| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 10/11/2006 | CN1279084C Method of manufacturing a replica as well as a replica obtained by carrying out an UV light-initiated cationic polymerization |
| 10/11/2006 | CN1279078C Epoxy resin containing fluorine, ramification, preparation method and application |
| 10/10/2006 | US7119130 An epoxy compound having at least two oxirane rings and a branched linkage chain; nontoxic, improved stability, photopolymerizability in high humidity, curability, high strength of the cured ink layer, substrate adhesion, and solvent and water resistances |
| 10/10/2006 | US7119129 photocuring a mixture of an aliphatic urethane diacrylate or triacrylate, an acrylated epoxy oligomer, and a (meth)acrylic ester in the presence of a photoinitiator; free of volatile organic compounds; spraying, screen printing, or dipping; touch screens, membrane switches, TV screens, VCR's |
| 10/10/2006 | US7118837 Photoimaged dielectric polymer and film, and circuit package containing the same |
| 10/10/2006 | US7118621 Organo-functional polysiloxanes |
| 10/10/2006 | CA2243068C Improved double metal cyanide catalysts and methods for making them |
| 10/05/2006 | WO2006103976A1 Inkjet ink composition for color filter, process for producing color filter, and color filter |
| 10/05/2006 | US20060223978 Radiation- or thermally-curable oxetane barrier sealants |
| 10/05/2006 | US20060223902 Light curable articles containing azinium salts |
| 10/05/2006 | US20060222999 Photopolymerization; ink jet printing; waterproofing; flexibility; useful as coatings, adhesives, inks and film coatings, ultraviolet inks for ink jet, sealers for display panels such as liquid crystals and organic electroluminescence, adhesives for bonding optical disks; improved adhesion |
| 10/04/2006 | EP1707585A1 One-component epoxy resin composition |
| 10/04/2006 | EP0855427B1 Aqueous dispersion composition |
| 10/04/2006 | CN1840562A Method for preparing latent hardener |
| 10/04/2006 | CN1277965C Length-measuring staying device for weft |
| 10/04/2006 | CN1277858C Epoxy resin composition, fiber-reinforced composite material and manufacturing method thereof |
| 10/03/2006 | US7115681 Resin composition |
| 09/28/2006 | WO2006101127A1 Electroconductive joining material and electric or electronic device using the same |
| 09/28/2006 | WO2006101008A1 Epoxy resin composition, cured product thereof, novel epoxy resin, process for production thereof, and novel phenol resin |
| 09/28/2006 | WO2006100978A1 Active ray-curable composition, polymerization method, active ray-curable ink, image-forming method and inkjet recorder |
| 09/28/2006 | US20060217527 Electroluminescent conjugated polymers containing phosphorescent moieties and the application thereof in LED |
| 09/28/2006 | US20060217499 Semiconductor encapsulation by a liquid epoxy resin, a curing agent containing > 5 wt % of an aromatic amine, a microencapsulated catalyst containing a hydroxy-benzoic acid; noncracking; shelf life; rapid curing; flip chips |
| 09/28/2006 | US20060217494 Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same |
| 09/28/2006 | US20060216520 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 09/28/2006 | US20060216519 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 09/28/2006 | US20060216495 epoxy resin, a phenolic novolak, a curing accelerator, and a silica filler, characterized in that the silica filler has a shape having at least two planes and has an average particle diameter of 0.3 to 10 mu m and a specific surface area of 8 to 30 m2/g. |
| 09/28/2006 | US20060214153 Epoxy resin molding material for sealing use and semiconductor device |
| 09/27/2006 | EP1705199A2 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 09/27/2006 | EP1704185A1 Reactive thermosetting system with long storage life |
