| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 07/08/2008 | US7396885 A blends comprising an adduct of epoxidized phenolic resins with (meth)acrylic acid, a (meth)acrylates, a liquid epoxy resins and curing agents; noncracking, solder-resistance, corrosion resistance, durability |
| 07/08/2008 | US7396869 Metallic acrylate curing agents and usage thereof in intermediate compositions |
| 07/08/2008 | CA2138636C Cathodic electrodeposition method utilizing cyclic carbonate-curable coating composition |
| 07/03/2008 | WO2008079592A1 Distortional composite matrix |
| 07/03/2008 | WO2008078692A1 Cationically polymerizable resin composition for molding, and molded article using the same |
| 07/03/2008 | WO2008078669A1 Sealing agent, members with thermally sprayed coatings, and bearings |
| 07/03/2008 | WO2008077935A1 Amide or thioester pre-extended epoxy-terminated visosifiers and method for producing the same |
| 07/03/2008 | WO2008077933A1 Ester pre-extended epoxy-terminated viscosifiers and method for producing the same |
| 07/03/2008 | US20080161533 An oxirane compound, such as glycidol is reacted in the presence of a powdered activated carbon catalyst, where necessary, with an initiator (polyhydric alcohol, aliphatic alcohol, oraliphatic carboxylic acid), to yield, a polyglycidol, a polyglycidol alkyl ether or polyester |
| 07/03/2008 | US20080161520 Diphenylsulfonium compounds in which the S atom is additionally attached to a xanthene-9-onyl-2-yl- or coumarin-7-yl- ring; acid generator for a chemically amplified resist; photopolymerization initiator for polymerizing an epoxide or a vinyl ether |
| 07/02/2008 | EP1939234A1 Resin composition for optical three-dimensional molded object |
| 07/02/2008 | EP1939233A1 Epoxy resin, epoxy resin composition, photosensitive resin composition, and cured object obtained therefrom |
| 07/02/2008 | EP1937786A1 Coating compositions and methods |
| 07/02/2008 | EP1937745A1 Method for chemical anchoring |
| 07/02/2008 | EP1937744A1 Production and use of polycarbonates comprising special purified, oligomeric epoxy resins |
| 07/02/2008 | CN101213490A 感光性树脂组合物 The photosensitive resin composition |
| 07/01/2008 | US7394965 Photosensitive resin composition for optical waveguide formation and optical waveguide |
| 07/01/2008 | US7393904 (Meth)acrylate-terminated polyphenylene ether |
| 06/26/2008 | WO2008075427A1 Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
| 06/26/2008 | US20080153976 methyldiphenol/4,4-/, diglycidyl ether, methyldiphenol/4,4-/, epichlorohydrin adduct and epoxy resin containing methyldipheno/4,4-/ and glycidol; chain extension using 4,4-biphenol; curable, curing |
| 06/26/2008 | US20080152985 Sulfonyl grafted heterocycle materials for proton conducting electrolytes |
| 06/26/2008 | US20080152831 Photocurable maskant composition and method of use |
| 06/25/2008 | EP1935915A1 Amide- or thioester-preextended epoxy-ended tougheners and process for their synthesis |
| 06/25/2008 | EP1935914A1 Hydroxyester-preextended epoxyended tougheners and process for their synthesis |
| 06/25/2008 | EP1935904A1 Ester-preextended epoxyended tougheners and process for their synthesis |
| 06/25/2008 | EP1551911B1 Autodepositing epoxy dispersion modified with ethylenically modified monomer |
| 06/25/2008 | EP1080392B1 Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography |
| 06/25/2008 | CN101208636A Toner and toner production process |
| 06/25/2008 | CN101208386A Epoxy resin composition for sealing semiconductor device and semiconductor device using the same |
| 06/25/2008 | CN101208373A Polyamide resin, epoxy resin compositions, and cured articles thereof |
| 06/25/2008 | CN101208368A Biphenylene-bridged phenol novolak resins and use thereof |
| 06/25/2008 | CN101205290A Isocyanate modified epoxy acrylic ester and preparation thereof |
| 06/25/2008 | CN100396716C Epoxy-functional hybrid copolymers |
| 06/24/2008 | US7390845 Sealing system and process therefor |
| 06/24/2008 | US7390840 Active ray curable composition, active ray curable ink, image forming method and inkjet recording apparatus utilizing the same |
| 06/24/2008 | US7390765 Catalyst of reaction product of polyisocyanate and tertiary amino group-containing amine, alcohol or polyol |
| 06/24/2008 | US7390571 mixing epoxy resins, dicyandiamide, a curing agents having imidazole rings and fillers, then heating the mixture in solvents to enhance compatibility and form a uniform dispersion; electrical insulation and fireproofing |
| 06/24/2008 | US7390479 Branched polyorganosiloxane polymers |
| 06/19/2008 | WO2008072668A1 Phenol resin, epoxy resin, curable resin composition, cured product of the composition, and method for producing phenol resin |
| 06/19/2008 | WO2008051373A3 Curable epoxy resin composition having improved adhesion to metal substrates and process for making coated and fiber-reinforced composite article |
| 06/19/2008 | US20080146706 epoxy resins modified by a mixture of bismaleimides, maleimides and barbituric acids, used for adhesion and insulation of electronics |
| 06/19/2008 | US20080145634 textile sheets impregnated with epoxy resin, curing agent; gelled via heat/pressure; for aerospace technology |
| 06/19/2008 | US20080142966 Metal Particles-Dispersed Composition and Flip Chip Mounting Process and Bump-Forming Process Using the Same |
| 06/19/2008 | CA2672111A1 Hybrid cationic curable coatings |
| 06/18/2008 | EP1704185B1 Reactive thermosetting system with long storage life |
