C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
11/2006
11/15/2006	CN1861682A Halogenless fire retarded epoxy resin composition
11/15/2006	CN1284776C Benzoxazine intermediate containing N-allyl and composition and preparation thereof
11/14/2006	US7135509 Suitable for machine component parts, electrical/electronic component parts, and automotive component parts, injection moldability, mechanical properties
11/09/2006	WO2006118335A1 Curable silicone composition and electronic components
11/09/2006	WO2006118323A1 Composition containing fluorine-containing aromatic polymer and laminated body containing fluorine-containing aromatic polymer
11/09/2006	WO2006118105A1 Thermosetting resin composition
11/09/2006	WO2006118091A1 Resin for filling into electronic substrate
11/09/2006	WO2006117339A1 Resorcinol-based mannich base
11/09/2006	WO2006093949A9 Two-component epoxy adhesive composition
11/09/2006	US20060252892 Hyperbranched polymer and cycloaliphatic epoxy resin thermosets
11/09/2006	US20060252891 Epoxy-acrylate/amine adhesive composition
11/09/2006	CA2605523A1 Resorcinol-based mannich base
11/08/2006	EP1719802A1 Method for curing an epoxy resin composition containing reactive phosphonate
11/08/2006	EP1718447A1 Heat-curable molding material pellet having multilayer structure
11/08/2006	EP1578851B1 Heat activated epoxy adhesive and use in a structural foam insert
11/08/2006	EP1272582B1 Rubber-metal composites
11/08/2006	CN1860164A Thermohardenable epoxy resin-based compositions, 3(4)-(aminomethyl)-cyclohexane-propanamine and 1,4(5)-cyclooctane dimethanamine
11/08/2006	CN1858112A Uvioresistant epoxy composition and its preparing method and use
11/08/2006	CN1858111A Process for preparing carbon nano tube/epoxy resin composite material
11/08/2006	CN1858110A process for preparing sea water resisting glass fiber reinforced epoxy resin nano composite material
11/08/2006	CN1858109A Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device
11/08/2006	CN1858108A Liquid hydrocarbon evaporation inhibitor
11/08/2006	CN1283685C Radiation curable resin composition for making colored three dimensional objects
11/08/2006	CN1283682C Indole resins, epoxy resins, and resin compositions containing the same
11/07/2006	US7132483 Water-based coating compositions containing epoxy resin(s) and (meth)acrylate(s), and methods of using the same
11/07/2006	US7132477 Powder coating compositions
11/07/2006	US7132476 Thermosetting compositions containing alternating copolymers of isobutylene type monomers
11/07/2006	US7132220 reaction product of an organohydrogenpolysiloxane, an alkenyl-organopolysiloxane and a diallyl bi- or bisphenol; curable by exposure to radiation having a wide range of wavelength; highly elastic, transparent, minute pattern
11/07/2006	US7132154 Blend of epoxy resin and glass fibers; heat and solvent resistance
11/02/2006	WO2006077153A3 Thermoset materials with improved impact resistance
11/02/2006	WO2006076310A3 Reinforcing sheet
11/02/2006	WO2006068674B1 Waterborne epoxy coating composition and method
11/02/2006	US20060247393 semiconductor encapsulating resin; polyepoxide of biphenyl-4,4'-diglycidyl ether and 3,3',5,5'-tetramethylbiphenyl-4,4'-diglycidyl ether, phenolic resin, low amount of filler, curing accelerator; inherently fire resistant without added flame retardant; forms foamed layer at ignition for fire retardancy
11/02/2006	US20060247392 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin
11/02/2006	US20060247391 Epoxy resin composition and semiconductor apparatus
11/02/2006	US20060247335 Epoxy resin, a curing agent, extender pigments and a non-chromate corrosion inhibiting additive that comprises oxides and/or hydroxides of molybdenum and/or cerium; corrosion resistance without the health risk of chromates
11/02/2006	US20060247333 Epoxy resin composition
11/02/2006	EP1717851A1 Circuit-connecting material and circuit terminal connected structure and connecting method
11/02/2006	EP1717253A1 Mannich base based on resorcinol
11/02/2006	EP1716201A2 Fire retardant compositions using siloxanes
11/01/2006	CN1856526A Binder resin for toner, method for producing same, and toner for electrophotography using such resin
11/01/2006	CN1854186A Semiconductor encapsulating epoxy resin composition and semiconductor device
11/01/2006	CN1854185A Semiconductor encapsulating epoxy resin composition and semiconductor device
11/01/2006	CN1854067A Magnesium hydrate particles and its manufacturing method and resin composite including same
11/01/2006	CN1854032A Oil-well shade
10/2006
10/31/2006	CA2340373C Thermosetting compositions containing carboxylic acid functional polymers prepared by atom transfer radical polymerization
