| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 08/31/2006 | US20060194063 Alicyclic epoxy resins, their preparation process, their compositions, epoxy resin cured product, and uses of alicyclic epoxy resin compositions |
| 08/31/2006 | US20060194062 fibre composite impregnated with an epoxy resin matrix and comprising a benzylidenamine compound; an aliphatic or cycloaliphatic primary monoamine and/or disecondary diamine |
| 08/31/2006 | US20060194053 Comb copolymers with defined side chains and process for their manufacture |
| 08/31/2006 | DE102005012457B3 New oligomer and polymer containing epoxy and silane groups (obtained by reacting epoxy group containing low-molecular oligomer or polymer compound with a silane group) useful for preparing anhydrous hardenable mixture |
| 08/31/2006 | CA2599153A1 Epoxy resin, hardenable resin composition containing the same and use thereof |
| 08/30/2006 | EP1695990A1 Two-component epoxy adhesive composition |
| 08/30/2006 | EP1695989A1 Curable composition |
| 08/30/2006 | EP1694791A1 Cationically curable composition |
| 08/30/2006 | EP1490451B1 Activatable material |
| 08/30/2006 | EP1490450B1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| 08/30/2006 | CN1826372A Method for production of objects from thermosetting resins |
| 08/30/2006 | CN1826365A Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 08/30/2006 | CN1826361A Curable resin compound |
| 08/30/2006 | CN1272522C Chemical anchoring adhesive rope |
| 08/29/2006 | US7098295 Electroluminescent conjugated polymers containing phosphorescent moieties and the application thereof in led |
| 08/29/2006 | US7098276 Flame-retardant epoxy resin composition and semiconductor device made using the same |
| 08/29/2006 | US7098258 epoxy resin and a curing agent of cyclohexanetricarboxylic acid and/or an anhydride; adhesives, shaped articles, protective films of color filters, sealants for photoelectric transducers, blue LED and white LED; excellent curability without accelerators; colorless, transparent, heat resistant |
| 08/29/2006 | US7097958 Mixture of epoxy and phenolic resins, latent curing agents and photosensitive acid generator |
| 08/24/2006 | WO2006088230A1 Thermosetting composition for solder resist and cured product thereof |
| 08/24/2006 | WO2006088040A1 Cationically curable composition and cured product thereof |
| 08/24/2006 | WO2006087906A1 Novel curable resin, method for producing same, epoxy resin composition and electronic component device |
| 08/24/2006 | WO2006087111A1 Low shrinkage amine-curing epoxy resin compositions comprising a lactone |
| 08/24/2006 | US20060189778 Silicone modified polyurea |
| 08/24/2006 | US20060189721 retarding the curing of the epoxy resin by adjusting an amount of the retarder while curing in presence of a curing accelerator cation phosphorus compound; used for semiconductor encapsulation; providing latency; storage stability; resist to soldering without forming cracks by the soldering |
| 08/24/2006 | US20060189160 Method for producing a pattern formation mold |
| 08/24/2006 | US20060188820 Photosensitive resin composition and method of forming a pattern using the composition |
| 08/23/2006 | EP1693395A1 Thermosetting resin composition, resin sheet and resin sheet for insulated substrate |
| 08/23/2006 | EP1692225A1 Polymer composition for encapsulating a chemical agent comprising an oxirane composition |
| 08/23/2006 | EP1692197A2 Radiation-curable inks for flexographic and screen-printing applications from multifunctional acrylate oligomers |
| 08/23/2006 | EP1578838B1 Thermally cuarble epoxy resin composition having an improved impact resistance at low temperatures |
| 08/23/2006 | EP1157057B1 Accelerators useful for energy polymerizable compositions |
| 08/23/2006 | CN1823556A Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them |
| 08/23/2006 | CN1823050A Epoxy-capped polythioethers |
| 08/23/2006 | CN1821876A Solder resist ink composition |
| 08/23/2006 | CN1271114C Oxalkylation products produced from expoxides and amines and their use in pigment preparations |
| 08/23/2006 | CN1271025C Process for producing fluorene derivative |
| 08/22/2006 | US7094845 Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same |
| 08/22/2006 | US7094844 Waterproof, heat resistance, shockproof; undercoating for semiconductor, flip chips |
| 08/22/2006 | US7094843 Containing a hydroxyl-containing aromatic compound, such as a phenol-formaldehyde condensate |
| 08/17/2006 | WO2006085485A1 Ring-opening polymerization method and activated carbon catalyst for ring-opening polymerization |
| 08/17/2006 | WO2006085421A1 Oxetane compound and hardenable composition containing the same |
| 08/16/2006 | EP1689816A1 Curable silicone composition and cured product thereof |
| 08/16/2006 | EP1689800A1 Flame retardant radiation curable compositions |
| 08/16/2006 | EP1341859B1 Stone impact protection primer, method for producing the same and use thereof |
| 08/16/2006 | CN1817936A High-temperature-resistant bisphenolA-glycidol ether epoxy resin system and production thereof |
| 08/16/2006 | CN1269921C Settability resin combination and use thereof |
| 08/15/2006 | US7091308 Chain extended dendritic polyether |
| 08/15/2006 | US7091286 Low-cure powder coatings and methods for using the same |
| 08/10/2006 | WO2006082776A1 Reactive polyurethane compound, method for producing same, resin composition and cured product thereof |
| 08/10/2006 | WO2006067927A8 Actinic ray curable composition, actinic ray curable ink, method of image forming therewith, inkjet recording apparatus and epoxy compound |
