Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
01/2007
01/30/2007US7169833 shell-core polymer containing (meth)acrylate ; aromatic amine curing agent; glass transition temperature; controlling particle size; sealant for flip chips
01/30/2007US7169828 Method of manufacturing a replica as well as a replica obtained by carrying out an UV light-initiated cationic polymerization
01/30/2007US7169474 Epoxy resin composition and semiconductor device
01/30/2007CA2255999C Cathodic electrocoating compositions containing alkane sulfonic acid
01/25/2007WO2007010932A1 Polyamide resin, epoxy resin compositions, and cured articles thereof
01/25/2007WO2007010784A1 Fluoroadamantane derivative, resin composition containing the same, and optical electron member using the resin composition
01/25/2007US20070021582 One-component epoxy resin composition
01/25/2007US20070021571 Curable polymer compound
01/25/2007US20070020555 Light sensitive composition containing a compounds capable of undergoing radical polymerization and cationic polymerization, a photopolymerization initiator of iron-arene complex and a halogenated alkyl group-containing compound; and polymeric binder; durability
01/25/2007US20070018315 Conductive adhesive composition
01/25/2007CA2614648A1 Polyamide resin, epoxy resin compositions, and cured articles thereof
01/24/2007EP1746119A1 Thermally curable precursor of a toughened thermo-expanded film and a film made thereof
01/24/2007EP1745105A1 Polyetheralkanolamine dispersants
01/24/2007EP1745104A1 Comb-like polyetheralkanolamines in inks
01/24/2007EP1745096A1 Thermohardenable epoxy resin-based compositions, 3(4)-(aminomethyl)-cyclohexane-propanamine and 1,4(5)-cyclooctane dimethanamine
01/24/2007EP1745084A1 Tack-free low voc vinylester resin
01/24/2007EP1745083A1 Highly-charged stable dental composition which may be cross-linked/polymerised by cationic reaction
01/24/2007EP1165688B1 Hardenable composition with a particular combination of characteristics
01/24/2007CN1900135A Process for preparing glycidic amine type polyfunctional epoxy resin
01/24/2007CN1296451C Dual cure B-stageable adhesive for die attach
01/24/2007CN1296450C Binder and electric apparatus
01/24/2007CN1296405C Polycarboxylic acid resin, polycarboxylic acid resin composition, and cured article obtained therefrom
01/23/2007US7167629 Formed by photopolymerizing 9,9-bis(glycidyl-(optionally oxyalkylene)oxyphenyl)fluorene in the presence of a photoacid generator; may be exposed to light through a photo mask by contact exposure and developed to form the resin layer into a pattern
01/23/2007CA2396095C Modified polyolefin resin, modified polyolefin resin composition, and use thereof
01/23/2007CA2202874C Hyperbranched macromolecule of polyester type
01/18/2007WO2007008199A1 Primer compositions for adhesive bonding systems
01/18/2007WO2007007827A1 Biphenylene-bridged phenol novolak resins and use thereof
01/18/2007WO2007007803A1 Actinic-energy-ray-curable resin composition for plastic film and plastic label
01/18/2007WO2007007725A1 Thermosetting epoxy resin composition
01/18/2007WO2007007635A1 Process for producing microparticulate hardening catalyst
01/18/2007CA2614694A1 Powder paint composition
01/17/2007EP1743004A2 Near infrared radiation curable powder coating composition having enhanced flow characteristics
01/17/2007EP1742974A2 Multi-modal vinyl ester resins
01/17/2007CN1898291A Curable resin composition, overcoats, and process for formation thereof
01/17/2007CN1898223A Epoxy compound and epoxy resin cured product obtained by curing the epoxy compound
01/16/2007US7163986 Applying to substrate; low temperature curing; solvent resistance, bonding strength to copper substrate, durability
01/16/2007US7163973 Molding material epoxy resins for composites formed by molding for electronics
01/11/2007WO2007005280A2 Molding composition and method, and molded article
01/11/2007WO2007004334A1 Photosensitive resin composition
01/11/2007WO2007004317A1 Toner, and toner production process
01/11/2007WO2007004184A1 Solid thermally expansible material
01/11/2007WO2007003650A1 Low-temperature impact resistant thermosetting epoxide resin compositions with solid epoxide resins
01/11/2007US20070010636 Latent hardener
01/11/2007US20070010601 Having cation and silicate anion moieties; flowability in presence of large quantities of filler; rapid curing; storage stability; reliable, heat resistant encapsulation; solder cracking and moisture resistance devices
01/11/2007US20070009742 Corrosion and alkali-resistant compositions and methods for using the same
01/11/2007US20070007692 Curable compositions for advanced processes, and products made therefrom
01/11/2007CA2635031A1 Low-temperature impact resistant thermosetting epoxide resin compositions with solid epoxide resins
01/11/2007CA2613762A1 Solid thermally expansible material
01/10/2007EP1741734A1 Heat curable epoxy resin composition having low temperature impact strength comprising solid epoxy resins
01/10/2007EP1741006A2 Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same
01/10/2007EP1740635A1 Coating composition
