| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 05/16/2007 | CN1965017A Composition for sealing optical semiconductor, optical semiconductor sealing material, and method for producing composition for sealing optical semiconductor |
| 05/16/2007 | CN1965012A Curing agent for epoxy resins and epoxy resin compositions |
| 05/16/2007 | CN1964797A Method for coating electrically conductive substrates |
| 05/16/2007 | CN1962798A Epoxy resin adhesive composition and optical semiconductor adhesive adopting same |
| 05/16/2007 | CN1962713A Fluorine-containing phenol resin derivative and its composition and preparation method |
| 05/16/2007 | CN1962712A Single component solid oxirene resin |
| 05/16/2007 | CN1315960C Solution type coatings |
| 05/16/2007 | CN1315905C Epoxy resin composition and semiconductor device |
| 05/15/2007 | US7217771 Epoxy resin |
| 05/15/2007 | CA2325716C Liquid, radiation-curable composition, especially for stereolithography |
| 05/10/2007 | WO2007052846A1 Epoxy resin composition, conductive film forming method, conductive pattern forming method, and multilayered wiring board manufacturing method |
| 05/10/2007 | WO2007052523A1 Rubber-modified polyamide resin, epoxy resin composition, and cured object obtained therefrom |
| 05/10/2007 | US20070105983 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 05/10/2007 | US20070104937 Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials |
| 05/09/2007 | EP1783154A1 Cationically polymerizable composition, active energy ray-curable inkjet ink, and method for producing cationically polymerizable composition |
| 05/09/2007 | EP1783153A2 Fluorine-containing epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus making use of the same |
| 05/09/2007 | EP1598398B1 Curable composition |
| 05/09/2007 | EP1278912B1 Hydroxy-phenoxyether polymers in papermaking |
| 05/09/2007 | CN1961261A Radiation-sensitive composition, laminate, process for producing the sane and electronic part |
| 05/09/2007 | CN1961026A Active energy ray-curable organopolysiloxane resin composition, optical transmission component, and manufacturing method thereof |
| 05/09/2007 | CN1960997A Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 05/09/2007 | CN1958639A Solidifying agent for aqueous epoxy resin, and preparation method |
| 05/09/2007 | CN1958638A Technique for synthesizing resin of epoxy vinyl ester with low exothermal peak |
| 05/09/2007 | CN1315184C Epoxy composition for semiconductor package, preparation method and semiconductor device using same |
| 05/09/2007 | CN1314752C 环氧树脂组合物 The epoxy resin composition |
| 05/09/2007 | CN1314726C Resin compound for forming interlayer insualting layer of printed wiring board, resin for forming insulating layer using resin compound, copper foil coated with resin and copper-coating layer-pressing |
| 05/09/2007 | CN1314725C Novel light-wave absorbing carbon fiber composite material preparation method |
| 05/08/2007 | USRE39615 Blend of a phenolic resole and the product made by reacting a difunctional epoxide and a di- or trifunctional benzene compound, e.g., resorcinol or m-aminophenol; provides both good adhesion as measured by peel strength testing and good heat resistance as measured by solder blister testing. |
| 05/08/2007 | US7214366 Linking a sulfur compound directly to a terminal carbon of polyethyleneglycol, polyalkylene oxides or a polyvinyl alcohol; converting the sulfur to an active ethyl sulfone group having a reactive site located at the second carbon from the sulfone group; modifying biologically active molecules |
| 05/08/2007 | CA2203267C Visible-light curable epoxy system with enhanced depth of cure |
| 05/08/2007 | CA2153009C Constant velocity joint boot and method of making the same |
| 05/03/2007 | WO2007050611A1 Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability |
| 05/03/2007 | WO2007049665A1 Alkali development-type photosensitive resin composition, substrate with projections for liquid crystal division alignment control formed using the same, and liquid crystal display device |
| 05/03/2007 | WO2007049385A1 Thermosetting composition for organic el device sealing |
| 05/03/2007 | US20070100114 Accelerator systems for low-temperature curing |
| 05/03/2007 | US20070100071 Organic fibre based on an epoxy resin and a rheology-controlling agent and corresponding dry goods |
| 05/03/2007 | US20070096355 Photocurable resin composition |
| 05/03/2007 | US20070096056 One component resin composition curable with combination of light and heat and use of the same |
| 05/03/2007 | DE112004002666T5 Gelatorstabilisierte kristalline Harze Gelatorstabilisierte crystalline resins |
| 05/02/2007 | EP1780587A1 Liquid crystal sealant and liquid crystal display cell utilizing the same |
| 05/02/2007 | EP1778758A2 Radiation curable, sprayable coating compositions |
| 05/02/2007 | EP1678246B1 Unsaturated polyester resin or vinyl ester resin compositions having reduced gel-time drift tendency |
| 05/02/2007 | EP1539825A4 Transformable pressure sensitive adhesive tape and use thereof in display screens |
| 05/02/2007 | CN1957013A Resin composition for encapsulating semiconductor and semiconductor device |
