Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
12/2006
12/21/2006DE10242017B4 Härter für Epoxidharze, dessen Verwendung und damit gehärtetes Epoxidharz Hardener for epoxy resins, its use and thus cured epoxy resin
12/20/2006EP1734068A1 Polymer composite formed article, printed wiring board using the formed article and method for producing them
12/20/2006EP1446452B1 Modified epoxy resins
12/20/2006CN1882656A weather-resistant compositions based on polyalkylene terephthalate/polycarbonate blends with modified impact resistance and moulded-in colour
12/20/2006CN1882615A Polyacrylic hydrazide and crosslinking or curing agent for resin
12/19/2006US7150913 epoxy compound with a surface energy at 125 degrees C. of 17 to 34 mJ/m2; and another epoxy compound with a surface energy at 125 degrees C. of at least 35 mJ/m2.; may also contain anionic surfactant with an aryloxy group, with an ammonium ion as a counter ion
12/19/2006CA2232800C Duroplast-bonded fibrous molds and process for producing same
12/14/2006WO2006132900A1 Flame retardant composition exhibiting superior thermal stability and flame retarding properties and use thereof
12/14/2006WO2006132165A1 Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device
12/14/2006WO2006132133A1 Latent curing agent
12/14/2006WO2006132093A1 Hardenable resin composition
12/14/2006WO2006131295A1 Unsaturated polyester resin or vinyl ester resin composition
12/14/2006US20060281872 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same
12/14/2006US20060281833 Mix of grafted and non-grafted particles in a resin
12/14/2006US20060280949 Method for making amine-modified epoxy resin and cationic electrodeposition coating composition
12/14/2006CA2610883A1 Flame retardant composition exhibiting superior thermal stability and flame retarding properties and use thereof
12/13/2006EP1731554A1 Prepreg, metal-clad laminate and printed circuit board using same
12/13/2006EP1731553A1 Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, sheet of fiber-reinforced composite material and cabinet for electrical/electronic equipment
12/13/2006EP1731544A1 Hardenable composition
12/13/2006EP1730210A2 Polycarboxy-functionalized prepolymers
12/13/2006EP1685193A4 Dual cure reaction products of self-photoinitiating multifunctional acrylates with cycloaliphatic epoxy compounds
12/13/2006CN1876710A Epoxy resin composition for sealing and packing optical semiconductor element and optical semiconductor element using the said composition
12/13/2006CN1876355A Resin base composite material parts quick forming method
12/13/2006CN1290383C Sheet-like matter for heat-transfer base plate and its mfg. method, and heat-transfer base plate and mfg. method using it
12/13/2006CN1289600C Thermosetting epoxy resin composition and its formed body and multilayered printed circuit board
12/13/2006CN1289594C Heat setting resin compsns. and its use
12/12/2006US7148295 Carboxy-functional crosslinkers for epoxy-functional powder-lacquer binding agents
12/12/2006US7148294 Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials
12/12/2006US7147920 Backing, adhesive layer, and protective member, where the adhesive layer comprises a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent; improved adhesion, heat resistance, low modulus of elasticity
12/12/2006US7147897 Use of silicon provides corrosion protection without significantly interfering with weldability
12/12/2006US7147889 Imbibition adjuvants; polyol and, or epoxides; applying to surfaces, transferrign
12/07/2006WO2006129480A1 Hardenable epoxy resin composition
12/07/2006WO2006129014A2 Use of a particular composition for producing parts by filament winding
12/07/2006WO2006128722A1 Toughened epoxy adhesive composition
12/07/2006US20060276601 Toughened epoxy adhesive composition
12/07/2006US20060276568 Thermosetting resin compounds
12/07/2006US20060275608 B-stageable film, electronic device, and associated process
12/07/2006DE102005047807A1 Modifizierte Nanopartikel Modified nanoparticles
12/07/2006DE102005024334A1 Cold-Box Bindemittelsystem unter Verwendung von gesättigten Fettsäureestern Cold-box binder system using saturated fatty acid esters
12/07/2006CA2609774A1 Toughened epoxy adhesive composition
12/06/2006EP1728826A1 Composition curable by both free-radical photocuring and cationic photocuring
12/06/2006EP1728825A1 Toughener for a structural epoxy adhesive
12/06/2006CN1875478A Solvent-modified resin compositions and methods of use thereof
12/06/2006CN1875477A Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications
12/06/2006CN1875071A Curable silicone composition and its cured product
12/06/2006CN1875069A Polytrimethylene terephthalate reinforced resin composition
12/06/2006CN1875068A No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
12/06/2006CN1875067A Epoxy resin molding material for sealing and electronic component
