| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 05/11/2006 | CA2584792A1 Heterocyclical chromophore architectures |
| 05/10/2006 | EP1655342A1 Curable composition |
| 05/10/2006 | CN1771460A Liquid crystal sealing agent and liquid crystalline display cell using the same |
| 05/10/2006 | CN1771290A Flame-retardant molding compositions |
| 05/10/2006 | CN1771275A Epoxy resin composition |
| 05/10/2006 | CN1771274A Resin composition for printed wiring board, prepreg, and laminate obtained with the same |
| 05/10/2006 | CN1771219A Novel phenol compound and novel epoxy resin derivable from such phenol compound |
| 05/10/2006 | CN1255449C Epoxy resin composition |
| 05/09/2006 | US7041771 Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering |
| 05/09/2006 | US7041749 Dual cure reaction products of self-photoinitiating multifunction acrylates with cycloaliphatic epoxy compounds |
| 05/09/2006 | US7041740 A thermosetting resin of epoxy , cyanate ester or bismaleimide-triazine, a curing agent and dissolved particules of a rigid-rod polyphenyl polymer (benzoyl-substitued 1,4-phenylene); heating to above the dissolution temperature and below the curing temperature; low pressure; high strenth; aircraft |
| 05/09/2006 | US7041399 Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| 05/04/2006 | WO2006046534A1 Heat-resistant composite material |
| 05/04/2006 | WO2006046440A1 Epoxy resin composition for sealing semiconductor and semiconductor device using the same |
| 05/04/2006 | WO2006046411A1 Actinic-light-curable composition, actinic-light-curable inkjet ink, method of forming image with the actinic-light-curable inkjet ink, and inkjet recording apparatus |
| 05/04/2006 | WO2006025928A3 Flexible, impact resistant primer |
| 05/04/2006 | WO2005123787A3 Method for obtaining coating compositions having reduced voc |
| 05/04/2006 | US20060094860 InSb nanoparticle |
| 05/04/2006 | US20060094848 Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same |
| 05/04/2006 | DE112004001165T5 Durch aktinische Strahlung härtbare stereolithographische Harzzusammensetzung mit verbesserter Stabilität The actinic-radiation-curable stereolithographic resin composition with improved stability |
| 05/03/2006 | EP1652869A1 Epoxy resin composition and method for producing heat-resistant laminate sheet |
| 05/03/2006 | EP1651731A1 Solventless, non-polluting radiation or thermally curable coatings |
| 05/03/2006 | EP1651700A1 Command-cure adhesives |
| 05/03/2006 | EP1651699A1 Epichlorohydrin amine polymers used for treating the surface of leather |
| 05/03/2006 | CN1768306A Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound |
| 05/03/2006 | CN1768112A Epoxy resin molding material for sealing use and semiconductor device |
| 05/03/2006 | CN1768089A Thermosetting resin composition, multilayer body using same, and circuit board |
| 05/03/2006 | CN1768086A Coloring resin composition, color filter, and liquid-crystal display |
| 05/03/2006 | CN1254507C Adhesive composition and adhesive sheet for semiconductor device |
| 05/03/2006 | CN1254506C Phenol resin composition and phenol resin copper-clad laminate |
| 05/02/2006 | US7037958 Epoxy coating |
| 05/02/2006 | US7037399 Epoxy resins |
| 04/27/2006 | WO2006043608A1 Polyepoxy compound, method for producing same, thermosetting resin composition containing same, cured product of such composition, and method for removing such cured product |
| 04/27/2006 | WO2006043524A1 Resin containing indole skeleton, epoxy resin containing indole skeleton, epoxy resin composition and cured product therefrom |
| 04/27/2006 | WO2006043454A1 Radiation curable resin, liquid crystal sealing material, and liquid crystal display cell using same |
| 04/27/2006 | WO2006043019A1 Fibre reinforced assembly |
| 04/27/2006 | US20060089466 Epoxy resin composition |
| 04/26/2006 | EP1650259A1 Vinyl ether curing composition |
| 04/26/2006 | EP1650248A1 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 04/26/2006 | EP1650247A1 Amines-epoxy compositions with high chemical resistance properties |
| 04/26/2006 | EP1650246A1 Alkoxylated epoxy-amine adduct and its use |
| 04/26/2006 | EP1648950A1 Thermohardening compositions comprising low-temperature impact strength modifiers |
| 04/26/2006 | EP1472300B1 Low voc vinylester resin and applications |
| 04/26/2006 | EP0770104B1 Increase in molecular weight of polycondensates |
| 04/26/2006 | CN1764692A Epoxy resin compositions containing mannich bases, suitable for high-temperature applications |
| 04/26/2006 | CN1763120A Oxyalkylated epoxide-amine adduct and its use |
| 04/25/2006 | US7034405 Blend of magnetic and silica powder in polymer; electromagnetic wave shield; enhancing dielectrics |
