| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 01/03/2008 | WO2008001637A1 Amine imide compound to be activated by irradiation of active energy ray, composition using the same, and method for curing the same |
| 01/03/2008 | WO2008000830A1 Heat setting compounds suitable for sticking together coated substrates |
| 01/03/2008 | WO2007085291A3 Use of polysulfide-containing two-component adhesives for the production of windows |
| 01/03/2008 | US20080004425 Cycloaliphatic polyepoxy compounds and prepartation thereof |
| 01/03/2008 | US20080003524 Sulfonate-Containing Anti-Reflective Coating Forming Composition for Lithography |
| 01/03/2008 | US20080003368 Particulate coatings having improved chip resistance, uv durability, and color stability |
| 01/03/2008 | US20080000917 Transparent polycarbonate-polyester blends with improved performance under caustic aqueous environments |
| 01/02/2008 | EP1873208A1 Curable composition and cured article excellent in transparency |
| 01/02/2008 | EP1873181A2 Curing agent for epoxy resin and coating composition |
| 01/02/2008 | EP1873149A1 Cycloaliphatic polyepoxy compounds and preparation thereof |
| 01/02/2008 | CN101099108A Liquid crystal sealing material and liquid crystal display cells made by using the same |
| 01/02/2008 | CN101098930A Curable composition |
| 01/02/2008 | CN101098906A Epoxy resin composition for encapsulating semiconductor chip and semiconductor device |
| 01/02/2008 | CN101098905A Latent curing agent |
| 01/02/2008 | CN101096412A Curing agent for epoxy resin and low-temperature using epoxy adhesive |
| 01/02/2008 | CN101096411A Curing agent for epoxy resin and coating composition |
| 01/02/2008 | CN100358932C Photosensitive composition and cured product thereof |
| 01/02/2008 | CN100358931C Tech. for synthesizing high toughness epoxy vinyl ester resin |
| 01/02/2008 | CN100358902C Synthesis of binuclear metal complex compound and its catalyzed copolymerization and cycloaddition reaction of carbon dioxide and epoxide |
| 12/27/2007 | WO2007148822A1 Polyfunctional epoxy compound, epoxy resin, cationic photopolymerizable epoxy resin composition, micro structured member, producing method therefor and liquid discharge head |
| 12/27/2007 | WO2007148566A1 Cationically polymerizable composition and method for controlling cationic polymerization |
| 12/27/2007 | WO2007148558A1 Active ray curable composition, method for curing the same, active ray curable ink composition, image forming method, and compound |
| 12/27/2007 | WO2007148518A1 Liquid crystal sealing agent and liquid crystal display cell utilizing the same |
| 12/27/2007 | US20070299242 Pendant acrylate and/or methacrylate-containing polyether monols and polyols |
| 12/27/2007 | US20070299218 Solder-resistant flexible thermosetting epoxy resin system |
| 12/27/2007 | US20070299217 Epoxy-capped polythioethers |
| 12/27/2007 | US20070298178 Two Packages Type Thermosetting Resin Composition, Film Forming Method and Coated Article |
| 12/26/2007 | EP1869106A2 Janus dendrimers and dendrons |
| 12/26/2007 | EP1771397B1 Mixture for applying a coating |
| 12/26/2007 | EP1444296B1 Low gloss asa resin |
| 12/26/2007 | CN101095215A Adhesive sheet for both dicing and die bonding and semiconductor device manufacturing method using the adhesive sheet |
| 12/26/2007 | CN100357336C Capsule type hardener and composition |
| 12/25/2007 | US7312260 Epoxide adducts and their salts as dispersants |
| 12/25/2007 | US7312104 Comprises epoxy resin, curing agent, and inorganic composite oxide particles (silicon dioxide and group III/IV oxide); formed via stripping sheet on bump-mounting wafer |
| 12/21/2007 | WO2007146388A1 Powder coating composition for pipe coating |
| 12/21/2007 | WO2007145309A1 Resin composition for stereolithography |
| 12/21/2007 | WO2007145264A1 Thermosetting resin composition, method for forming antihalation film of solid-state imaging device, antihalation film of solid-state imaging device, and solid-state imaging device |
| 12/21/2007 | WO2007144425A1 Coating system |
| 12/21/2007 | WO2007144408A1 Coating system |
| 12/21/2007 | WO2007127032A3 One-part uv and abrasion resistant pigmented surfacing film composition for prepregs |
| 12/21/2007 | WO2007120203A3 Flame retardant compositions with a phosphorated compound |
| 12/21/2007 | WO2006116033A3 Method for preparing tomato sauce and pasta |
| 12/21/2007 | CA2650005A1 Powder coating composition for pipe coating |
| 12/20/2007 | US20070293637 epoxides in the monomer or oligomer is linked by group comprising a siloxane to a silicon atom, a binder, an acid generator capable of producing an acid upon exposure to actinic radiation; decreased shrinkage, cracking and brittleness |
| 12/20/2007 | US20070293588 Curable Composition |
| 12/20/2007 | US20070292620 curing agent for epoxy resins; for bridging cracks in a substrate; low temperature crosslinking; good adhesion to the substrate, good resistance to chemicals and resilience |
| 12/19/2007 | EP1867693A1 Hybrid Adhesive |
| 12/19/2007 | EP1867672A1 Epoxy resin composition |
| 12/19/2007 | EP1867671A2 Castor Oil/Epoxidized soybean oil based elastomeric compositions |
| 12/19/2007 | EP1866358A1 Halogen-free flame-retardant epoxy resin formulations |
| 12/19/2007 | CN100356204C Photosensitive composition, photosensitive color composition, color filter, and liquid crystal display equipemnt |
| 12/19/2007 | CN100355802C Ultraviolet light cured ink prepolymer and preparation method thereof |
