process for preparing multifunctional carbon nanotube for epoxy resin nano composites |
| 10/11/2006 | CN1279134C Method for adhering substrates using ultraviolet activatable adhesive film and ultraviolet irradiation apparatus |
| 10/11/2006 | CN1279114C Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same |
| 10/11/2006 | CN1279105C High molecule electrolyte film by basic polyethenyl alcohol mixed with poly-epoxy chloro propane and application thereof |
| 10/10/2006 | US7118699 Method of making a composite with a barrier layer in a closed mold process |
| 10/10/2006 | US7118621 Organo-functional polysiloxanes |
| 10/05/2006 | WO2006103185A1 Composition comprising benzoxazine and epoxy resin |
| 10/05/2006 | WO2006014483A3 Epoxidized esters of vegetable oil fatty acids as reactive diluents |
| 10/05/2006 | US20060223978 Radiation- or thermally-curable oxetane barrier sealants |
| 10/05/2006 | US20060223913 An inorganic porous fine particle supporting a preferably triphosphazene-modified, phenol end-capped polyether, and an encapsulating epoxy or bismaleimide resin; bromine and antimony-free; nontoxic; improved hydrolysis resistance in high humidity |
| 10/05/2006 | US20060222860 Radiopaque polymers for circuit board assembly |
| 10/05/2006 | US20060219350 Method and apparatus for bonding and debonding adhesive interface surfaces |
| 10/04/2006 | EP1086160B1 Carboxy-functionalized polyphenylene ethers and blends containing them |
| 10/04/2006 | EP0979854B1 Circuit connecting material, and structure and method of connecting circuit terminal |
| 10/04/2006 | EP0855427B1 Aqueous dispersion composition |
| 10/04/2006 | CN1277965C Length-measuring staying device for weft |
| 10/04/2006 | CN1277881C Epoxy composition for light semiconductor packing |
| 10/04/2006 | CN1277858C Epoxy resin composition, fiber-reinforced composite material and manufacturing method thereof |
| 10/03/2006 | US7115681 Resin composition |
| 09/28/2006 | WO2006101008A1 Epoxy resin composition, cured product thereof, novel epoxy resin, process for production thereof, and novel phenol resin |
| 09/28/2006 | WO2006100124A1 Gel time drift-free resin compositions |
| 09/28/2006 | WO2006100123A1 Gel time drift-free resin compositions |
| 09/28/2006 | WO2006100122A1 Gel time drift-free resin compositions |
| 09/28/2006 | WO2006100121A1 Gel time drift-free resin compositions |
| 09/28/2006 | WO2006100120A1 Gel time drift-free resin compositions |
| 09/28/2006 | US20060217499 Semiconductor encapsulation by a liquid epoxy resin, a curing agent containing > 5 wt % of an aromatic amine, a microencapsulated catalyst containing a hydroxy-benzoic acid; noncracking; shelf life; rapid curing; flip chips |
| 09/28/2006 | US20060217495 Polyester resin composition for profile extrusion molding and molded article comprising the same |
| 09/28/2006 | US20060217494 Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same |
| 09/28/2006 | US20060216520 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 09/28/2006 | US20060216519 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 09/28/2006 | US20060216495 epoxy resin, a phenolic novolak, a curing accelerator, and a silica filler, characterized in that the silica filler has a shape having at least two planes and has an average particle diameter of 0.3 to 10 mu m and a specific surface area of 8 to 30 m2/g. |
| 09/27/2006 | EP1705218A1 Gel time drift-free resin compositions |
| 09/27/2006 | EP1705217A1 Gel time drift-free resin compositions |
| 09/27/2006 | EP1705216A1 Gel time drift-free resin compositions |
| 09/27/2006 | EP1705215A1 Gel time drift-free resin compositions |
| 09/27/2006 | EP1705214A1 Gel time drift-free resin compositions |
| 09/27/2006 | EP1705199A2 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 09/27/2006 | EP1704185A1 Reactive thermosetting system with long storage life |
| 09/27/2006 | EP1704181A1 Halogen-free flame-retardant resin composition and prepreg and laminate using the same |
| 09/27/2006 | EP1558653B1 Fiber dispersant-containing systems |
| 09/27/2006 | CN1837290A Thermosetting epoxy asphalt materials for pavement and bridge and process for preparing same |
| 09/27/2006 | CN1837284A Epoxy-organosilicon mixed resin composition and method for preparing same, and light-emitting semiconductor device |
| 09/27/2006 | CN1837283A Resin composition for color filter protective film and color filter |
| 09/26/2006 | US7112636 Epoxy resin composition |
| 09/26/2006 | US7112635 Acid catalyzed copolymerization of water, tetrahydrofuran and multifunctional epoxides and uses thereof |
| 09/26/2006 | US7112634 Thermosetting resin composition |
| 09/21/2006 | WO2006098676A1 Ultraviolet curing resin composition |
| 09/21/2006 | WO2006098514A1 Sealing resin composition |
| 09/21/2006 | WO2006098493A1 Curable silicone composition and electronic device produced therefrom |
| 09/21/2006 | WO2006098425A1 Epoxy resin composition and semiconductor device |