01/10/2007EP1651699B1 Epichlorohydrin amine polymers used for treating the surface of leather
01/10/2007EP1454936B1 Epoxy resin compositions for fiber-reinforced composite materials, process for production of the materials and fiber-reinforced composite materials
01/10/2007EP1328529B1 Well-defined nanosized building blocks for organic/inorganic nanocomposites
01/10/2007CN1894291A Radiation-curable inks for flexographic and screen-printing applications from multifunctional acrylate oligomers
01/10/2007CN1294218C Metal containers
01/10/2007CN1294200C Low gloss ASA resin
01/09/2007US7162110 Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator
01/09/2007CA2353736C Viscous and amine-cured chemical anchoring adhesive
01/09/2007CA2252816C Coating composition consisting of at least 3 components
01/04/2007WO2007002913A1 Oligomeric amidoamines or amidoquats for fabric or hair treatment compositions
01/04/2007WO2007002023A2 Isotactic specific catalyst for direct production of highly isotactic poly (propylene oxide) or highly isotactic poly (butylene oxide)
01/04/2007WO2007001803A2 Cure catalyst, composition, electronic device and associated method
01/04/2007WO2006068702A3 Environmentally friendly demulsifiers for crude oil emulsions
01/04/2007US20070004901 Chemical process
01/04/2007US20070004874 Polymer and epoxy resin compositions
01/04/2007US20070004816 Photocurable resin composition
01/04/2007US20070003767 Hardeners for coating compositions (IV)
01/04/2007US20070003766 Hardeners for coating compositions (III)
01/04/2007DE10001228B4 Polymerisierbare Zubereitungen auf der Basis von siliziumhaltigen Epoxiden Polymerizable compositions on the basis of silicon-containing epoxides
01/03/2007EP1739116A1 Hollow resin fine particles, organic/inorganic hybrid fine particles, and method for producing hollow resin fine articles
01/03/2007EP1739112A1 Flame retardant epoxy resin composition and semiconductor device using the same
01/03/2007EP1454956B1 Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials
01/03/2007EP1453864B1 Method for obtaining coating compositions having reduced voc
01/03/2007EP1142923B1 Flame-retardant epoxy resin composition and semiconductor device made using the same
01/03/2007CN1890286A Thermosetting resin composition, resin sheet and resin sheet for insulated substrate
01/03/2007CN1890285A Encapsulant mixture having a polymer bound catalyst
01/03/2007CN1293116C Photocurable/thermoseting composition for forming matte film
01/03/2007CN1293115C Method for preparing epoxy resin in use for light solidified coating material
01/02/2007US7157549 Devoid of any Lewis acids and Lewis bases as additives
01/02/2007US7157529 Multi-layered macromolecules and methods for their use
12/2006
12/28/2006WO2006138637A1 Curcumin and curcuminoid compounds, and use thereof as photosensitizers of onium salts
12/28/2006WO2006137260A1 Polymerizable composition, ink composition, image-forming method, inkjet recorder, and alicyclic epoxide
12/28/2006WO2006137257A1 Colored alkali-developable photosensitive resin composition and color filters made by using the same
12/28/2006WO2006136261A1 Continuous polymer-analogous reaction of reactive silane monomers with functionalised polymers
12/28/2006WO2006074394A3 Heat activated sealants and foamed materials
12/28/2006WO2005100431A3 Polycarboxy-functionalized prepolymers
12/28/2006US20060293501 Isotactic specific catalyst for direct production of highly isotactic poly (propylene oxide) or Highly isotactic poly (butylene Oxide)
12/28/2006US20060293466 Methods for synthesis of graft polymers
12/28/2006US20060292701 Photocrosslinked hydrogel blend surface coatings
12/28/2006DE102005029792A1 Hardening agent, useful for an aqueous or solvent-free epoxy resin dispersion, comprises a polyepoxide compound and an amine
12/28/2006DE102005029146A1 Hardeners for water based floor coating composition is obtained by reacting an epoxy intermediate with a polyamine to form intermediate, while allowing primary amino groups to react off; and reacting intermediate with specific Lewis acid
12/28/2006DE102005029145A1 New hardeners, obtainable by reacting a mixture of e.g. an epoxidized aromatic hydroxy compound with polyamine, and with monofunctional epoxy compounds, useful for water-based epoxy resin systems
12/28/2006DE102005029144A1 Hardener for water-based epoxy resin, e.g. floor coating material, obtained by reacting epoxides and bisphenols together, reacting with a polyamine and then reacting with a carbonyl compound
12/28/2006DE102005029143A1 Hardener for water-based epoxy resin, e.g. floor coating material, obtained by reacting epoxides and phenolic compounds together, reacting with polyamine and then with unsaturated carbonyl compound or nitrile
12/27/2006EP1736500A1 Composition for sealing optical semiconductor, optical semiconductor sealing material, and method for producing composition for sealing optical semiconductor
12/27/2006EP1736496A1 Curing agent for coating compositions (III)
12/27/2006EP1736495A1 Curing agent for coating compositions (IV)
12/27/2006EP1736494A1 Curing agent for coatings
12/27/2006EP1736493A1 Curing agent for coating compositions (II)