Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
07/2006
07/26/2006EP1363922B1 Novel hydroxyaryl phosphine oxides mixture, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom
07/26/2006EP1246859B1 Polymerizable dental compositions based on epoxies that contain silicon
07/26/2006CN1807539A Resin composition for encapsulating semiconductor
07/26/2006CN1807483A High nitrogen content epoxide resin an its preparation method and uses
07/26/2006CN1266196C Continuous filament mat binder system
07/26/2006CN1266186C One-ingredient moisture-curing epoxy resin composition
07/20/2006WO2006075482A1 Curable composition
07/20/2006WO2006075415A1 Latent curing agent
07/20/2006US20060160931 Epoxy of bisphenol A, epichlorohydrin, tetraphenyl ethane groups, phosphorus containing heterocyclic groups, having disilane crosslinking; higher heat resistance and copper peel strength
07/20/2006US20060159929 Epoxy compound and cured epoxy resin product
07/20/2006US20060159928 Resin composition for printed wiring board, prepreg, and laminate obtained with the same
07/20/2006US20060156955 Thermosetting resin composition
07/19/2006EP1507817B1 Method for producing epoxidised polysulfides
07/19/2006EP1321481B1 Modified polyolefin resin, modified polyolefin resin composition, and use thereof
07/19/2006EP1264851B1 Resin composition, molding material, and molded object
07/19/2006EP1252551B1 Photoinitiator system with acylphosphine oxide initiators
07/19/2006CN1803889A Epoxy resin and thermosetting cyanate ester resin copolymer and method for preparing the same
07/19/2006CN1803882A Alpha, omega end amino polyether used as epoxy resin curing agent and method for preparing the same
07/19/2006CN1803881A Ultraviolet light cured ink prepolymer and preparation method thereof
07/19/2006CN1264832C Polyhydric phenols, epoxy resins, epoxy resin composition, and cured products thereof
07/18/2006US7078444 Photoactive cation contains at least one of (i) a transition metal containing organometallic cation, (ii) an organic onium cation, such as an iodonium or sulfonium cation, or (iii) a mixture, and (2) a segmented hydrocarbon-fluorocarbon-sulfonate anion; used in photoinitiated acid-catalyzed processes
07/18/2006US7078156 Negative resist composition comprising base polymer having epoxy ring and Si-containing crosslinker and patterning method for semiconductor device using the same
07/18/2006CA2274818C Material containing polyreactions products and method for the production thereof
07/18/2006CA2146210C Water base coating composition
07/13/2006WO2006074394A2 Heat activated sealants and foamed materials
07/13/2006WO2006073608A1 Optoelectronic molding compound that transmits visible light and blocks infrared light
07/13/2006WO2006073178A1 Photorefractive index modulating polymer composition, hologram recording material and method of refractive index control
07/13/2006WO2006073053A1 Liquid crystal sealing material and liquid crystal display cells made by using the same
07/13/2006US20060154081 Surface modification of substrates
07/13/2006US20060154078 Curable high-molecular weight epoxy resin based on multicylcic monomer, dicylopentadiene dioxide, a glycidyl acrylate and a curing agent; no phase separation in matrix when dyed with a heavy metal; high adhesion and conduction accuracy; strength, heat/moisture resistance, flexibility; semiconductors
07/13/2006US20060154039 Carbon fiber-reinforced resin composite materials
07/12/2006EP1679329A1 Curable composition
07/12/2006EP1679328A1 Photocuring resin composition containing organic polymer having epoxy group and/or oxethane group-containing silicon group at end, and method for producing same
07/12/2006EP1678246A1 Unsaturated polyester resin or vinyl ester resin compositions having reduced gel-time drift tendency
07/12/2006CN1802407A Nanoporous laminates
07/12/2006CN1802398A Method for production of prepolymers made from polysulphides and polyepoxides
07/11/2006US7074738 The epoxy resin includes a compound having two or more epoxy groups in one molecule, a compound having two or more phenolic hydroxy groups, in a molecule, and a trisubstituted phosphoniophenolate or salt as a curing accelerator
07/11/2006US7074273 Comprises acrylic ester/amide copolymers and epoxy based compatabilizer for surface treatment, imparting waterproofing/ink repellency; catalytic polymerization; patterned by UV irradiation
07/11/2006US7074254 Binder for powder metallurgy, mixed powder for powder metallurgy and method for producing same
07/11/2006CA2236819C Reactive resin manufacture
07/06/2006WO2006071820A1 Fire-retardant low-density epoxy composition
07/06/2006US20060149022 Conjugated polymers and blends containing carbazole, representation and use thereof
07/06/2006US20060148948 Flame-retardant for engineering thermoplastic applications
07/06/2006DE19983141B4 Vernetzbare Zusammensetzung und daraus erhältlicher vernetzter Gegenstand Crosslinkable composition and obtainable therefrom crosslinked article
07/06/2006CA2592305A1 Fire-retardant low-density epoxy composition
07/05/2006EP1676903A2 Cage for a rolling element bearing
07/05/2006EP1676581A2 Polymer compositions for use in therapy
07/05/2006EP1675806A1 Uv hardening glass printing ink and uv hardening glass printing lacquer and method for printing a glass substrate
07/05/2006EP1675620A2 Polymer derivatives
07/05/2006EP1622962B1 Toughened polyoxymethylene-poly(lactic acid) compositions
07/05/2006EP1613604B1 1-imidazolylmethyl-substituted-2-naphtols and their use as accelerators for low-temperature curing
