Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
04/2008
04/03/2008US20080081883 reacting dehydromucic acid with polyepoxides, in the presence of polymerization catalysts, to form curable polyesterether copolymers, used as coatings particularly for those providing corrosion resistance and flame resistance
04/02/2008EP1906242A1 Photosensitive resin composition
04/02/2008EP1905792A1 Actinic-energy-ray-curable resin composition for plastic film and plastic label
04/02/2008EP1566394B1 PROCESSES FOR PRODUCIng FIBER-REINFORCED COMPOSITE MATERIAL
04/02/2008CN101155884A Film-forming compositions derived from acyclic carbonates and polyamines
04/02/2008CN101155854A Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic compo
04/02/2008CN101153212A Set of resin compositions for preparing system-in-package type semiconductor device
04/01/2008US7352069 Electronic component unit
04/01/2008US7351784 Chip-packaging composition of resin and cycloaliphatic amine hardener
04/01/2008US7351783 Non-aromatic epoxy resin, a polysiloxane and an epoxysilane; anti-corrosive effect
04/01/2008CA2514994C Epoxy resin composition
04/01/2008CA2269378C Curable resin composition
03/2008
03/27/2008WO2008036721A1 Low temperature, moisture curable coating compositions and related methods
03/27/2008WO2008035605A1 Thermally polymerizable resin composition
03/27/2008WO2008035515A1 Liquid epoxy resin composition and epoxy resin cured product
03/27/2008WO2008035404A1 Linear (meth)acryloyl-containing compound, star (meth)acryloyl-containing compound and process for producing them
03/27/2008WO2008034753A1 Catalytic low temperature polymerization
03/27/2008WO2007107192A3 Paint composition, in particular anti-corrosive paint for rare earth permanent magnets
03/27/2008US20080076900 Epoxy Resin Composition for Optical Semiconductor Encapsulation
03/27/2008US20080073029 Bisphenol-A diglycidyl ether, bisphenol-F diglycidyl ether, or bisphenol-A/F diglycidyl ether as liquid epoxy resins; epoxy adduct of a dicarboxylic acid and a diglycidyl ether; a urea derivative (reaction product of diphenylmethane diisocyanate/p, p*-/ and butylamine) as thixotropic agent; curing agent
03/27/2008DE102006042095A1 Basismaterial für fotostrukturierbare Resists und Dielektrika Base material for photo-patternable resist and dielectrics
03/27/2008CA2663815A1 Low temperature, moisture curable coating compositions and related methods
03/26/2008EP1902106A1 Primer compositions for adhesive bonding systems
03/26/2008EP1902105A2 Powder paint composition
03/26/2008EP1902083A1 Oligomeric amidoamines or amidoquats for fabric or hair treatment compositions
03/26/2008EP1838776B1 Fire-retardant low-density epoxy composition
03/26/2008EP1819503B1 Continuous pultrusion process for producing high performance structural profiles
03/26/2008EP1730592A4 Permanent resist composition, cured product thereof, and use thereof
03/26/2008EP1550678B1 Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same
03/26/2008CN101151294A Epoxy resin composition
03/25/2008US7348392 Silicone modified acrylics and epoxies
03/25/2008US7348072 Light-emitting polymer and organoelectroluminescent display using the same
03/20/2008WO2008032850A1 Photopolymerizable composition
03/20/2008WO2008032704A1 One-component epoxy resin composition and motor or electric generator utilizing the same
03/20/2008WO2008032383A1 Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board
03/19/2008EP1900774A1 Hardenable resin composition
03/19/2008EP1899768A1 Toner, and toner production process
03/19/2008CN101147210A Electroconductive joining material and electric or electronic device using the same
03/19/2008CN101147085A Inkjet ink composition for color filter, process for producing color filter, and color filter
03/19/2008CN101143919A Method for synthesizing alicyclic epoxy resin by catalyzing unsaturated alicyclic compound
03/19/2008CN100376023C Electronic component unit
03/19/2008CN100375757C Organic titanium epoxy resin catalytic ester cyanate system
03/18/2008US7345140 Phenol-reacted non-ester alicyclic diepoxides
03/18/2008US7345102 mixture of epoxy resins, curing agent and flame retarders used as seals for light emitting diodes; reliability and transparency within a broad temperature range
03/18/2008US7344731 Rigid gas permeable lens material
03/18/2008CA2432296C Organic carboxylate composition, method for producing the same, and additive for epoxy resin
03/18/2008CA2335229C Polycationic polymer salts, their production and use
03/18/2008CA2215503C Thermosetting composition, its uses and a flexible, unfoldable preform containing this composition
03/13/2008WO2008028827A2 Base material for photostructureable resists and dielectrics
03/13/2008WO2007146604A3 Solvent-borne coating compositions, related coating methods and coated substrates
03/13/2008US20080064850 Dispersing acrylic resin solution containing polyglycidyl acrylate, acrylic-isocyanate containing monomer, and carboxylic group- or carboxylic anhydride group-containing compound as curing agent, with organic solvent into solution containing water-soluble polymer, removing the solvent, then solidifying
03/13/2008US20080064780 cationically curable component having epoxy group containing component; oxetane group containing component, multifunctional acrylate and a radical photoinitiator and a cationic photoinitiator; use in stereolithography; flexibility, elongation, tensile strength, curl resistance, water resistance