| 05/02/2007 | CN1957012A Hardener for epoxy resin and epoxy resin composition |
| 05/02/2007 | CN1957011A Radiation curable liquid resin composition for optical three-dimensional molding and optical molded article obtained by photocuring same |
| 05/02/2007 | CN1957007A Thermosetting powder coating and process for producing the same |
| 05/02/2007 | CN1955208A Method for producing epoxy using bisphenol A and epoxychloropropane |
| 05/02/2007 | CN1313883C Printed circuit board |
| 05/02/2007 | CN1313510C Additive and ink-jet recording medium containing the same |
| 05/02/2007 | CN1313242C Thermal-setting welding paste |
| 05/01/2007 | US7211303 Alignment film and LCD made of the same |
| 05/01/2007 | CA2381498C Leach-protective coatings for water meter components |
| 05/01/2007 | CA2346105C Curable coating compositions containing blends of carbamate-functional compounds |
| 04/26/2007 | WO2007047428A1 Coating compositions and methods |
| 04/26/2007 | WO2007046405A1 Thermosetting resin composition and use thereof |
| 04/26/2007 | WO2007046399A1 Thermosetting resin composition and photosemiconductor encapsulation material |
| 04/26/2007 | WO2007046316A1 Epoxy resin, curable resin composition and cured product thereof |
| 04/26/2007 | WO2007046262A1 Epoxy resin, epoxy resin composition, photosensitive resin composition, and cured object obtained therefrom |
| 04/26/2007 | US20070093630 Mannich bases and processes for the preparation of mannich bases |
| 04/26/2007 | US20070093614 Epoxy resin composition |
| 04/26/2007 | CA2625136A1 Coating compositions and methods |
| 04/25/2007 | EP1620484B1 Method for production of prepolymers made from polysulphides and polyepoxides |
| 04/25/2007 | EP1436297B1 Photoactivable nitrogen bases |
| 04/25/2007 | EP1323761B1 Polyphenol resin, process for its production, epoxy resin composition and its use |
| 04/25/2007 | EP0996657B2 Hydroxy-functional oligomers for high solids coatings |
| 04/25/2007 | CN1954411A Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 04/25/2007 | CN1954010A 液态环氧树脂组合物 Liquid epoxy resin composition |
| 04/25/2007 | CN1312246C Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| 04/25/2007 | CN1312190C Resinoid phenols solidified agent and preparation method |
| 04/25/2007 | CN1312189C Epoxy resin with three functional groups and its derivatives, their preparation method and use |
| 04/24/2007 | US7208538 Metal-acrylates as curing agents for polybutadiene, melamine and epoxy functional compounds |
| 04/24/2007 | US7208104 Mixture solution for preparing a conductive polymer to produce solid electrolytic capacitors and its method |
| 04/19/2007 | WO2007043684A1 Phenol polymer, production method thereof and use thereof |
| 04/19/2007 | WO2007043449A1 Thermosetting composition, antihalation film for solid-state imaging device and process for producing the same, and solid-state imaging device |
| 04/19/2007 | WO2007042199A1 Method for chemical anchoring |
| 04/19/2007 | WO2007042183A1 Production and use of polycarbonates comprising special purified, oligomeric epoxy resins |
| 04/19/2007 | US20070088147 Epoxy resin, epoxy resin composition including the epoxy resin and method of preparing the epoxy resin |
| 04/19/2007 | US20070088138 Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith |
| 04/19/2007 | US20070087202 Composite material |
| 04/19/2007 | CA2624381A1 Method for chemical anchoring |
| 04/18/2007 | EP1775321A1 Flame-retardant epoxy resin composition |
| 04/18/2007 | EP1775278A1 Process for producing epoxy resins |
| 04/18/2007 | CN1950453A Polycarboxy-functionalized prepolymers |
| 04/18/2007 | CN1950420A Ferrocenium-derived catalyst for cationically polymerizable monomers |
| 04/18/2007 | CN1950419A Cationically photopolymerizable composition |
| 04/18/2007 | CN1950418A Two-pack type thermosetting resin composition, method of forming coating film, and coated article |
| 04/18/2007 | CN1311003C Branched polyorganosiloxane polymers |
| 04/17/2007 | US7205361 Particulate hydrophobic polymer, production process therefor and column for reversed-phase high-performance liquid chromatography |
| 04/17/2007 | CA2346101C Curable coating compositions containing blends of carbamate-functional compounds |
| 04/17/2007 | CA2192452C Catalytic compositions and coatings made therefrom |
| 04/12/2007 | WO2007040107A1 Resin composition for optical semiconductor device encapsulation and optical semiconductor device produced by using same |
| 04/12/2007 | WO2005062801A3 Epoxy adhesive composition method of preparing using |
| 04/12/2007 | US20070082965 Photocuring resin composition, medical device using same and method for manufacturing same |
| 04/11/2007 | EP1772498A2 Ink composition, and imageforming method and recorded material using the same |
| 04/11/2007 | EP1772473A1 Epoxy resin, method for producing same and epoxy resin composition thereof |
| 04/11/2007 | EP1772446A1 Process for producing organic compounds from glycerol , the glycerol coming from renewable raw material |
| 04/11/2007 | EP1771522A1 Viscous chemical anchoring adhesive |
| 04/11/2007 | EP1771491A1 Photosensitive compositions based on polycyclic polymers |
| 04/11/2007 | EP1771397A1 Mixture for applying a coating |