| 06/18/2008 | CN101200540A Method for employing anion polymeric polyamide as epoxy resin curing agent |
| 06/18/2008 | CN101200458A Alicylic epoxy compounds and their preparation process, alicylic epoxy resin composition, and encapsulant for light-emitting diode |
| 06/18/2008 | CN100395274C Preparation process of carbon nanotube epoxy resin curing agent |
| 06/12/2008 | WO2008069333A1 Curable epoxy resin composition, cured body thereof, and use thereof |
| 06/12/2008 | WO2008068205A1 Epoxy resin compositions and method for the production thereof |
| 06/12/2008 | WO2008048554A3 Improved epoxy compositions |
| 06/12/2008 | US20080139758 Polymerizable Composition |
| 06/12/2008 | US20080139733 Oligomers And Polymers Containing Epoxide Groups And Silane Groups, Their Preparation And Use |
| 06/12/2008 | US20080139728 Composition Containing a Hydrogenated Bisglycidyl Ether and a Cross-Linking Agent |
| 06/11/2008 | EP1930359A1 High-stability microencapsulated hardener for epoxy resin and epoxy resin composition |
| 06/11/2008 | EP1930326A1 Synthesis of new dihydrobenzoxazine |
| 06/11/2008 | EP1928396A2 Epoxy based oil free root canal sealer |
| 06/11/2008 | CN101198632A Epoxy resin composition and curing product thereof |
| 06/11/2008 | CN101195676A Phosphor A containing novolac epoxy and method for producing the same |
| 06/11/2008 | CN100393836C Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices |
| 06/11/2008 | CN100393802C Resin composition, and use and method for preparing the same |
| 06/10/2008 | US7384546 Multi-layered macromolecules and methods for their use |
| 06/05/2008 | WO2008065939A1 Adamantane derivative, method for producing the same, and resin composition containing adamantane derivative |
| 06/05/2008 | WO2008065866A1 Insulating polymeric-material composition |
| 06/05/2008 | US20080131702 Epoxy resin composition and semiconductor package including the same |
| 06/05/2008 | US20080131639 Adhesive Composition for Semiconductor Device and Cover Lay Film, Adhesive Sheet, and Copper-Clad Polymide Film Made With the Same |
| 06/04/2008 | EP1926554A2 Cure catalyst, composition, electronic device and associated method |
| 06/04/2008 | EP1848754B1 Low shrinkage amine-curing epoxy resin compositions comprising a lactone |
| 06/04/2008 | CN101193975A Hardenable resin composition |
| 06/04/2008 | CN101190931A Preparation of cation light initiator ferrocene arene salt and application thereof |
| 06/04/2008 | CN100391996C Epoxy resin solidification agent and its preparation method |
| 06/04/2008 | CN100391995C Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 05/29/2008 | WO2008064115A1 Epoxy resins comprising a cycloaliphatic diamine curing agent |
| 05/29/2008 | WO2008062231A2 Improvements in or relating to polymer composites |
| 05/29/2008 | US20080124822 Thermosetting resin composition and photo-semiconductor encapsulant |
| 05/29/2008 | DE19809419B4 Adhäsive Zusammensetzung, deren Verwendung und Verfahren zu deren Herstellung Adhesive composition, the use thereof and processes for their preparation |
| 05/28/2008 | EP1925630A1 Thermosetting resin composition |
| 05/28/2008 | CN101189275A Hardenable epoxy resin composition |
| 05/28/2008 | CN101189274A Latent curing agent |
| 05/28/2008 | CN101186679A Preparation method of phenolic resin for producing epoxy resin |
| 05/28/2008 | CN100390243C Coating composition |
| 05/27/2008 | US7378461 Curable epoxy resin compositions and process for production thereof |
| 05/27/2008 | US7378228 using a multilayer insulating coating of an epoxy resin having two or more epoxy groups in one molecule, a modified phenolic resin having a triazine ring, a basic curing agent such as imidazole compound, a photosensitive acid generator, heat curing; fireproofing; dilution wtih MEK or other solvents |
| 05/22/2008 | WO2008059935A1 Photocurable/thermosetting resin composition, cured product and printed wiring board |
| 05/22/2008 | WO2008059856A1 Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition |
| 05/22/2008 | WO2008059755A1 Crystalline resin cured product, crystalline resin composite body and method for producing the same |
| 05/22/2008 | WO2008059670A1 Photocurable/thermosetting resin composition, cured object, and printed wiring board |
| 05/22/2008 | WO2008059612A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 05/22/2008 | US20080119613 Polyetheralkanolamine Dispersants |
| 05/22/2008 | US20080118729 Thermoplastic composition, method of making, and articles formed therefrom |
| 05/22/2008 | US20080118666 Radiation curable resin composition for making colored three dimensional objects |
| 05/22/2008 | US20080116497 Chip-packaging compositions including catalysts and hardeners, packages made therewith, and methods of assembling same |
| 05/21/2008 | EP1923416A1 Adamantane derivative, epoxy resin, and optical electronic member using resin composition comprising them |
| 05/21/2008 | EP1922135A1 Hindered cyclic polyamines and their salts for acid gas scrubbing process |
| 05/15/2008 | WO2008056172A1 Inkjet printing |
| 05/14/2008 | EP1921111A1 Epoxy resin composition and die bonding material comprising the composition |
| 05/14/2008 | EP1921100A1 Use of a polyamine stream as curing agent in epoxy adhesive and flooring applications |
| 05/14/2008 | EP1920006A2 Shape memory epoxy copolymers |
| 05/14/2008 | EP1475398B1 Indole resins, epoxy resins and resin compositions containing the same |
| 05/14/2008 | CN101177479A Method for preparing self-emulsification aqueous epoxy resin emulsion |