| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 04/11/2007 | EP1200533B1 Method of producing a laminated structure |
| 04/11/2007 | CN1946780A Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, sheet of fiber-reinforced composite material and cabinet for electrical/electronic equipment |
| 04/11/2007 | CN1946528A Heat-curable molding material pellet having multilayer structure |
| 04/11/2007 | CN1944527A Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing same |
| 04/11/2007 | CN1944487A Preparing method for epoxy resin active diluent of low organic chlorine content |
| 04/11/2007 | CN1309787C Energy-ray curing resin composition |
| 04/11/2007 | CN1309786C Thermosetting resin composition and laminates and circuit board substrates made by same |
| 04/11/2007 | CN1309784C Resin composition and rheostat |
| 04/10/2007 | US7202359 Azaoxa heterocyclic compound and method of preparing the same |
| 04/10/2007 | US7202311 Phosphine oxide hydroxyarl mixtures with novolac resins for co-curing epoxy resins |
| 04/10/2007 | US7202286 UV-curable compositions |
| 04/10/2007 | US7201957 halogen-free; for printed circuits; mixture containing benzoguanamine-phenol-formaldehyde terpolymer |
| 04/10/2007 | CA2268832C Optical guide |
| 04/10/2007 | CA2200339C Increasing the molecular weight of polycondensates |
| 04/05/2007 | WO2007038674A1 Braid-reinforced composites and processes for their preparation |
| 04/05/2007 | WO2007037500A1 Epoxy resin composition and semiconductor device |
| 04/05/2007 | WO2007037434A1 Resin composition for optical three-dimensional molded object |
| 04/05/2007 | WO2007037378A1 High-stability microencapsulated hardener for epoxy resin and epoxy resin composition |
| 04/05/2007 | WO2007037024A1 Process for producing latent catalyst and epoxy resin composition |
| 04/05/2007 | WO2007036194A1 Epoxide resin system and moulding material produced from said epoxide resin system and opto-electronic component with said moulding material |
| 04/05/2007 | US20070078254 Optical material and optical element |
| 04/05/2007 | US20070078236 Reactive thermosetting system with long storage life |
| 04/05/2007 | US20070077431 Multi-layered macromolecules and methods for their use |
| 04/05/2007 | US20070074896 Thermosetting resin composition, laminated body using it, and circuit board |
| 04/05/2007 | DE112005001011T5 Wärmehärtender Pulverüberzug und Verfahren zu dessen Herstellung Thermosetting powder coating and process for its production |
| 04/05/2007 | CA2625794A1 High-stability microencapsulated hardener for epoxy resin and epoxy resin composition |
| 04/05/2007 | CA2623631A1 Epoxy based oil free root canal sealer |
| 04/04/2007 | EP1770108A1 Epoxy resin, epoxy resin composition, and cured product thereof |
| 04/04/2007 | EP1769032A1 Amine compositions |
| 04/04/2007 | EP1670860B1 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability |
| 04/04/2007 | EP1275674B1 Epoxy resin composition and prepreg made with the epoxy resin composition |
| 04/04/2007 | CN1942515A Low heat release and low smoke reinforcing fiber/epoxy composites |
| 04/04/2007 | CN1942508A Optical refractive index-modifying polymer composition, hologram recording material and method of controlling refractive index |
| 04/04/2007 | CN1942502A Epoxy resin composition |
| 04/04/2007 | CN1939251A Teeth repairing material of visible-light curing composite nano-resin and its production |
| 04/04/2007 | CN1308376C Novel sulfurized phenolic resin, process for producing the same, phenol derivative having thioether structure or disulfide structure, process for producing the same, and epoxy resin composition and ad |
| 04/04/2007 | CN1308365C Production of Redix with siloxane structural unit |
| 04/03/2007 | CA2253170C A one-component, low temperature curable coating powder |
| 03/29/2007 | WO2007034914A1 Photoradial- and photocation-curable composition |
| 03/29/2007 | WO2007034713A1 Epoxy resin composition |
| 03/29/2007 | WO2007034679A1 Resin composition for radiation curing and prepreg |
| 03/29/2007 | US20070073009 Hardeners for coating compositions (II) |
| 03/28/2007 | EP1765907A1 Curable compositions with an improved adhesion performance |
| 03/28/2007 | EP1765906A1 Curing agents for epoxy resins |
| 03/28/2007 | EP1765905A2 Flexible, impact resistant primer |
| 03/28/2007 | CN1938366A Hollow resin fine particles, organic/inorganic hybrid fine particles, and method for producing hollow resin fine articles |
| 03/28/2007 | CN1938358A Resin composition, metal foil with resin, insulating sheet with base material and multilayer printed wiring board |
| 03/28/2007 | CN1938357A Thermosetting resin composition, laminated body using it, and circuit board |
| 03/28/2007 | CN1938356A Hardenable composition |
| 03/28/2007 | CN1938355A Coating composition based on modified epoxy resins |
| 03/28/2007 | CN1935870A Process for synthesizing low-styrene-content high-temperature-resistance epoxy vinyl ester resin |
| 03/28/2007 | CN1307701C Dual cured B-stageable underfill for wafer level |
| 03/27/2007 | US7196141 Polymer and epoxy resin compositions |
