| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 03/08/2007 | US20070055039 Latent curing agent and composition |
| 03/08/2007 | US20070054974 Radiation curable ink containing at least two photo-polymerization compounds, one of which is an oxetane compound having a specific formula, and the other is an epoxy compound, having an oxirane ring in the molecule; low viscosity and high sensitivity |
| 03/08/2007 | US20070054218 Radiation curable resin composition for making colored three dimensional objects |
| 03/08/2007 | US20070052131 Method of producing a weld-cut sealing/heat-shrinkable packaging film formed of a polyethylene terephthalate-based block copolymer polyester |
| 03/08/2007 | DE102005042097A1 Flame-resistant epoxy resin is structured by a condensation at the oxiran rings to form phosphor-carbon compounds |
| 03/07/2007 | EP1760102A1 Cationically photopolymerizable composition and optoelectronic component using same |
| 03/07/2007 | EP1760101A1 Epoxy resin, epoxy resin composition and cured product thereof |
| 03/07/2007 | EP1622969B1 Use of diazepine derivatives as latent hardening components |
| 03/07/2007 | EP1453876B1 Method for the production of tubes in composite materials |
| 03/07/2007 | CN1926456A Curable resin composition for light guide formation, curable dry film for light guide formation, cured resin and light guide |
| 03/07/2007 | CN1926214A Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 03/07/2007 | CN1926167A Ultraviolet-curing composition |
| 03/06/2007 | US7186312 Adhesive which hardens in several stages |
| 03/01/2007 | WO2007023856A1 Gas barrier composite film for hydrothermally processable package and packaging bag obtained by using same |
| 03/01/2007 | WO2007023165A1 Coating mass |
| 03/01/2007 | WO2007005280A3 Molding composition and method, and molded article |
| 03/01/2007 | US20070049722 for solder joints in electronic packaging; increase the glass transition temperature (Tg) under low temperature cure conditions; 5-hydroxymethyl-8-hydroxyquinoline; maleimidehexanoyl- or carbamate functionalized at the 5-position |
| 03/01/2007 | US20070049708 Coating-forming components of epoxy resin and amine curing agent wherein curing agent is reaction product of methaxylylenediamine or paraxylylenediamine, a polyfunctional compound having at least one acyl group or carboxylic acid |
| 03/01/2007 | US20070049705 Polycarbonate molding compositions having improved rheological properties |
| 03/01/2007 | CA2618730A1 Coating mass |
| 02/28/2007 | EP1757633A1 Accelerators useful for energy polymerizable compositions |
| 02/28/2007 | EP1755792A1 Method for coating electrically conductive substrates |
| 02/28/2007 | EP1550677B1 Composition for holography, method of curing the same, and cured article |
| 02/28/2007 | EP1414902B1 Epoxy resin |
| 02/28/2007 | EP1407463B1 Electrical article having epoxy dielectric layer cured with aminophenylfluorenes |
| 02/28/2007 | CN1302040C Composition for protective film, method of using same, and use thereof |
| 02/27/2007 | US7183363 Thermally conductive casting compound |
| 02/27/2007 | US7183362 Process for producing polyester resins |
| 02/27/2007 | US7183139 Flip-chip system and method of making same |
| 02/27/2007 | US7183040 cationically curable component having a linking aliphatic ester group; epoxy group containing component; oxetane group containing component, multifunctional acrylate and a radical photoinitiator and a cationic photoinitiator |
| 02/27/2007 | US7182833 Which comprises applying a curable composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated |
| 02/22/2007 | WO2007022217A1 Mercaptan-hardened epoxy polymer compositions and processes for making and using same |
| 02/22/2007 | WO2007022193A2 Process for the preparation of copolymer-1 |
| 02/22/2007 | WO2007021464A1 Hindered cyclic polyamines and their salts for acid gas scrubbing process |
| 02/22/2007 | WO2007020764A1 Laminate to be used in flexible printed wiring boards and wiring boards made by using the same |
| 02/22/2007 | US20070043138 Resin composition for photofabrication of three dimensional objects |
| 02/22/2007 | US20070042191 Tougher cycloaliphatic epoxide resins |
| 02/22/2007 | US20070040145 Composition for polymer solid electrolyte, polmer solid electrolyte, polymer, polymer solid electrolyte battery, ionconductive membrane, copolymer and process for producing the copolymer |
| 02/22/2007 | CA2619327A1 Mercaptan-hardened epoxy polymer compositions and processes for making and using same |
| 02/21/2007 | EP1754747A1 Photoinitiator composition including hindered amine stabilizer |
| 02/21/2007 | EP1754735A1 One pack thermosetting type epoxy resin composition and underfilling materials for semiconductor mounting |
| 02/21/2007 | EP1754734A1 Curing agent for epoxy resins and epoxy resin compositions |
| 02/21/2007 | EP1754733A1 Composition |
| 02/21/2007 | EP1753801A1 Catalyst for curing epoxy resins, epoxy resin composition, and powder coating composition |
| 02/21/2007 | EP1753772A1 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 02/21/2007 | EP1290054B1 Glyoxal-phenolic condensates with enhanced fluorescence |
| 02/21/2007 | CN1918514A Photosensitive resin composition and cured product thereof |
| 02/21/2007 | CN1918216A Novel underfill material having enhanced adhesion |
| 02/21/2007 | CN1918208A Multi-component kit for fixing and its uses |
| 02/21/2007 | CN1918207A Encapsulation epoxy resin material and electronic component |
| 02/21/2007 | CN1916049A Epoxy resin curing agent of containing phosphor, prepartion method and applicaiton |
| 02/21/2007 | CN1916034A Solidifiable composition material by ultraviolet light and application |
| 02/21/2007 | CN1915985A Method for producing maleic anhydride of hydriding terpene |
