Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
---|
04/03/2008 | US20080081883 reacting dehydromucic acid with polyepoxides, in the presence of polymerization catalysts, to form curable polyesterether copolymers, used as coatings particularly for those providing corrosion resistance and flame resistance |
04/02/2008 | EP1906242A1 Photosensitive resin composition |
04/02/2008 | EP1905792A1 Actinic-energy-ray-curable resin composition for plastic film and plastic label |
04/02/2008 | EP1566394B1 PROCESSES FOR PRODUCIng FIBER-REINFORCED COMPOSITE MATERIAL |
04/02/2008 | CN101155884A Film-forming compositions derived from acyclic carbonates and polyamines |
04/02/2008 | CN101155854A Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic compo |
04/02/2008 | CN101153212A Set of resin compositions for preparing system-in-package type semiconductor device |
04/01/2008 | US7352069 Electronic component unit |
04/01/2008 | US7351784 Chip-packaging composition of resin and cycloaliphatic amine hardener |
04/01/2008 | US7351783 Non-aromatic epoxy resin, a polysiloxane and an epoxysilane; anti-corrosive effect |
04/01/2008 | CA2514994C Epoxy resin composition |
04/01/2008 | CA2269378C Curable resin composition |
03/27/2008 | WO2008036721A1 Low temperature, moisture curable coating compositions and related methods |
03/27/2008 | WO2008035605A1 Thermally polymerizable resin composition |
03/27/2008 | WO2008035515A1 Liquid epoxy resin composition and epoxy resin cured product |
03/27/2008 | WO2008035404A1 Linear (meth)acryloyl-containing compound, star (meth)acryloyl-containing compound and process for producing them |
03/27/2008 | WO2008034753A1 Catalytic low temperature polymerization |
03/27/2008 | WO2007107192A3 Paint composition, in particular anti-corrosive paint for rare earth permanent magnets |
03/27/2008 | US20080076900 Epoxy Resin Composition for Optical Semiconductor Encapsulation |
03/27/2008 | US20080073029 Bisphenol-A diglycidyl ether, bisphenol-F diglycidyl ether, or bisphenol-A/F diglycidyl ether as liquid epoxy resins; epoxy adduct of a dicarboxylic acid and a diglycidyl ether; a urea derivative (reaction product of diphenylmethane diisocyanate/p, p*-/ and butylamine) as thixotropic agent; curing agent |
03/27/2008 | DE102006042095A1 Basismaterial für fotostrukturierbare Resists und Dielektrika Base material for photo-patternable resist and dielectrics |
03/27/2008 | CA2663815A1 Low temperature, moisture curable coating compositions and related methods |
03/26/2008 | EP1902106A1 Primer compositions for adhesive bonding systems |
03/26/2008 | EP1902105A2 Powder paint composition |
03/26/2008 | EP1902083A1 Oligomeric amidoamines or amidoquats for fabric or hair treatment compositions |
03/26/2008 | EP1838776B1 Fire-retardant low-density epoxy composition |
03/26/2008 | EP1819503B1 Continuous pultrusion process for producing high performance structural profiles |
03/26/2008 | EP1730592A4 Permanent resist composition, cured product thereof, and use thereof |
03/26/2008 | EP1550678B1 Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
03/26/2008 | CN101151294A Epoxy resin composition |
03/25/2008 | US7348392 Silicone modified acrylics and epoxies |
03/25/2008 | US7348072 Light-emitting polymer and organoelectroluminescent display using the same |
03/20/2008 | WO2008032850A1 Photopolymerizable composition |
03/20/2008 | WO2008032704A1 One-component epoxy resin composition and motor or electric generator utilizing the same |
03/20/2008 | WO2008032383A1 Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board |
03/19/2008 | EP1900774A1 Hardenable resin composition |
03/19/2008 | EP1899768A1 Toner, and toner production process |
03/19/2008 | CN101147210A Electroconductive joining material and electric or electronic device using the same |
03/19/2008 | CN101147085A Inkjet ink composition for color filter, process for producing color filter, and color filter |
03/19/2008 | CN101143919A Method for synthesizing alicyclic epoxy resin by catalyzing unsaturated alicyclic compound |
03/19/2008 | CN100376023C Electronic component unit |
03/19/2008 | CN100375757C Organic titanium epoxy resin catalytic ester cyanate system |
03/18/2008 | US7345140 Phenol-reacted non-ester alicyclic diepoxides |
03/18/2008 | US7345102 mixture of epoxy resins, curing agent and flame retarders used as seals for light emitting diodes; reliability and transparency within a broad temperature range |
03/18/2008 | US7344731 Rigid gas permeable lens material |
03/18/2008 | CA2432296C Organic carboxylate composition, method for producing the same, and additive for epoxy resin |
03/18/2008 | CA2335229C Polycationic polymer salts, their production and use |
03/18/2008 | CA2215503C Thermosetting composition, its uses and a flexible, unfoldable preform containing this composition |
03/13/2008 | WO2008028827A2 Base material for photostructureable resists and dielectrics |
03/13/2008 | WO2007146604A3 Solvent-borne coating compositions, related coating methods and coated substrates |
03/13/2008 | US20080064850 Dispersing acrylic resin solution containing polyglycidyl acrylate, acrylic-isocyanate containing monomer, and carboxylic group- or carboxylic anhydride group-containing compound as curing agent, with organic solvent into solution containing water-soluble polymer, removing the solvent, then solidifying |