| 04/25/2006 | US7034404 Waterproofing; storage stability; blend of epoxy resin and phenolic resin, lacency curing agent and inorganic filler |
| 04/25/2006 | US7034089 Epoxy-functional hybrid copolymers |
| 04/25/2006 | US7033670 LCT-epoxy polymers with HTC-oligomers and method for making the same |
| 04/25/2006 | CA2127203C Epoxy acrylates |
| 04/20/2006 | WO2006040922A1 Composition for forming bottom anti-reflective coating containing aromatic sulfonic acid ester compound and light photoacid-generating agent |
| 04/20/2006 | US20060084786 Copolymers of tetrahydrofuran, ethylene oxide and an additional cyclic ether |
| 04/20/2006 | US20060084767 Silicone modified acrylics and epoxies |
| 04/20/2006 | US20060084723 Nanocomposites, method of production, and method of use |
| 04/20/2006 | CA2583916A1 Aging-resistant coatings and adhesive composites |
| 04/20/2006 | CA2582728A1 Aqueous epoxy resin systems |
| 04/20/2006 | CA2524012A1 Alkoxylated epoxide-amine adducts and their use |
| 04/19/2006 | EP1647584A1 Aqueous epoxy resin systems |
| 04/19/2006 | EP1647052A1 Underfill and mold compounds including siloxane-based aromatic diamines |
| 04/19/2006 | CN1761715A Mannich bases and method for the production of mannich bases |
| 04/19/2006 | CN1761714A Molding compositions containing quaternary organophosphonium salts |
| 04/19/2006 | CN1761692A Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
| 04/19/2006 | CN1761473A Heterobifunctional polymeric bioconjugates |
| 04/19/2006 | CN1760702A Thermosetting one-solution type composition for protective film of color filter and color filter using the same |
| 04/19/2006 | CN1252210C Connection material and connection structure body |
| 04/19/2006 | CN1252204C Method for adhering substrates using light activatable adhesive film |
| 04/19/2006 | CN1252177C Polymer and epoxy resin compsns |
| 04/19/2006 | CN1252118C Second-order non-linear optical polymer of isocyanate crosslinked epoxy resin |
| 04/19/2006 | CN1252110C Novolac aralkyl resin, its preparing method and composition containing said resin |
| 04/19/2006 | CN1252096C Phenol-novolacs with improved optical properties |
| 04/19/2006 | CN1252045C Process for synthesizing omega amine polyoxyvinyl |
| 04/18/2006 | US7030198 Curable compositions comprising an epoxidised unsaturated polyester and mineral fillers |
| 04/13/2006 | WO2006038530A1 Epoxy resin composition for optical semiconductor encapsulation |
| 04/13/2006 | US20060079592 Photo-curable coating composition for hard protective coat and coated article |
| 04/13/2006 | CA2581077A1 Epoxy resin composition for optical semiconductor encapsulation |
| 04/12/2006 | EP1644348A1 Epoxy-capped polythioethers |
| 04/12/2006 | EP0897405B2 Coating agent consisting of at least 3 components |
| 04/12/2006 | CN1759155A A conductive adhesive composition |
| 04/12/2006 | CN1759131A Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
| 04/12/2006 | CN1759130A Fluorocarbon-modified epoxy resin |
| 04/12/2006 | CN1250665C Impact-resistant epoxy resin compositions |
| 04/12/2006 | CN1250644C Active energy ray solidified resin composition for Fresnel lens and Fresnel lens rasher |
| 04/12/2006 | CN1250599C Epoxy resin compositions and semiconductor devices |
| 04/12/2006 | CN1250598C Modified epoxy resin by organic silicon and its electronic package material and preparation process thereof |
| 04/12/2006 | CN1250534C Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom |
| 04/11/2006 | US7026014 Overcoating with polymer containing epoxy groups |
| 04/11/2006 | CA2352396C Low temperature curing, sag-resistant epoxy primer |
| 04/06/2006 | WO2006035955A1 Curable diamantane compound |
| 04/06/2006 | WO2006035641A1 Modified epoxy resin composition |
| 04/06/2006 | US20060074203 producing the crosslinking composition by reacting an amino compound; a mono(alkylaldehyde) and/or a poly(alkylaldehyde), and an alcohol; and adding an organic compound; stabilized aminoplast-based crosslinking compositions |
| 04/06/2006 | US20060074199 Curable resin composition |
| 04/06/2006 | US20060074138 Road resistance to permanent deformation, fatigue cracking and thermal cracking is improved by use of the modified asphalt binder |
| 04/06/2006 | US20060073113 Polyalkylene glycol derivative and modified bio-related substance |
| 04/05/2006 | EP1642917A1 Epoxy resin composition |
| 04/05/2006 | CN1756816A Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby |
| 04/05/2006 | CN1756784A Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith |
| 04/05/2006 | CN1754913A Flame retardant compositions |
| 04/05/2006 | CN1249168C Semiconductor sealing resin composition, semiconductor device using same, and process for preparing semiconductor device |
| 04/05/2006 | CN1249161C Cast composite based on thermosetting epoxy resin |