| 02/21/2007 | CN1301257C Amine compounds and curable compositions derived therefrom |
| 02/20/2007 | US7179869 Transesterifying an ester having a limited acid value with a diol having a cyclic acetal skeleton in the presence of a titanium compound to obtain an oligomer which is then polymerized to increase the molecular weight; impact resistance and low yellowness |
| 02/20/2007 | US7179552 Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
| 02/20/2007 | CA2184471C Coating composition, process for forming cured film and coated article |
| 02/20/2007 | CA2138063C Polyurethane foam-supported double metal cyanide catalysts for polyol synthesis |
| 02/15/2007 | WO2007018011A1 Composition, actinic energy radiation hardenable composition and epoxy compound |
| 02/15/2007 | WO2007017307A1 Uv-curable and thermosetting epoxy resin lacquer for electronic subassemblies in humid spaces |
| 02/15/2007 | US20070037896 polymerizable resin composition comprises an epoxy compound, a photo cation polymerization initiator, and a photo radical polymerization initiator; excellent in curing properties and corrosion resistance with less resin coloration and less cure shrinkage; surface protective material for optical disks |
| 02/15/2007 | US20070036981 Molding compositions containing quaternary organophosphonium salts |
| 02/15/2007 | US20070036971 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 02/15/2007 | US20070034309 Process for producing tyres, tyres thus obtained and elastomeric compositions used therein |
| 02/14/2007 | EP1752483A1 Oxetane compound and hardenable composition containing the same |
| 02/14/2007 | EP1752463A1 Novel fluorinated alkylfluorophosphoric acid salt of onium and transition metal complex |
| 02/14/2007 | EP1752435A1 Process for producing dichloropropanol from glycerol , the glycerol coming eventualy from the manufacture of biodiesel |
| 02/14/2007 | EP1581573A4 Water-based epoxy grout |
| 02/14/2007 | CN1914246A Thermosetting resin composition and use thereof |
| 02/14/2007 | CN1914245A Thermoplastic elastomer composition and molded article |
| 02/14/2007 | CN1914244A Thermoplastic elastomer composition and molded article |
| 02/14/2007 | CN1911984A Novel sulfurized phenolic resin, process for producing the same, phenol derivative having thioeter structure or disulfide structure, process for producing the same |
| 02/14/2007 | CN1911920A 2-amino ethyl sulfonic acid modified water epoxy resin and its preparation method and water epoxy emulsion prepared from said water epoxy resin |
| 02/14/2007 | CN1300210C Cyanate modified epoxy resin system catalystzed by organic titanium epoxy resin |
| 02/14/2007 | CN1300152C Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins |
| 02/08/2007 | WO2007015591A1 Epoxy resin composition for packaging semiconductor device |
| 02/08/2007 | WO2007015427A1 Thermosetting epoxy resin composition and semiconductor device |
| 02/08/2007 | WO2007015426A1 Light-emitting device, method for manufacturing same, molded body and sealing member |
| 02/08/2007 | WO2007015375A1 Photosensitive resin composition and cured article thereof |
| 02/08/2007 | WO2005078030A3 Near infrared radiation curable powder coating composition having enhanced flow characteristics |
| 02/07/2007 | EP1748801A2 Compositions and articles containing a crosslinked polymer matrix and an immobilized active liquid, as well as methods of making and using the same |
| 02/07/2007 | CN1910235A Reactive thermosetting system with long storage life |
| 02/07/2007 | CN1910234A Dual cure reaction products of self-photoinitiating multifunctional acrylates with cycloaliphatic epoxy compounds |
| 02/07/2007 | CN1299380C Epoxy nitrile insulator and seal agent for fuel cell assembles |
| 02/06/2007 | US7172274 Reacting a prepolymer having one or more guanidinium or biguanidinium units and having at least one reactive end group; and chain extender having at least two groups able to react with reactive end group |
| 02/01/2007 | WO2007014039A2 Thermally curable precursor of a toughened thermo-expanded film and a film made thereof |
| 02/01/2007 | WO2007013284A1 Epoxy resin composition and semiconductor device |
| 02/01/2007 | WO2007012577A1 Composition |
| 02/01/2007 | US20070027298 Photosetting, thermosetting liquid ink |
| 02/01/2007 | US20070027274 An optionally halogenated bisphenol A or bisphenol F epoxy resin, a resorcinol epoxy resin or a tetrakis(hydroxyphenyl)ethane epoxy resin; dicyandiamide as a latent hardener for the epoxy resin, and assymetrical N,N-dimethylurea as an accelerator; powder coatings, electrical laminates, and adhesives |
| 02/01/2007 | CA2615773A1 Thermally curable precursor of a toughened thermo-expanded film and a film made thereof |
| 01/31/2007 | EP1747245A1 Ferrocenium-derived catalyst for cationically polymerizable monomers |
| 01/31/2007 | CN1906536A Photosensitive resin composition, color filter and liquid crystal display device |
| 01/31/2007 | CN1906234A Polymer composite formed article, printed wiring board using the formed article and method for producing them |
| 01/31/2007 | CN1906226A Curing silicone composition and cured product thereof |
| 01/31/2007 | CN1298033C Anisotropic conductive adhesive, assembling method, and electrooptical device module |
| 01/31/2007 | CN1297584C Hydrogenation of methane diphenylamine homolog and epoxy resin cured therefrom |
| 01/31/2007 | CN1297583C Sealing material for liquid crystal and liquid crystal display cell using same |
| 01/31/2007 | CN1297582C Radiation curable supersizes |
| 01/30/2007 | US7169862 Reaction product of an epoxy resin and dimer fatty acids further reacted with a polyisocyanate, an amino functional siloxane or polysiloxane curing agent; primers with improved corrosion resistance and adhesion to aluminum substrates |