| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 02/19/2008 | CA2157312C Highly active double metal cyanide catalysts |
| 02/14/2008 | WO2008018364A1 Prepreg, laminate and printed wiring board |
| 02/14/2008 | WO2008017647A1 A mold with a metallic surface to which a pretreatment layer has been applied, comprising a phosphinic acid derivative |
| 02/14/2008 | US20080039591 Acid Anhydride Ester and Composition Thereof, and Heat-Curable Resin Composition and Cured Product Thereof |
| 02/14/2008 | US20080039555 Thermally conductive material |
| 02/14/2008 | US20080039542 Composition and associated method |
| 02/14/2008 | US20080035018 Use of epoxypolysiloxanes modified with oxyalkylene ether groups as additives for radiation-curing coatings |
| 02/13/2008 | EP1887031A1 White prepreg, white laminated plate, and metal foil clad white laminated plate |
| 02/13/2008 | EP1887022A1 Substrates having metalic surface and pretreatment layer containing a phosphinic acid derivate applied thereon |
| 02/13/2008 | EP1887021A1 Hardenable composition and novel adamantane compound |
| 02/13/2008 | EP1885764A1 Two-component epoxy adhesive composition |
| 02/13/2008 | EP1885700A1 Imidazole salts, method for producing them, use thereof and epoxy resins containing said salts |
| 02/13/2008 | CN101124275A Fire-retardant low-density epoxy composition |
| 02/13/2008 | CN101124258A Thermosetting composition for solder resist and cured product thereof |
| 02/13/2008 | CN101124233A Novel curable resin, method for producing same, epoxy resin composition and electronic component device |
| 02/13/2008 | CN101121890A Low-melting point liquid crystal epoxy resin and synthesis method thereof |
| 02/13/2008 | CN101121775A Method for preparing line-type o-cresol novolac epoxy resin |
| 02/13/2008 | CN101121704A Acid anhydride ester and composition thereof, and heat-curable resin composition and cured product thereof |
| 02/13/2008 | CN100368459C Cationically photopolymerizable resin composition and optical disk surface protection material |
| 02/12/2008 | US7329711 Moldings containing polyarylene ether sulfones, fillers, and additives |
| 02/12/2008 | CA2332496C Photopolymerizable dental compositions |
| 02/12/2008 | CA2185207C 1-imidazolylmethyl-2-naphthols as catalysts for curing epoxy resins |
| 02/07/2008 | WO2008016122A1 Liquid crystal sealing material, process for production of liquid crystal display panels with the same, and liquid crystal display panels |
| 02/07/2008 | WO2008016121A1 Insulating polymer material composition |
| 02/07/2008 | WO2008016120A1 Insulating polymer material composition |
| 02/07/2008 | WO2008016119A1 Insulating polymer material composition |
| 02/07/2008 | WO2008014931A1 Sheet molding compounds (smc), thick molding compounds (tmc), and bulk molding compounds (bmc) comprising thermosetting resins based on renewable resources |
| 02/07/2008 | US20080033117 Sealing epoxy resin; reducing dielectrics: toughness |
| 02/07/2008 | US20080032061 rapid curing polymer having epoxy and aromatic hydrocarbon functionality and photoinitiator in solvent; optical waveguides; simple, efficient; adhesion is improved if the composition is combined with a photo-sensitizer or photo-radical generator |
| 02/07/2008 | US20080029200 Toughened activatable material for sealing, baffling or reinforcing and method of forming same |
| 02/06/2008 | EP1884531A1 Sheet molding compounds (smc) comprising thermosetting resins based on renewable resources |
| 02/06/2008 | CN101117377A Method for preparing aqueous epoxy resin |
| 02/06/2008 | CN101117376A Low-viscosity bisphenol A epoxide resin and production method thereof |
| 02/06/2008 | CN100366656C Epoxy resin composition and method for producing heat-resistant laminate sheet |
| 02/05/2008 | CA2300169C Aqueous dispersions of epoxy resins |
| 01/31/2008 | WO2008012281A1 Composition that can be polymerized and/or crosslinked when irradiated by cationic and/or radical route |
| 01/31/2008 | WO2007095276A3 Method for deprotecting aryl or alkyl sulfonamides of primary or secondary amines |
| 01/31/2008 | US20080027169 Thermohardenable Epoxy Resin-Based Compositions, 3(4)-(Aminomethyl)-Cyclohexane-Propanamine and 1,4(5)-Cyclooctane Dimethanamine |
| 01/31/2008 | US20080027155 Thermally Conductive Material for Electronic and/or Electrical Components, and Use Thereof |
| 01/30/2008 | EP1882714A1 Method for producing fiber-reinforced thermally molten epoxy resin |
| 01/30/2008 | CN101115782A Latent curing agent |
| 01/30/2008 | CN101113229A Curing agent intermediate composition and curing agent employing the same |
| 01/30/2008 | CN101113224A Colored resin composition, color filter, and liquid crystal display |
| 01/30/2008 | CN101113198A Method for preparing high-molecular L-lactic acid by employing low-molecular-weight epoxide resin chain extender |
| 01/30/2008 | CN101113197A Synthesis technique of alkide resin modified epoxy vinyl esters resin |
| 01/30/2008 | CN101113196A Silicon-phosphor-containing heat-stable hybridized epoxide resin and the preparing method and application thereof |
| 01/30/2008 | CN100365081C Coating composition |
| 01/30/2008 | CN100365038C Curing agent for epoxide resins, use thereof and cured epoxide resin therewith |
| 01/29/2008 | US7323693 Apparatus and method for measuring cured state of reaction curable resin |