12/06/2006CN1875056A Two component curable compositions
12/06/2006CN1288207C Photo-induced cation curable epoxy resin composition
12/06/2006CN1288206C Epoxy resin/montmorillonoid nano-compoiste-material and its preparation method
12/06/2006CN1288205C Blend film and its preparation method and use
12/06/2006CN1288184C Polyether polyamine agents and mixtures therefor
12/05/2006US7144763 light emitting diode; curable silicone with pendant epoxy groups, a hydroxyl-containing compound or silicone, anhydride curing agent, ancillary curing catalyst; radiation transparent, UV stability, clear; packaging
12/05/2006US7144630 Durable composite; adhesion of elastomer to metal
12/05/2006US7144604 Method for cross-linking polyacrylates
12/05/2006US7143895 Methods of bonding metal surfaces, and components therefor
12/05/2006CA2147051C Stabilized polyvinyl chloride
11/2006
11/30/2006WO2006127995A1 Sealer compositions
11/30/2006WO2006127228A1 Method of forming nanocomposite materials
11/30/2006WO2006125669A1 Cold-box binder system using saturated fatty acid esters
11/30/2006US20060270828 Curable resin composition and products of curing thereof
11/30/2006US20060270810 Curable resin composition
11/30/2006US20060270808 Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device
11/30/2006US20060269701 Metal-polyamide/polyethylene-metal laminate
11/29/2006CN1871300A Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
11/29/2006CN1871299A Adhesive compositions
11/29/2006CN1871276A 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device
11/29/2006CN1869122A Solventless immersion resin used for high voltage electric machine vacuum pressure immersion
11/29/2006CN1869121A Water molecule coagulating agent
11/29/2006CN1286930C Curable resin compositions
11/29/2006CN1286916C Elastomer-modified epoxy siloxane compositions
11/29/2006CN1286909C Process for preparing four-leg zinc-oxide crystal whisker reinforced epoxy composite materials
11/29/2006CN1286908C Photocureable composition photocureable pressure sensitive adhesive sheet and adhering method thereof
11/29/2006CN1286907C Polymer sol-electrolyte and lithium cell therewith
11/29/2006CN1286906C 环氧树脂组合物和半导体装置 Epoxy resin composition and a semiconductor device
11/28/2006US7141627 comprises aromatic polyester; high glass transition temperature and low dissipation factor; improved solvent solubility; dielectrics; electronics
11/28/2006US7141619 Corrosion and alkali-resistant compositions and methods for using the same
11/23/2006WO2006122754A1 Use of epoxy derivatives as additives for cementitious building materials
11/23/2006US20060264573 Ambient curable protective sealant
11/23/2006US20060264538 Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
11/22/2006EP1724306A1 Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material
11/22/2006EP1724299A1 Modifier for resin and resin composition using the same and formed article
11/22/2006EP1651731B1 Solventless, non-polluting radiation or thermally curable coatings
11/22/2006EP1497369B1 Surface improver for reinforced composite compositions
11/22/2006EP1362877B1 One-pack moisture-curing epoxy resin composition
11/22/2006CN1867631A Electric conductor provided with an adherent layer and method for the production of said electric conductor
11/22/2006CN1867629A Resin composition for protective film
11/22/2006CN1865347A Method for improving heat property and crystallization behavior of polylactic acid and its multiple blocked copolymer
11/22/2006CN1865345A Reinforced rubber sheet basal body composite resin for car
11/22/2006CN1865344A 粘着性树脂组合物及其用途 Adhesive resin composition and uses thereof
11/22/2006CN1865329A Flame-proof agent and flame-proof resin composition comprising same, and its uses
11/22/2006CN1285685C Radiation-cured powder composition, its powdery varnish and color paint and coating method and the product
11/22/2006CN1285657C Polymer flame retardant of containing two different aryl phosphates mixture, method for preparing same and use thereof
11/21/2006US7138467 crystalline epoxy resin, an epoxy-functional and phenyl group containing polysiloxane copolymer, and liquid silicone resin; low melt viscosity, excellent reactivity and dispersibility in organic resins; flame retardant properties; no environmentally harmful antimony oxides or halogenated epoxy resins
11/21/2006US7138444 Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions
11/16/2006WO2006119770A1 Method for the establishment of a crack resistant epoxy paint coat and paint compositions suitable for said method
11/16/2006US20060258824 Flame-retardant epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards
11/16/2006US20060258822 Curing accelerator, epoxy resin composition, and semiconductor device
11/16/2006US20060255321 Radiation shielding composition and a preparation method thereof