| 12/18/2007 | US7309754 Stable encapsulant fluid capable of undergoing reversible Diels-Alder polymerization |
| 12/13/2007 | WO2007142262A1 Epoxy resin composition and cured epoxy resin |
| 12/13/2007 | WO2007142248A1 Novel epoxy compounds and process for their production |
| 12/13/2007 | WO2007142140A1 Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
| 12/13/2007 | WO2007141911A1 Method of dehalogenating organic compound |
| 12/13/2007 | WO2007141877A1 Process for production of aminated phosphoric acid ester compound, flame-retardant resin, and flame-retardant resin composition |
| 12/13/2007 | US20070287810 Epoxy-capped polythioethers and hydroxy/amine-capped polythioethers |
| 12/13/2007 | US20070287021 Prepreg, Metal-Clad Laminate and Printed Circuit Board Using Same |
| 12/13/2007 | US20070286997 Material Composition for Conductive Layers in Electronic Devices |
| 12/12/2007 | EP1865345A1 Inkjet ink composition for color filter, process for producing color filter, and color filter |
| 12/12/2007 | EP1865011A1 Low viscosity curable compositions |
| 12/12/2007 | CN101085831A Polyamide curing agent compositions |
| 12/12/2007 | CN100354363C Thermoplastic composition having low gloss appearance |
| 12/12/2007 | CN100354333C Low-temperature curable epoxy resin curing agent and epoxy resin composition |
| 12/11/2007 | US7307128 A curable compound, or adduct, or epoxy resins of anthrahydroquinone and epichlorohydrin; phenolic resin as curing agents; cured product is used for semiconductor encapsulation; solid, low melt viscosity, flame retardance, halogen-free; mechanical strength, heat resistance, moisture resistance |
| 12/06/2007 | WO2007138870A1 Liquid crystal sealing agent and liquid crystal display cell using the same |
| 12/06/2007 | US20070282058 rapid curing and produces a cured product of excellent flexibility and adhesiveness for seals for electronic and electrical elements; product of a branched phenolic-hydroxy substituted polysiloxane, and an epoxy-functional aliphatic siloxane |
| 12/06/2007 | US20070282036 Process For Making Filled Silicone Rubber Compositions |
| 12/05/2007 | EP1861449A1 Epoxy and silane group-containing oligomers and polymers a method for the production and the use thereof |
| 12/05/2007 | EP1359175B1 Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| 12/05/2007 | CN101084252A Epoxy resin, epoxy resin composition, and cured object obtained therefrom |
| 12/05/2007 | CN101084250A Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition |
| 12/05/2007 | CN100352847C Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
| 12/04/2007 | US7304120 Preparing a curable compound, or adduct, or epoxy resins of anthrahydroquinone and epichlorohydrin; cured product is used for semiconductor encapsulation; solid, low melt viscosity, flame retardance, halogen-free; mechanical strength, heat and moisture resistance |
| 12/04/2007 | CA2511567C Manufacture of void-free laminates and use thereof |
| 12/04/2007 | CA2329105C Cationic coating composition |
| 11/29/2007 | WO2007136003A1 Optical disk and ultraviolet-curable composition for optical disk |
| 11/29/2007 | WO2007135909A1 Thermosetting resin composition and cured product thereof |
| 11/29/2007 | WO2007135094A1 Low shrinkage epoxy-cationic curable compositions |
| 11/29/2007 | WO2007001705A3 Resin compositions with high thermoplastic loading |
| 11/29/2007 | US20070275250 Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross linking agent |
| 11/28/2007 | EP1860133A1 Epoxy resin, epoxy resin composition, and utilizing the same, prepreg and laminated plate |
| 11/28/2007 | EP1858950A1 Thermosetting composition for solder resist and cured product thereof |
| 11/28/2007 | EP1858905A1 Organotrisiloxane, its preparation and its use in curable resin composition |
| 11/28/2007 | CN100351283C 2-component mixing systems |
| 11/27/2007 | US7300986 Cured network polymer containing a monomer having two or more epoxy group and one or more amide linkage; useful for making resin casting, a film, an adhesive layer, or a bonding agent |
| 11/27/2007 | US7300963 Reaction product of the diglycidyl ether of a polyalkylene oxide, bisphenol a or bisphenol f, and diglycidyl ethers of bisphenol a or bisphenol f, further reacted with a polyamine such as diethylenetriamine; low shrinkage of cured coating |
| 11/27/2007 | US7300747 For producing optical materials such as adhesives for optical devices, coating compositions for optical devices, resist materials, prisms, fiber optics, information recording media, filters and plastic lenses |
| 11/27/2007 | US7300616 Method and apparatus for forming an article of manufacture and an article of manufacture made by a new and novel process |
| 11/27/2007 | US7300604 Tetrahydroxybenzene tetraester derivative and polymer thereof |
| 11/27/2007 | CA2511569C Manufacture of void-free laminates and use thereof |
| 11/22/2007 | WO2007132827A1 Sealing agent for cof mounting and semiconductor component sealed by using the same |
| 11/22/2007 | WO2007132724A1 Reactive carboxylate compound, curable resin composition using the same, and use thereof |
| 11/22/2007 | WO2007100734A3 A halogen-free phosphorous epoxy resin composition |
| 11/22/2007 | US20070267134 Photoinitiated Cationic Epoxy Compositions |
| 11/21/2007 | EP1857485A1 Ring-opening polymerization method and activated carbon catalyst for ring-opening polymerization |
| 11/21/2007 | EP1668056A4 Epoxy resin compositions, processes utilzing same and articles made therefrom |
| 11/21/2007 | EP1507832B1 Jettable compositions |