| 09/27/2006 | EP1703973A1 Heterogeneous ruthenium catalyst, nucleus-hydrogenated diglycidyl ether of bisphenols a and f, and method for the production thereof |
| 09/27/2006 | EP1252218B1 Epoxy resin composition |
| 09/27/2006 | CN1839169A Photosensitive composition and cured product thereof |
| 09/27/2006 | CN1837257A High temperature -resistant 4,5-epoxy cyclohexane-1,2-diglycidyl-m-phthalate epoxy resins and process for preparing same |
| 09/27/2006 | CN1837256A Hyperbranched polymer containing crown ether and synthesis process therefor |
| 09/26/2006 | US7112636 Epoxy resin composition |
| 09/26/2006 | US7112634 Thermosetting resin composition |
| 09/26/2006 | CA2260975C Thermal transfer compositions, articles and graphic articles made with same |
| 09/21/2006 | WO2006098491A1 Organotrisiloxane, preparation and use in curable resin composition |
| 09/21/2006 | WO2006098329A1 Epoxy resin, epoxy resin composition, and utilizing the same, prepreg and laminated plate |
| 09/21/2006 | WO2006097387A1 Epoxy and silane group-containing oligomers and polymers a method for the production and the use thereof |
| 09/21/2006 | US20060211845 1-Imidazolymethyl -substituted -2-naphtols and their use as accelerators for low - temperature curing |
| 09/21/2006 | US20060208219 Sealant of an epoxy resin from a bisphenol S-type polyvalent aromatic group with a glycidyl group, a thermo-curing agent, and a filler; excellent coatability, bondability to a substrate, long service life, pot life, high adhesive strength |
| 09/20/2006 | EP1702938A1 Curing silicone composition and cured product thereof |
| 09/20/2006 | EP1701690A2 Epoxy adhesive composition method of preparing using |
| 09/20/2006 | EP1570000B1 Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| 09/20/2006 | EP1558678B1 Toughened epoxy / polyanhydride no- flow underfill encapsulant composition |
| 09/20/2006 | EP1483331B1 High flow compositions of compatibilized poly(arylene ether)/polyamide blends |
| 09/20/2006 | EP1272535B1 Hydrogels and methods for their production |
| 09/20/2006 | EP1198518B1 Method for producing flat articles from renewable raw materials |
| 09/20/2006 | CN1835984A 固化性树脂组合物 Curable resin composition |
| 09/20/2006 | CN1835983A Photo-curable resin composition and sealing agent for flat panel display using the same |
| 09/20/2006 | CN1835946A Epoxy compound and cured epoxy resin product |
| 09/20/2006 | CN1276023C 固化性环氧树脂组合物 Curable epoxy resin composition |
| 09/20/2006 | CN1275997C Process for synthesizing low molecular bisphenol A epoxy resin by one-step alkalization method |
| 09/19/2006 | US7109289 Polymers with addition polymer monomer to form protective coatings for chemical resistance |
| 09/19/2006 | US7109288 Thermal conductivity; electrical insulation; epoxy material containing mesogen structured and hardening monomer units |
| 09/19/2006 | US7109286 Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins made by using the derivatives, flame-retardant resin compositions, sealing media and laminated sheets |
| 09/19/2006 | US7108919 Reactive non-isocyanate coating compositions |
| 09/19/2006 | US7108806 Mixing epoxy resin, amine, filler, corrosion inhibitor and oxygen scavenger, imidazole curing agent and solvent |
| 09/14/2006 | WO2006095670A1 Base multiplying agents and base-reactive curable compositions |
| 09/14/2006 | WO2006095554A1 Alkali-developable photosensitive resin composition |
| 09/14/2006 | WO2006095516A1 Curable resin composition, prepreg and composite material using same |
| 09/14/2006 | WO2006095494A1 Photosensitive solder resist composition, photosensitive solder resist film, permanent pattern and method for forming same |
| 09/14/2006 | US20060204897 Negative resist composition comprising base polymer having epoxy ring and si-containing crosslinker and patterning method for semiconductor device using the same |
| 09/14/2006 | US20060204762 Liquid epoxy resin composition and semiconductor device |