07/05/2006EP1478678B1 Prepolymers for native epoxide resins and method for producing said prepolymers
07/05/2006CN1798787A Use of urea derivatives as accelerators for epoxy resins
07/05/2006CN1798786A Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device
07/05/2006CN1798785A Epoxy resin curing compositions and resin compositions including same
07/05/2006CN1262599C Thermosetting resin composition and semiconductor device obtained therefrom
07/05/2006CN1262598C Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device
07/05/2006CN1262571C Polycarbonate composition with a modified impact resistance
07/04/2006US7071288 Waterproofing; heat resistance
07/04/2006US7071243 Heat resistance; waterproofing; adhesives; electrical properties
07/04/2006US7070886 epoxides in the monomer or oligomer is linked by group comprising a siloxane to a silicon atom, a binder, an acid generator capable of producing an acid upon exposure to actinic radiation; decreased shrinkage, cracking and brittleness
07/04/2006US7070861 Flame retardant epoxy resin containing phenolic novolak type epoxy resin, a bisphenol type epoxy resin free of halogen, an inorganic filler and an organic phosphorus containing flame retardant
06/2006
06/29/2006WO2006068702A2 Environmentally friendly demulsifiers for crude oil emulsions
06/29/2006WO2006068493A1 Anticorrosive, surface-tolerant, water-dilutable epoxy mastic primer
06/29/2006WO2006068483A1 Half esters and coating compositions comprising reactions products of half esters and polyepoxides
06/29/2006WO2006068193A1 Thermoplastic resin composition and molded article
06/29/2006WO2006068185A1 Epoxy resin, epoxy resin composition, and cured object obtained therefrom
06/29/2006WO2006068134A1 Method for producing branched polyether resin composition and method for producing acid-pendant branched polyether resin composition
06/29/2006WO2006068063A1 Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition
06/29/2006WO2006067955A1 Method for producing acid anhydride based epoxy resin curing agent, acid anhydride based epoxy resin curing agent, epoxy resin composition, cured article therefrom and optical semiconductor device
06/29/2006WO2006067927A1 Actinic ray curable composition, actinic ray curable ink, method of image forming therewith, inkjet recording apparatus and epoxy compound
06/29/2006WO2006067195A1 Coating system
06/29/2006WO2006020380A3 Radiation curable, sprayable coating compositions
06/29/2006US20060142543 polymerizing tetrahydrofuran in the presence of at least one telogen (acetic anhydride) and/or comonomer and of an acidic heterogeneous catalyst based on activated sheet silicates or mixed metal oxides in a fluidized bed; high space-time yield with simple catalyst removal
06/29/2006US20060142507 Epoxy resin composition
06/29/2006US20060142427 allows for reduced amounts of phosphonate as compared to a composition not containing the filler; optional polybenzoxazine resin, and an optional co-curing agent
06/29/2006US20060141262 a heat treated mixture of epoxy resins, dicyandiamide, curing agents having imidazole rings, fillers and solvents, to enhance compatibility and form a uniform dispersion; electrical insulation and fireproofing
06/28/2006EP1674919A1 Sealant for liquid crystal, liquid-crystal display made with the same, and process for produicng the display
06/28/2006EP1674518A1 Fire-retardant low-density epoxy composition
06/28/2006EP1674495A1 Coating system
06/28/2006EP1622976B1 Flame-retardant molding compositions
06/28/2006EP0983320B9 Curable sealant composition
06/28/2006CN1795238A 环氧树脂组合物 The epoxy resin composition
06/28/2006CN1795223A Polyphosphonate flame retardant curing agent for epoxy resin
06/28/2006CN1793196A Tech. for synthesizing high toughness epoxy vinyl ester resin
06/28/2006CN1793195A Organic imvite modified epoxyresin
06/28/2006CN1261480C Epoxy resin curing agent and ultra-low temperature adhesive of epoxy resin prepared by it
06/27/2006US7067605 polyisobutylene, hydrogenated polyisoprene, hydrogenated polybutadiene, or their copolymers, prepared by addition of a hydrosilane having an epoxy or an oxetanyl group to an unsaturated end group or reacting a hydrolyzable silyl end group with an epoxy or oxetane compound having a hydroxy group
06/27/2006US7067233 a photoresist composition of a polyether; a diphenyl propenol polymerized with epichlorhydrin, an acrylate resin, a curing agent, and an organic solvent; a high curing efficiency, brightness; prevents the formation of remnant in photoresist patterns
06/22/2006WO2006066021A2 Epoxy resin compositions, methods of preparing, and articles made therefrom
06/22/2006WO2006064736A1 Thermosetting epoxy resin composition and use thereof
06/22/2006WO2006064638A1 Composition capable of cationic polymerization and actinic energy ray curing and method of image forming using the composition
06/22/2006US20060135743 Bimetallic zinc complex and process of producing polycarbonate using the same as polymerization catalyst
06/22/2006US20060135710 Epoxy resin compositions, methods of preparing and articles made therefrom
06/22/2006US20060135628 Environmentally friendly demulsifiers for crude oil emulsions
06/22/2006US20060134348 Alignment film and LCD made of the same
06/21/2006EP1672026A1 Resin composition for protective film
06/21/2006EP1671997A1 Latent curing agent and composition
06/21/2006EP1670860A1 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
06/21/2006EP1530617B1 Epoxy compositions having improved shelf life and articles containing the same