03/13/2008US20080063955 Flame retardancy; halogen free; curing shrinkage and solder resistance; resin comprised of linear polymer containing ethylenic unsaturated compound with carboxyl groups, multifunctional ethylenic unsaturated monomers, photopolymerization initiator and phosphorated epoxy resin
03/12/2008EP1896523A1 Continuous polymer-analogous reaction of reactive silane monomers with functionalised polymers
03/12/2008EP1896519A2 Resin compositions with high thermoplastic loading
03/12/2008EP1440111B1 Hardenable cyanate compositions
03/12/2008CN101142528A Photosensitive resin composition, printed wiring board, and semiconductor package substrate
03/12/2008CN101142253A Epoxy resin, epoxy resin composition, and utilizing the same, prepreg and laminated plate
03/12/2008CN101142222A Organotrisiloxane, preparation and use in curable resin composition
03/12/2008CN101139431A Method for manufacturing novel environment-protection epoxy resin
03/12/2008CN100374618C Surface treated steel sheet having excellent white rust resistance, and production method therefor
03/11/2008US7342077 Star polymer reaction product of a functionalized, chain-stopping monomer, a first compound, and a highly-branched, polyfunctional core; use in clear coats; made without using complicated Atom Transfer Radical Polymerization (ATRP) or Reversible Addition-Fragmentation Chain Transfer (RAFT) methods
03/06/2008WO2008026397A1 Radiation-sensitive insulation resin composition, cured article, and electronic device
03/06/2008WO2007123854A3 Method of repairing small coating defects
03/06/2008US20080057314 Low Heat Release and Low Smoke Reinforcing Fiber/Epoxy Composites
03/06/2008DE102006040471A1 se of an epoxy-functional adduct prepared from triglycidyl iscyanurate or triglycidyl trimellitate as a crosslinker or hardener for carboxy-functional polyesters suitable for producing powder coatings
03/05/2008EP1894972A2 Photosensitive resin composition for flexible circuit board and flexible circuit board using the same
03/05/2008EP1095313B1 Photopolymerizable thermosetting resin compositions
03/05/2008CN101137620A Base multiplying agents and base-reactive curable compositions
03/05/2008CN101134806A Method for preparing aqueous epoxy resin hardener
03/05/2008CN100372833C Aryl sulfonium salt, polymerizable composition and polymerization method of the same
03/04/2008US7338993 Flame-retardant molding compositions
03/04/2008US7338989 Epoxy resin as binder; polyamine as curing agent; powder coating; wear resistance
02/2008
02/28/2008US20080051553 Thermally curable compositions and method
02/28/2008US20080051550 Novel sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition adhesive
02/28/2008US20080051549 Diluent free epoxy resin formulation
02/28/2008US20080051523 Low-cure powder coatings and methods for using the same
02/28/2008US20080047462 Comb-Like Polyetheralkanolamines In Inks
02/27/2008CN101133363A Colored alkali-developable photosensitive resin composition and color filters made by using the same
02/27/2008CN101133097A Hardening accelerator, hardenable resin composition, and electronic component device
02/26/2008US7335782 Thioxanthone derivatives, and their use as cationic photoinitiators
02/26/2008CA2219878C Aqueous coating composition
02/21/2008WO2008020594A1 Modified liquid epoxy resin, epoxy resin composition using the same, and cured product thereof
02/21/2008WO2007149377A3 Epoxy adhesive composition and use thereof
02/21/2008US20080045670 Epoxy Adhesive Composition
02/21/2008US20080044737 Data storage medium comprising colloidal metal and preparation process thereof
02/21/2008US20080044667 Modified Phenolic Resin, Epoxy Resin Composition Containing the Same, and Prepreg Containing the Composition
02/21/2008US20080044660 Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards
02/20/2008EP1890352A1 Fuel cell separator composition, fuel cell separator, and method for producing the same
02/20/2008EP1889862A1 Curable resin composition, process for producing the same, and coated object made with the same
02/20/2008EP1149130B1 Acrylic terpolymer for the use as a self-fixturing adhesive
02/20/2008CN101128512A Process for production of branched polyether resin composition and process for production of acid pendant type branched polyether resin composition
02/20/2008CN101128505A Epoxy resin composition, cured object obtained therefrom, semiconductor-encapsulating material, novel phenolic resin, and novel epoxy resin
02/20/2008CN101128504A Coating system
02/20/2008CN101128503A Two-component epoxy adhesive composition
02/20/2008CN101128502A Latent hardener for epoxy resin and epoxy resin composition
02/20/2008CN101128501A Epoxy resin, solidifiable resin composition containing epoxy resin and use thereof
02/20/2008CN100369949C High temperature -resistant 4,5-epoxy cyclohexane-1,2-diglycidyl-m-phthalate epoxy resins and process for preparing same
02/19/2008US7332557 Epoxy resin, epoxy resin composition thereof and cured product thereof
02/19/2008US7332249 Holographic storage medium comprising polyfunctional epoxy monomers capable of undergoing cationic polymerization
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