10/26/2006	WO2006112943A1 Epoxy-functional polysiloxanes, silicone composition, and coated optical fiber
10/26/2006	WO2006066021A3 Epoxy resin compositions, methods of preparing, and articles made therefrom
10/26/2006	US20060241251 Coherent Insert
10/26/2006	US20060241250 Semiconductor encapsulating epoxy resin composition and semiconductor device
10/26/2006	US20060241215 Semiconductor encapsulating epoxy resin composition and semiconductor device
10/26/2006	US20060240239 Compositions adapted for chain linking
10/26/2006	US20060240198 Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device
10/25/2006	EP1715004A1 Die attach adhesives with improved stress performance
10/25/2006	EP1715003A1 Impact resistant epoxy resin compositions
10/25/2006	EP1715002A1 Curable composition
10/25/2006	EP1059323B1 Thermosetting composition containing polyhemiacetal ester resin and powdery thermosetting composition
10/25/2006	EP1034193B1 Phenol-novolacs with improved optical properties
10/25/2006	CN1851307A Pneumatic brake pipe, and its manufacturing method
10/25/2006	CN1850903A Method for improving interface performance carbonfiber/epoxy resin composite material
10/24/2006	US7125931 Thermosetting compositions containing alternating copolymers of isobutylene type monomers
10/24/2006	US7125917 Epoxy molding compounds with resistance to UV light and heat
10/24/2006	US7125609 Epoxy modified organopolysiloxane resin based compositions useful for protective coatings
10/24/2006	US7125606 Multilayer composite
10/24/2006	US7125461 Activatable material for sealing, baffling or reinforcing and method of forming same
10/19/2006	WO2006109890A1 Photosensitive resin composition, printed wiring board, and semiconductor package substrate
10/19/2006	WO2006109744A1 Epoxy resin composition
10/19/2006	US20060235151 High-temperature endurable phase-change polymer
10/18/2006	EP1711572A1 Thixotropic reactive composition
10/18/2006	EP1613707B1 Radiation-cured substances
10/18/2006	CN1849373A Nano-filled composite materials with exceptionally high glass transition temperature
10/18/2006	CN1849354A Composition, treated backing, and coated abrasive articles containing the same
10/18/2006	CN1847309A Organosilicon modified carbonyl epoxy composite material
10/18/2006	CN1847308A Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices
10/18/2006	CN1280375C Adhesive for laminated product, anchoring agent, laminated films, multiplayer packaging material and packaging bag
10/18/2006	CN1280372C Adhesive composition and glass plate with thermoplastic elastomer molding
10/18/2006	CN1280354C Synthesis process of dielectric material for high speed transmission
10/17/2006	US7122600 Powder coating compositions having improved mar and acid resistance
10/17/2006	US7122587 Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
10/12/2006	WO2006107660A1 Refractory solid, adhesive composition, and device, and associated method
10/12/2006	WO2006107659A1 Resin compositions and methods of use thereof
10/12/2006	WO2006106338A1 Polymeric material
10/12/2006	WO2006105623A1 Method for improving acoustic properties
10/12/2006	WO2006105620A1 Acoustic sealant composition
10/12/2006	US20060229419 Cost effective alternative to conventional aliphatic polyisocyanates, which retards photodegradation of electrodepositable coatings; curable, film-forming
10/12/2006	US20060229418 improved stability, performance
10/12/2006	US20060228562 Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating
10/12/2006	US20060228561 Epoxy resin composition for semiconductor encapsulating use, and semiconductor device
10/12/2006	CA2602335A1 Non-degradable low swelling, water soluble radiopaque hydrogels
10/11/2006	EP1710264A2 Prepolymers containing phosphor organic compounds and their use
10/11/2006	EP1709119A1 Gelator-stabilized crystalline resins
10/11/2006	EP1138739B1 Photocurable resin composition for sealing material and method of sealing
10/11/2006	CN1845966A Low odor binders curable at room temperature
10/11/2006	CN1845949A Process for producing rubbery polymer particle and process for producing resin composition containing the same
10/11/2006	CN1844290A Embedding damping pulp and method for preparing same
10/11/2006	CN1844244A Resin composition and its use in bonding sheet and copper clad plate
10/11/2006	CN1844242A Process for in-situ polymerization preparation of nylon 6/epoxy resin/silicon dioxide nano composite materials
10/11/2006	CN1844239A PET/clay nano composite materials and method for preparing same
10/11/2006	CN1844238A Solvent-free impregnating resin for vacuum pressure impregnation of high voltage motor
10/11/2006	CN1844237A Solvent-free impregnating resin and its preparation process and use

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