| 09/21/2006 | US20060211831 polyepoxide or epoxy resin reacted with an amine or phenol, a blocked polyisocyanate, rust inhibitor; automobiles, electric appliances and building materials |
| 09/21/2006 | US20060211429 Wireless local loop antenna |
| 09/21/2006 | US20060210805 for encapsulating semiconductors; acrylonitrile-butadiene copolymers; polysiloxanes |
| 09/21/2006 | US20060208219 Sealant of an epoxy resin from a bisphenol S-type polyvalent aromatic group with a glycidyl group, a thermo-curing agent, and a filler; excellent coatability, bondability to a substrate, long service life, pot life, high adhesive strength |
| 09/21/2006 | DE112004002063T5 Polytrimethylenterephthalatat-verstärkte Harzzusammensetzung Polytrimethylenterephthalatat-reinforced resin composition |
| 09/20/2006 | EP1702938A1 Curing silicone composition and cured product thereof |
| 09/20/2006 | EP1701793A1 A catalyst system for ethylene (co)-polymerization |
| 09/20/2006 | EP1701690A2 Epoxy adhesive composition method of preparing using |
| 09/20/2006 | EP1570000B1 Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| 09/20/2006 | EP1558678B1 Toughened epoxy / polyanhydride no- flow underfill encapsulant composition |
| 09/20/2006 | EP1499677B1 Hydrolysis resistant polyester compositions and related articles and methods |
| 09/20/2006 | EP1373407B1 Binding agent mixture and the use thereof |
| 09/20/2006 | CN1834188A Package or pre-applied foamable underfill for lead-free process |
| 09/20/2006 | CN1834167A Thermally conductive composition and method for preparing the same |
| 09/20/2006 | CN1276045C Method of adhesion of conductive materials, laminate, and adhesive composition |
| 09/20/2006 | CN1276024C Strengthening carbon fiber composite material and method for repairing defective pipeline |
| 09/20/2006 | CN1276023C 固化性环氧树脂组合物 Curable epoxy resin composition |
| 09/19/2006 | US7109289 Polymers with addition polymer monomer to form protective coatings for chemical resistance |
| 09/19/2006 | US7109286 Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins made by using the derivatives, flame-retardant resin compositions, sealing media and laminated sheets |
| 09/19/2006 | US7109265 Autodepositable adhesive |
| 09/19/2006 | US7109258 Polymeric material with antistatic properties and method for obtaining it |
| 09/19/2006 | US7108920 Reworkable compositions incorporating episulfide resins |
| 09/14/2006 | WO2006096033A1 Non-halogen flame retardant and highly heat resistant phosphorous-modified epoxy resin compositions |
| 09/14/2006 | WO2006095914A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 09/14/2006 | WO2006095590A1 Filler for resin, resin base material containing same and electronic component substrate material |
| 09/14/2006 | WO2006095516A1 Curable resin composition, prepreg and composite material using same |
| 09/14/2006 | WO2006094614A1 Process for making foam resins |
| 09/14/2006 | WO2005054148A3 Piezoelectric device and method of manufacturing same |
| 09/14/2006 | US20060205897 Two-component epoxy adhesive composition |
| 09/14/2006 | US20060205896 Epoxy resin composition for semiconductor sealing and semiconductor device |
| 09/14/2006 | US20060205891 Containing at least one polyimide resin, a phenolic resin component containing at least one phenolic resin, and an epoxy resin component containing at least one epoxy resin; phosphazene and cyanate ester; excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability |
| 09/14/2006 | US20060205882 Acetoacetylated polyvinyl polymers and curable coating compositions made therefrom |
| 09/14/2006 | US20060205861 Coating compositions comprising epoxy resins and aminofunctional silicone resins |
| 09/14/2006 | US20060204763 Sizing for high performance glass fibers and composite materials incorporating same |
| 09/14/2006 | US20060204762 Liquid epoxy resin composition and semiconductor device |
| 09/14/2006 | US20060204761 Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same |
| 09/14/2006 | US20060204760 Epoxy resin composition for photosemiconductor element encapsulation and photosemiconductor device using the same |
| 09/14/2006 | US20060204759 Low temperature curing coating powder |
| 09/13/2006 | EP1700880A1 Process for making foam resins |
| 09/13/2006 | EP1699885A1 A marine anti-bio-fouling coating and a method of applying the coating |
| 09/13/2006 | EP1587865B1 Flame-retardant for engineering thermoplastic applications |
| 09/13/2006 | EP1448654B1 Radiation curable resin composition for making colored three dimensional objects |
| 09/13/2006 | CN1833002A 生物降解聚酯混合物 Biodegradable polyester mixture |
| 09/13/2006 | CN1833001A Curable flame retardant epoxy resin compositions |
| 09/13/2006 | CN1274760C Curable epoxy resin compositions and process for production thereof |
| 09/13/2006 | CN1274744C Flame retardant molding compositions |
| 09/12/2006 | US7105614 Curable epoxy resin composition |