Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
06/2006
06/21/2006EP1478674B1 Low-corrosive epoxy resins and production method therefor
06/21/2006CN1789304A Resin composition with high optical property
06/21/2006CN1789178A Method for preparing biodegradable water treatment agent PECS
06/21/2006CN1260264C Flame-retardant epoxy resin and its preparing method
06/21/2006CN1260258C Process for producing epoxidized diene polymer
06/20/2006US7064157 Flame retardant resin and flame retardant composition containing the same
06/15/2006US20060128835 Capsule type hardener and composition
06/15/2006US20060125119 B-stageable underfill encapsulant and method for its application
06/14/2006EP1669398A1 Reactive flame retardant and flame-retardant processed resin obtained with the same
06/14/2006EP1668086A2 Low-cure powder coatings and methods for using the same
06/14/2006EP1668078A1 Potting compound, use thereof and components encapsulated in said potting compound
06/14/2006EP1668063A2 Adhesively bonded engine and transmission parts
06/14/2006EP1668057A1 Resin formulation, uses thereof, and moulded body produced therefrom
06/14/2006EP1668056A2 Epoxy resin compositions, processes utilzing same and articles made therefrom
06/14/2006EP1668054A2 Catalysts for low-cure powder coatings and methods for using the same
06/14/2006EP1597315A4 Molding compositions containing quaternary organophosphonium salts
06/14/2006EP1244644B1 Process for the elimination of materials containing hydrolyzable halides and other high molecular weight materials from epihalohydrin derived epoxy resins
06/14/2006CN1788062A Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices
06/14/2006CN1788044A Stabilized flame retardant additives and their use
06/14/2006CN1788032A Powdered epoxy composition
06/14/2006CN1786004A Synthesis of binuclear metal complex compound and its catalyzed copolymerization and cycloaddition reaction of carbon dioxide and epoxide
06/14/2006CN1259356C Liquid crystal epoxy resin with branched chain, its preparing method, composition and use
06/13/2006US7060786 Heat resistant resin composition and adhesive film
06/13/2006US7060761 Epoxy resin compositions
06/08/2006WO2006059702A1 Composition, cured product and article
06/08/2006WO2006059606A1 Biodegradable resin composition
06/08/2006WO2006059542A1 Epoxy resin composition and semiconductor devices
06/08/2006WO2006059452A1 Method for forming photoresist pattern using double layer antireflection film
06/08/2006WO2006059363A1 Epoxy resin composition for prepreg, prepreg, and multilayered printed wiring board
06/08/2006DE102005051611A1 Wärmehärtende Harzzusammensetzung, und Prepreg, metallbeschichtete, laminierte Platte und Platine mit gedruckter Schaltung unter Verwendung desselben A thermosetting resin composition and prepreg, metal-coated, of the same laminated board and printed circuit board using
06/07/2006EP1667168A1 Composition for polymer solid electrolyte, polymer solid electrolyte, polymer, polymer solid electrolyte battery, ion-conductive membrane, copolymer and process for producing the copolymer
06/07/2006EP1666516A1 Latent hardener
06/07/2006EP1666515A1 Alicyclic epoxy resin, process for producing the same, composition thereof, cured epoxy resin, and use of alicyclic epoxy resin composition
06/07/2006EP1665375A1 Solvent-modified resin compositions and methods of use thereof
06/07/2006EP1664160A1 Method for production of objects from thermosetting resins
06/07/2006EP1663261A2 Purified polyoxypropylene/polyoxyethylene copolymers and method of preparing the same
06/07/2006EP1567288A4 ANTI-REFLECTIVE COATING COMPOSITIONS FOR USE WITH LOW k DIELECTRIC MATERIALS
06/07/2006EP1317498B1 Holographic storage medium comprising polyfunctional epoxy monomers capable of undergoing cationic polymerization
06/07/2006EP1232198B1 Uv-curable compositions
06/07/2006CN1784449A Cationically photopolymerizable resin composition and optical disk surface protection material
06/07/2006CN1784444A Polymeric epoxy resin composition
06/07/2006CN1783543A Porous film and its producing method, battery producing method and electrode/porous film assembly
06/07/2006CN1781985A Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof
06/07/2006CN1258560C Hot curable epoxy composition in a separated container
06/06/2006US7056978 Toughened epoxy-anhydride no-flow underfill encapsulant
06/06/2006US7055938 Liquid jet recording head and process for production thereof
06/01/2006WO2006057298A1 Polymerizable composition
06/01/2006WO2006056320A1 Hydrolysis-stable, hydrophobic, solvent-free polyols
06/01/2006US20060116444 Resin compositions for press-cured mica tapes for high voltage insulation
06/01/2006US20060115641 Porous wet friction material utilizing a compliant epoxide resin binder system
05/2006
05/31/2006EP1661930A1 Photo-curable resin composition and sealing agent for flat panel display using the same
05/31/2006EP1660595A1 Curable alkanolamine-containing epoxy powder coating composition
05/31/2006EP1587850B1 Curing agents for cationically curable compositions
05/31/2006EP1485437B1 Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby
05/31/2006CN1780884A Cathodic corrosion protection powder coating composition and method.