| 01/29/2008 | US7323521 Epoxy polymer additives for powder coatings |
| 01/29/2008 | US7323520 Anti-aging agents for rubber vulcanizates based on organic compounds containing conjugated azadienes |
| 01/29/2008 | US7323242 Aqueous polymer dispersion; emulsion polymers consisting of unsaturated acid and epoxide ; curing; alkanolamine hardening |
| 01/29/2008 | US7323234 Curable alkanolamine containing epoxy powder coating composition |
| 01/29/2008 | CA2386166C Coating with optical taggent |
| 01/29/2008 | CA2334824C Resin system |
| 01/24/2008 | WO2008010521A1 Photosensitive resin composition |
| 01/24/2008 | WO2008009560A1 Hardenable epoxy resin composition |
| 01/24/2008 | US20080021173 Epoxy Resin, Epoxy Resin Composition And Cured Product Thereof |
| 01/24/2008 | US20080020231 Epoxy Resin Composition |
| 01/24/2008 | DE112006000540T5 Basen-multiplikative Mittel und basenreaktive härtbare Zusammensetzungen Base multiplicative agent and base reactive curable compositions |
| 01/23/2008 | EP1470446A4 Organic anti-reflective coating compositions for advanced microlithography |
| 01/23/2008 | CN101111533A Ring-opening polymerization method and activated carbon catalyst for ring-opening polymerization |
| 01/23/2008 | CN101111530A Molding composition and method, and molded article |
| 01/23/2008 | CN101108892A Diluent free epoxy resin formulation |
| 01/23/2008 | CN100363401C Method for producing epoxidised polysulfides |
| 01/23/2008 | CN100363399C Photocurable composition and mfg. method, photocurable pressure-sensitive adhesive sheet and mfg. and bonding method |
| 01/23/2008 | CN100363398C Prepn of high-boiling alcohol lignin epoxy resin |
| 01/23/2008 | CN100363397C Hyperbranched polymer containing crown ether and synthesis process therefor |
| 01/22/2008 | US7320848 Poly(azine)-based charge transport materials |
| 01/17/2008 | WO2008007764A1 Photosensitive resin composition, layered product thereof, cured object therefrom, and method of forming pattern from the composition (3) |
| 01/17/2008 | WO2008007762A1 Photosensitive resin composition, layered product thereof, cured object therefrom, and method of forming pattern from the composition (2) |
| 01/17/2008 | WO2008006835A1 Assembly of prepregs for producing structures, for example ones which deploy through inflation |
| 01/17/2008 | WO2008006390A1 Ink jet cartridge comprising a layer made by a curable resin composition |
| 01/17/2008 | CA2654017A1 Assembly of prepregs for producing structures, for example ones which deploy through inflation |
| 01/16/2008 | EP1640363B1 Process for production of monosulfonium salts, cationic polymerization initiators, curable compositions, and products of curing |
| 01/16/2008 | CN101107285A Epoxy resin composition, method for forming latent of the same and semiconductor device |
| 01/16/2008 | CN101107284A Composition containing a hydrogenated bisglycidyl ether and a cross-linking agent |
| 01/16/2008 | CN100362072C Adhesive for resin roll assembly and resin roll |
| 01/15/2008 | US7318991 Diphenylsulfonium compounds in which the S atom is additionally attached to a xanthene-9-onyl-2-yl- or coumarin-7-yl- ring; acid generator for a chemically amplified resist; photopolymerization initiator for polymerizing an epoxide or a vinyl ether |
| 01/10/2008 | WO2008004630A1 Active energy ray-curable composition for optical uses, and high-refractive index resin |
| 01/10/2008 | WO2008004504A1 Alicyclic diepoxy compound, epoxy resin composition, and cured product |
| 01/10/2008 | US20080009602 Epoxy Resin, Method For Producing Same And Epoxy Resin Composition Thereof |
| 01/10/2008 | US20080009130 Underfill and mold compounds including siloxane-based aromatic diamines |
| 01/10/2008 | US20080008971 Polymerization catalysts; ink jet heads |
| 01/10/2008 | US20080008965 Ester compounds and their preparation, polymers, resist compositions and patterning process |
| 01/09/2008 | EP1876495A1 Composition comprising polymer having ethylene-dicarbonyl structure for use in forming anti-reflective coating for lithography |
| 01/09/2008 | EP1876199A1 Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof |
| 01/09/2008 | EP1876194A1 Heat curing composition usable as an adhesive for coated substrates |
| 01/09/2008 | EP1876013A2 Laminate and process for producing a laminate of this type |
| 01/09/2008 | EP1741006B1 Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same |
| 01/09/2008 | EP1461829B1 Dual cure b-stageable underfill for wafer level |
| 01/09/2008 | EP1419527B1 Adhesive tape |
| 01/09/2008 | CN101103311A Cationic photopolymerizable epoxy resin composition, minute structural member using the same and method for manufacturing minute structural member |
| 01/09/2008 | CN101103062A Curable resin composition and interlayer insulating film |
| 01/09/2008 | CN101103038A Silane formulation for moisture-crosslinking hybrid adhesives and sealants |
| 01/09/2008 | CN101100502A B stage epoxy resin solution and preparing method thereof |
| 01/09/2008 | CN100360513C Alcyl epoxide and its production process and composition and LED sealing material |
| 01/08/2008 | CA2515716C Curable epoxidized polyisoprene composition |
| 01/08/2008 | CA2349383C Curable coating compositions containing blends of carbamate-functional compounds |
| 01/03/2008 | WO2008001695A1 Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable composition |