| 03/27/2007 | US7196124 Elastomeric material compositions obtained from castor oil and epoxidized soybean oil |
| 03/27/2007 | US7195858 Negative type photosensitive resin composition containing a phenol-biphenylene resin |
| 03/27/2007 | US7195731 Method for preparing and processing a sample for intensive analysis |
| 03/22/2007 | WO2007032326A1 Photosensitive resin composition and cured object obtained therefrom |
| 03/22/2007 | WO2007032109A1 Photosetting composition, photosetting ink composition and printing method and composition for resists using the same |
| 03/22/2007 | US20070066755 Electrically conductive polymer compositions |
| 03/22/2007 | US20070066721 Heat-curable compositions comprising low-temperature impact strength modifiers |
| 03/22/2007 | US20070066699 photocurable polyisobutene or polyoxypropylene glycol endcapped with epoxy group-containing silicon compound or copolymerized with polysiloxanes; excellent curability by irradiation of a light energy source within a short time, no need moisture and heating; as adhesive, sealant; storage stability |
| 03/22/2007 | US20070065669 Curable alkanolamine-containing epoxy powder coating composition |
| 03/21/2007 | EP1764382A1 Dual cure compositions, methods of curing thereof and articles therefrom |
| 03/21/2007 | EP1668086B1 Low-cure powder coatings and methods for using the same |
| 03/21/2007 | EP1020456B1 Polyhydric phenols, epoxy resins, epoxy resin composition, and cured products thereof |
| 03/21/2007 | CN1934190A Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices |
| 03/21/2007 | CN1934158A One-component epoxy resin composition |
| 03/21/2007 | CN1934157A 环氧树脂组合物和半导体装置 Epoxy resin composition and a semiconductor device |
| 03/21/2007 | CN1934156A 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device |
| 03/21/2007 | CN1934098A High-purity alicyclic epoxy compound, process for producing the same, curable epoxy resin composition, cured article thereof, and use |
| 03/21/2007 | CN1931890A Synthesis process of epoxy resin with anionic catalyst |
| 03/21/2007 | CN1931889A Modified solid imidazole curing agent and its modification process |
| 03/21/2007 | CN1305991C Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator |
| 03/21/2007 | CN1305960C Optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
| 03/20/2007 | US7192991 Polyvinyl/vinylidene ethers, onium salt photoinitiator, and encapsulated, crystallizable polymer-bound base (amines, imidazoles); heat resistance; corrosion resistance |
| 03/20/2007 | US7192984 Compositions of polyacids and polyethers and methods for their use as dermal fillers |
| 03/15/2007 | WO2007029598A1 Adamantane derivative, epoxy resin, and optical electronic member using resin composition comprising them |
| 03/15/2007 | WO2007029503A1 Epoxy resin composition |
| 03/15/2007 | WO2007029483A1 Photosensitive composition for volume hologram recording |
| 03/15/2007 | WO2007001803A3 Cure catalyst, composition, electronic device and associated method |
| 03/15/2007 | US20070060720 Epoxy resin composition |
| 03/15/2007 | US20070060682 Actinic radiation-curable stereolithographic resin composition having improved stability |
| 03/15/2007 | US20070060663 Photocurable composition, photocurable ink composition, printing method and resist composition using the same |
| 03/15/2007 | US20070060662 Polymerisation initiator system |
| 03/14/2007 | EP1763070A1 Adhesive sheet for both dicing and die bonding and semiconductor device manufacturing method using the adhesive sheet |
| 03/14/2007 | EP1762582A1 Epoxy resin composition |
| 03/14/2007 | EP1761586A1 Active energy ray-curable organopolysiloxane resin composition, optical transmission component, and manufacturing method thereof |
| 03/14/2007 | EP1761581A1 Curing agents for epoxy resins |
| 03/14/2007 | EP1590392A4 Epoxy resin curing compositions and epoxy resin compositions including same |
| 03/14/2007 | EP1470175B1 Oligomeric chain extenders for processing, post-processing and recycling of condensation polymers, synthesis, compositions and applications |
| 03/14/2007 | CN1930213A Oxetane compound and hardenable composition containing the same |
| 03/14/2007 | CN1930206A Epoxy adhesive composition |
| 03/14/2007 | CN1929850A Purified polyoxypropylene/polyoxyethylene copolymers and method of preparing the same |
| 03/14/2007 | CN1304501C Jettable compositions |
| 03/13/2007 | US7189770 Using amine , ketone, ketimine and water curing agents for polyurethanes |
| 03/13/2007 | US7189307 Fibrous sheet such as paper towel with topically applied crosslinked binder of an epoxy-functional polymer such as an epichlorohydrin-methyldiallylamine copolymer and a carboxylated ethylene-vinyl acetate copolymer; improved strength; formaldehyde-free curing |
| 03/13/2007 | CA2347426C Bismuth oxide catalyst for cathodic electrocoating compositions |
| 03/13/2007 | CA2211628C Liquid, radiation-curable composition, especially for stereolithography |
| 03/09/2007 | CA2559292A1 Low viscosity polymer polyols characterized by a high hydroxyl number |
| 03/08/2007 | WO2007026553A1 Low softening point phenol novolac resin, method for producing same, and epoxy resin cured product using same |