| 08/10/2006 | US20060178462 Maintain flexibility |
| 08/10/2006 | US20060178456 Surface improver for reinforced composite compositions |
| 08/10/2006 | US20060178454 Vinyl ether curing composition |
| 08/10/2006 | US20060178444 Dental composition based on silicone crosslinkable by cation process |
| 08/10/2006 | DE19756749B4 Dispersionen auf der Basis von Umsetzungsprodukten von Epoxidharzen und Alkylidenpolyphenolen, ihre Herstellung und Anwendung als Beschichtungsmaterial und Bindemittel für härtbare Mischungen Dispersions based on reaction products of epoxy resins and alkylidenepolyphenols, their preparation and application as a coating material and binder for curable mixtures of |
| 08/09/2006 | EP1687374A1 Organic fibre based on an epoxy resin and a rheology-controlling agent and corresponding dry goods |
| 08/09/2006 | EP1620485B1 Powdered epoxy composition |
| 08/09/2006 | EP1279709B1 Method of bonding adherend |
| 08/09/2006 | EP1273609B1 Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them |
| 08/09/2006 | CN1816581A 环氧树脂组合物 The epoxy resin composition |
| 08/09/2006 | CN1816580A Epoxy resin, process for producing the same, epoxy resin composition containing the same, and cured object |
| 08/09/2006 | CN1269198C Resin packaged semiconductor device and die bonding material and packaging material thereof |
| 08/09/2006 | CN1268664C Resin composition, composition for solder resist, and cured article obtained therefrom |
| 08/08/2006 | US7087702 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin |
| 08/08/2006 | US7087699 Reactive injection molding; polyurethanes; polythiourethanes; polyureas |
| 08/08/2006 | US7087684 Chemical intermediate of unsaturated ester and aminopolyalkylene oxide; reacting with epoxide |
| 08/08/2006 | US7087679 Heat resistant blends; radiation transparent, dimensional stability, impact strength; fluoropolymer blend |
| 08/08/2006 | US7087663 Adducts of epoxy resins and phosphorus-derived acids and a process for their preparation |
| 08/08/2006 | US7087146 Method for producing a multilayer coating and the use thereof |
| 08/08/2006 | CA2120416C Water-dilutable dispersions of acrylate copolymers |
| 08/03/2006 | WO2006080297A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 08/03/2006 | WO2006080270A1 Curing accelerator, curable resin composition, and electronic part/device |
| 08/03/2006 | US20060173101 Highly elastic epoxy resin composition |
| 08/03/2006 | US20060171916 water insoluble polyallylamine copolymer (hydrochloride) crosslinked with epichlorohydrin crosslinking agent; decreasing serum level of phosphate by binding phosphate in gastrointestinal tract, without increasing absorption of any clinically undesirable material, as calcium or aluminum; hyperphosphatemia |
| 08/02/2006 | EP1685193A2 Dual cure reaction products of self-photoinitiating multifunctional acrylates with cycloaliphatic epoxy compounds |
| 08/02/2006 | EP1685178A1 Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof |
| 08/02/2006 | EP1627017B1 Electric conductor provided with an adherent layer and method for the production of said electric conductor |
| 08/02/2006 | EP1525275B1 Base paints containing fatty acid-modified epoxy esters and/or fatty acid-modified alkyd resins, methods for the production thereof and their use |
| 08/02/2006 | CN1813346A Underfill and mold compounds including siloxane-based aromatic diamines |
| 08/02/2006 | CN1813003A Photocurable resin composition |
| 08/02/2006 | CN1810847A Improved epoxy acrylic ester and its prepn |
| 08/02/2006 | CN1810813A Phosphorus-containing bishydroxy compound, phosphorus-containing epoxy resin synthesized therewith, and their prepn process and application |
| 08/02/2006 | CN1267468C Amino composition and producing process thereof |
| 08/01/2006 | US7084492 Underfill and mold compounds including siloxane-based aromatic diamines |
| 08/01/2006 | US7084210 Vehicular reinforcement; polymethyl methacrylate viscosity enhancing agent; small voids and high Young's modulus |
| 08/01/2006 | US7084194 Heat resistance; flame retarders; adhesives; composites; laminated plates; printed circuits |
| 07/27/2006 | WO2006078062A1 Epoxy resin composition, method of rendering the same latent, and semiconductor device |
| 07/27/2006 | WO2006077887A1 Curable composition |
| 07/27/2006 | WO2006077886A1 Hardenable composition |
| 07/27/2006 | WO2006077862A1 Epoxy resin composition and optical material using same |
| 07/27/2006 | WO2006077771A1 Curable resin composition and interlayer insulating film |
| 07/27/2006 | WO2006077693A1 Polymerizable actinic radiation curable composition, polymerization method, actinic radiation curable ink and image formation method, and ink jet recording apparatus and epoxy compound |
| 07/27/2006 | WO2006077081A1 Composition containing a hydrogenated bisglycidyl ether and a cross-linking agent |
| 07/27/2006 | WO2006050128A3 Heterocyclical chromophore architectures |
| 07/27/2006 | US20060167197 Photosensitive compositions based on polycyclic polymers |
| 07/27/2006 | US20060167189 Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using the same |
| 07/27/2006 | US20060167155 Cathodic corrosion protection powder coating composition and method |
| 07/27/2006 | US20060166005 Resin layer-coated copper foil and multilayer printed wiring board obtained with the resin layered-coated copper foil |
| 07/26/2006 | EP1683816A1 Polyacrylic hydrazide and crosslinking or curing agent for resin |
| 07/26/2006 | EP1682599A1 Tougher cycloaliphatic epoxide resins |