03/13/2008 | US20080064780 cationically curable component having epoxy group containing component; oxetane group containing component, multifunctional acrylate and a radical photoinitiator and a cationic photoinitiator; use in stereolithography; flexibility, elongation, tensile strength, curl resistance, water resistance |
03/13/2008 | US20080063955 Flame retardancy; halogen free; curing shrinkage and solder resistance; resin comprised of linear polymer containing ethylenic unsaturated compound with carboxyl groups, multifunctional ethylenic unsaturated monomers, photopolymerization initiator and phosphorated epoxy resin |
03/12/2008 | EP1896523A1 Continuous polymer-analogous reaction of reactive silane monomers with functionalised polymers |
03/12/2008 | EP1896519A2 Resin compositions with high thermoplastic loading |
03/12/2008 | EP1440111B1 Hardenable cyanate compositions |
03/12/2008 | CN101142528A Photosensitive resin composition, printed wiring board, and semiconductor package substrate |
03/12/2008 | CN101142253A Epoxy resin, epoxy resin composition, and utilizing the same, prepreg and laminated plate |
03/12/2008 | CN101142222A Organotrisiloxane, preparation and use in curable resin composition |
03/12/2008 | CN101139431A Method for manufacturing novel environment-protection epoxy resin |
03/12/2008 | CN100374618C Surface treated steel sheet having excellent white rust resistance, and production method therefor |
03/11/2008 | US7342077 Star polymer reaction product of a functionalized, chain-stopping monomer, a first compound, and a highly-branched, polyfunctional core; use in clear coats; made without using complicated Atom Transfer Radical Polymerization (ATRP) or Reversible Addition-Fragmentation Chain Transfer (RAFT) methods |
03/06/2008 | WO2008026397A1 Radiation-sensitive insulation resin composition, cured article, and electronic device |
03/06/2008 | WO2007123854A3 Method of repairing small coating defects |
03/06/2008 | US20080057314 Low Heat Release and Low Smoke Reinforcing Fiber/Epoxy Composites |
03/06/2008 | DE102006040471A1 se of an epoxy-functional adduct prepared from triglycidyl iscyanurate or triglycidyl trimellitate as a crosslinker or hardener for carboxy-functional polyesters suitable for producing powder coatings |
03/05/2008 | EP1894972A2 Photosensitive resin composition for flexible circuit board and flexible circuit board using the same |
03/05/2008 | EP1095313B1 Photopolymerizable thermosetting resin compositions |
03/05/2008 | CN101137620A Base multiplying agents and base-reactive curable compositions |
03/05/2008 | CN101134806A Method for preparing aqueous epoxy resin hardener |
03/05/2008 | CN100372833C Aryl sulfonium salt, polymerizable composition and polymerization method of the same |
03/04/2008 | US7338993 Flame-retardant molding compositions |
03/04/2008 | US7338989 Epoxy resin as binder; polyamine as curing agent; powder coating; wear resistance |
02/28/2008 | US20080051553 Thermally curable compositions and method |
02/28/2008 | US20080051550 Novel sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition adhesive |
02/28/2008 | US20080051549 Diluent free epoxy resin formulation |
02/28/2008 | US20080051523 Low-cure powder coatings and methods for using the same |
02/28/2008 | US20080047462 Comb-Like Polyetheralkanolamines In Inks |
02/27/2008 | CN101133363A Colored alkali-developable photosensitive resin composition and color filters made by using the same |
02/27/2008 | CN101133097A Hardening accelerator, hardenable resin composition, and electronic component device |
02/26/2008 | US7335782 Thioxanthone derivatives, and their use as cationic photoinitiators |
02/26/2008 | CA2219878C Aqueous coating composition |
02/21/2008 | WO2008020594A1 Modified liquid epoxy resin, epoxy resin composition using the same, and cured product thereof |
02/21/2008 | WO2007149377A3 Epoxy adhesive composition and use thereof |
02/21/2008 | US20080045670 Epoxy Adhesive Composition |
02/21/2008 | US20080044737 Data storage medium comprising colloidal metal and preparation process thereof |
02/21/2008 | US20080044667 Modified Phenolic Resin, Epoxy Resin Composition Containing the Same, and Prepreg Containing the Composition |
02/21/2008 | US20080044660 Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards |
02/20/2008 | EP1890352A1 Fuel cell separator composition, fuel cell separator, and method for producing the same |
02/20/2008 | EP1889862A1 Curable resin composition, process for producing the same, and coated object made with the same |
02/20/2008 | EP1149130B1 Acrylic terpolymer for the use as a self-fixturing adhesive |
02/20/2008 | CN101128512A Process for production of branched polyether resin composition and process for production of acid pendant type branched polyether resin composition |
02/20/2008 | CN101128505A Epoxy resin composition, cured object obtained therefrom, semiconductor-encapsulating material, novel phenolic resin, and novel epoxy resin |
02/20/2008 | CN101128504A Coating system |
02/20/2008 | CN101128503A Two-component epoxy adhesive composition |
02/20/2008 | CN101128502A Latent hardener for epoxy resin and epoxy resin composition |
02/20/2008 | CN101128501A Epoxy resin, solidifiable resin composition containing epoxy resin and use thereof |
02/20/2008 | CN100369949C High temperature -resistant 4,5-epoxy cyclohexane-1,2-diglycidyl-m-phthalate epoxy resins and process for preparing same |
02/19/2008 | US7332557 Epoxy resin, epoxy resin composition thereof and cured product thereof |
02/19/2008 | US7332249 Holographic storage medium comprising polyfunctional epoxy monomers capable of undergoing cationic polymerization |