05/31/2006CN1780528A Prepreg and laminate and printed wiring board using the same
05/31/2006CN1257910C Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins made by using the derivatives, flame-retardant resin compositions, sealing media and it
05/30/2006US7053250 using double metal cyanide catalyst having more active surface area per particle as well as improved overall morphology; catalyst produces polyether polyol with a narrower molecular weight distribution; improvement in quality of polyol
05/30/2006US7053138 For thermoplastic, thermosetting resin; using phosphinic compound
05/30/2006US7053133 High room temperature storage stability and no catalytic action before activation by ultraviolet rays; thermal press bonding; epoxy resin, an ultraviolet activatable cationic polymerization catalyst, a polymerization inhibitor and water
05/26/2006WO2006054461A1 Active ray-curable composition, active ray-curable ink and image-forming method
05/25/2006WO2006025611A9 Material composition for conductive layers in electronic devices
05/25/2006US20060111536 Organic polymer having epoxy-group-containing silicon group at end and process for producing the same
05/25/2006US20060111463 Photopolymerization of unsaturated monomers in the presence of the photoinitiators wherein the composition is free of an additive that competitively absorbs actinic radiation.
05/25/2006US20060111462 Arylsulfinate salts in initiator systems for polymeric reactions
05/24/2006EP1659141A1 Thermosetting epoxy resin composition and transparent material
05/24/2006EP1448733B1 Thermally curable binding agents
05/24/2006EP0932844B1 Optical guide
05/24/2006DE102005046132A1 Flammhemmende Zusammensetzungen The flame-retardant compositions
05/24/2006DE102004055764A1 Heterogeneous ruthenium catalyst, useful for hydrogenating bis-glycidyloxyphenyl-alkanes to cyclohexane analogs, for use in lacquers, has silica carrier with specific nuclear magnetic resonance characteristics
05/24/2006CN1257206C Low viscosity curing agents compositions in epoxy resin systems for low temperature cure applications
05/23/2006USRE39106 Improve photospeed of epoxy resins; a cationical polymerizable blends for free radical polymerization, comprising at least two epoxy resins, monoacrylic monomers, free radical initiator and photo-generating acid precursor; control of polymerization reaction; use in solid imaging, accuracy, clarity
05/23/2006US7049393 Techniques for the preparation of highly fluorinated polyethers
05/23/2006US7049388 Process for manufacturing an α-dihydroxy derivative and epoxy resins prepared therefrom
05/23/2006US7049354 Oxazolidone ring-containing epoxy resin
05/23/2006US7049349 Epoxy resin modified by an aromatic polyamine, formed from a polyepoxide containing primary amine groups and at least one pore-forming agent or its degradation product
05/18/2006WO2006051820A1 Thermosetting resin composition, thermosetting film, cured product of those, and electronic component
05/18/2006WO2005047370A3 Bio-based epoxy, their nanocomposites and methods for making those
05/18/2006US20060106177 Fluorocarbon-modified epoxy resin
05/18/2006US20060106166 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
05/18/2006US20060105111 Actinic ray curable composition, actinic ray curable ink and image formation method employing the ink
05/18/2006US20060103028 Electronic component unit
05/18/2006US20060102882 Flame retardant compositions with a phosphorated compound
05/17/2006EP1657766A1 Reactive polymer-supported porous film for battery separator, method for producing the porous film and electrode/porous film assembly
05/17/2006EP1657269A1 Conductive epoxy resin composition and method for producing the same
05/17/2006EP1657268A1 Photosensitive composition and cured product thereof
05/17/2006EP1196463B1 Epoxy resin prepared from p-hydroxystyrene having high functionality, low melt viscosity with high glass transition temperature
05/17/2006CN1774461A Accelerator systems for low-temperature curing
05/17/2006CN1774424A 1-imidazolylmethyl-substituted-2-naphtols and their use as accelerators for low-temperature curing
05/17/2006CN1772787A Prepn of Cationic ultraviolet initiator for curing epoxy resin
05/17/2006CN1256396C High temperature epoxy adhesive films
05/16/2006US7045589 Bioerodible poly(ortho esters) from dioxane-based di(ketene acetals), and block copolymers containing them
05/16/2006US7044324 Composite material
05/11/2006WO2006049156A1 Epoxy resin composition and semiconductor device
05/11/2006WO2006049045A1 Sulfonic-ester-containing composition for formation of antireflection film for lithography
05/11/2006US20060100397 Useful for casting out optoelectronic components; acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak
05/11/2006US20060100315 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
05/11/2006US20060100301 Curable compositions and rapid prototyping process using the same
05/11/2006US20060100299 Transformable pressure sensitive adhesive tape and use thereof in display screens
05/11/2006US20060099497 Reactive polymer-supported porous film for battery separator, method for producing the porous film, method for producing battery using the porous film, and electrode/porous film assembly