| 09/13/2006 | EP1700875A2 Curable composition having low coefficient of thermal expansion, method of making an integrated circuit, and an integrated circuit made there from |
| 09/13/2006 | EP1700874A1 Curable composition |
| 09/13/2006 | EP1699557A1 Heterogeneous ruthenium catalyst, methods for hydrogenating a carbocyclic aromatic group, and nucleus-hydrogenated diglycidyl ether of bisphenols a and f |
| 09/13/2006 | EP1587865B1 Flame-retardant for engineering thermoplastic applications |
| 09/13/2006 | EP1480968B1 Thioxanthone derivatives, and their use as cationic photoinitiators |
| 09/13/2006 | EP1448654B1 Radiation curable resin composition for making colored three dimensional objects |
| 09/13/2006 | CN1832976A Epichlorohydrin amine polymers used for treating the surface of leather |
| 09/13/2006 | CN1274780C Water-resistant adhesive composite for wood |
| 09/13/2006 | CN1274760C Curable epoxy resin compositions and process for production thereof |
| 09/13/2006 | CN1274744C Flame retardant molding compositions |
| 09/12/2006 | US7105625 Such as (3-aminopropyl)tribisphenol A silane; bonding organic adhesives to inorganic substrates; void free semiconductor package sealing |
| 09/12/2006 | US7105614 Curable epoxy resin composition |
| 09/12/2006 | US7105591 Heat resistance, high strength, stiffness, impact strength |
| 09/12/2006 | US7105271 For forming fine patterns having a high aspect ratio |
| 09/10/2006 | CA2599578A1 Comb-like polyetheralkanolamines in inks and coatings |
| 09/08/2006 | WO2006093949A1 Two-component epoxy adhesive composition |
| 09/08/2006 | WO2006093203A1 Epoxy resin composition, cured object obtained therefrom, semiconductor-encapsulating material, novel phenolic resin, and novel epoxy resin |
| 09/08/2006 | CA2599400A1 Two-component epoxy adhesive composition |
| 09/06/2006 | EP1698651A1 Polyamide acid resin having unsaturated group, photosensitive resin composition using same, and cured product thereof |
| 09/06/2006 | EP1698625A1 Epoxy compounds and cured epoxy resins obtained by curing the compounds |
| 09/06/2006 | EP1697441A1 Novel underfill material having enhanced adhesion |
| 09/06/2006 | CN1829757A Epoxy resin composition and method for producing heat-resistant laminate sheet |
| 09/06/2006 | CN1829756A Modified epoxy resin, process for production thereof, photosensitive resin compositions and photosensitive elements |
| 09/06/2006 | CN1273870C Composition for forming antireflection film for lithography |
| 09/06/2006 | CN1273868C Liquid resin composition and method for producing cured article or tridimensional formed article |
| 09/06/2006 | CN1273535C High-temp. under mould-filling material with low heat generating in use |
| 09/05/2006 | US7101959 coordination catalysts used for polymerization of heterocyclic compounds such as epoxides, thioepoxides, cyclic esters or thioesters; catalysts selectivity |
| 09/05/2006 | US7101933 reacting polyphenylene ether (PPE) with an epoxy resin that has low bromine content in a non-polar solvent in the presence of a catalyst in a reactor; PPE needs not to be cleaved into small molecules and instead mixes and react directly reducing reaction time |
| 09/05/2006 | US7101596 Liquid crystal sealant, liquid crystal display device using the same and method for producing the device |
| 08/31/2006 | WO2006090794A1 Latent hardener for epoxy resin and epoxy resin composition |
| 08/31/2006 | WO2006090662A1 Epoxy resin, hardenable resin composition containing the same and use thereof |
| 08/31/2006 | US20060194933 Thermosetting epoxy resin composition and transparent material |
| 08/31/2006 | US20060194931 Use of diazepine derivatives as latent hardening components |
| 08/31/2006 | US20060194923 Curable composition |
| 08/31/2006 | US20060194064 Underfill encapsulant for wafer packaging and method for its application |