Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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11/15/2006 | CN1284815C Solidifing agent of modified like epoxy resins by alcyl amine |
11/14/2006 | US7135544 Living olefin polymerization processes |
11/14/2006 | US7135224 Adhesive tape |
11/09/2006 | WO2006118334A1 Curable silicone composition and cured product therefrom |
11/09/2006 | WO2006118323A1 Composition containing fluorine-containing aromatic polymer and laminated body containing fluorine-containing aromatic polymer |
11/09/2006 | WO2006118241A1 Liquid epoxy resin, epoxy resin composition and cured product thereof |
11/09/2006 | WO2006118240A1 Epoxy resin and epoxy resin composition |
11/09/2006 | WO2006118059A1 Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof |
11/09/2006 | WO2006093949A9 Two-component epoxy adhesive composition |
11/09/2006 | US20060252911 adamantyl diglycidyl ether or 1-adamantanol epichlorohydrin adduct curable to polyepoxides; encapsulant for light-emitting diode; superior optical properties, heat resistance, photostability, and shrinkage inhibition |
11/09/2006 | US20060252891 Epoxy-acrylate/amine adhesive composition |
11/09/2006 | US20060252159 Photocrosslinked hydrogel blend surface coatings |
11/08/2006 | EP1719802A1 Method for curing an epoxy resin composition containing reactive phosphonate |
11/08/2006 | EP1719789A1 Hyperbranched polymer and cycloaliphatic epoxy resin thermosets |
11/08/2006 | EP1718453A1 Infiltrant system for rapid prototyping process |
11/08/2006 | EP1718447A1 Heat-curable molding material pellet having multilayer structure |
11/08/2006 | EP1578851B1 Heat activated epoxy adhesive and use in a structural foam insert |
11/08/2006 | EP1481019B1 Process for preparing chain extended thermoplastic guanidinium polymers |
11/08/2006 | EP1214191A4 Treated copper foil and process for making treated copper foil |
11/08/2006 | CN1860164A Thermohardenable epoxy resin-based compositions, 3(4)-(aminomethyl)-cyclohexane-propanamine and 1,4(5)-cyclooctane dimethanamine |
11/08/2006 | CN1858083A Ammonia 618 epoxy resin additive compound-acetone imine |
11/08/2006 | CN1284010C Method of sealing lens |
11/08/2006 | CN1283709C Particle, composition and protective film |
11/08/2006 | CN1283685C Radiation curable resin composition for making colored three dimensional objects |
11/08/2006 | CN1283684C Improved resin of epoxy-ester and preparation method |
11/08/2006 | CN1283682C Indole resins, epoxy resins, and resin compositions containing the same |
11/08/2006 | CN1283339C Method for preparing multifunctional deemulsifying agent of crude oil and products thereof |
11/07/2006 | US7132557 Amine compounds and curable compositions derived therefrom |
11/07/2006 | US7132216 Non-aromatic chromophores for use in polymer anti-reflective coatings |
11/02/2006 | WO2006116033A2 Method for preparing tomato sauce and pasta |
11/02/2006 | WO2006115231A1 Curable resin composition and process for producing bonded part obtained with the same |
11/02/2006 | WO2006115074A1 Composition comprising polymer having ethylene-dicarbonyl structure for use in forming anti-reflective coating for lithography |
11/02/2006 | WO2006076310A3 Reinforcing sheet |
11/02/2006 | US20060247401 Process for production of monosulfonium salts, cationic polymerization initiators, curable compositions, and products of curing |
11/02/2006 | US20060247393 semiconductor encapsulating resin; polyepoxide of biphenyl-4,4'-diglycidyl ether and 3,3',5,5'-tetramethylbiphenyl-4,4'-diglycidyl ether, phenolic resin, low amount of filler, curing accelerator; inherently fire resistant without added flame retardant; forms foamed layer at ignition for fire retardancy |
11/02/2006 | US20060247392 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin |
11/02/2006 | US20060247391 Epoxy resin composition and semiconductor apparatus |
11/02/2006 | US20060247334 Epoxy resin composition and method for producing heat-resistant laminate sheet |
11/02/2006 | US20060247333 Epoxy resin composition |
11/02/2006 | US20060246188 Method for preparing tomato sauce using convective heating and sauce and pasta products produced thereby |
11/02/2006 | EP1716195A1 Multicomponent kit for fastening purposes and the use thereof |
11/02/2006 | CA2603889A1 Method for preparing tomato sauce and pasta |
11/01/2006 | CN1856521A Latent hardener |
11/01/2006 | CN1856520A Epoxy resin compositions, processes utilzing same and articles made therefrom |
11/01/2006 | CN1854133A Heterocycle-bearing onium salts |
11/01/2006 | CN1282697C Thermosetting organic resin composition |
10/31/2006 | CA2340373C Thermosetting compositions containing carboxylic acid functional polymers prepared by atom transfer radical polymerization |
10/26/2006 | WO2006112438A1 Epoxy resin composition, hardening product thereof, semiconductor sealing material, novel epoxy resin, novel polyhydroxy compound and process for producing the same |
10/26/2006 | WO2006112396A1 Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component |
10/26/2006 | WO2005104750A3 Method and apparatus for forming a finished article of manufacture and a finished article of manufacture made by a new and novel process |
10/26/2006 | US20060241274 Difunctional phenol (e.g. bisphenol A) coupled with a divinyl ethers of a (poly)oxyalkylene glycol optionally capped by epihalohydrin; moisture resistance and water resistance; coatings, structural materials; semiconductor encapsulant, printed circuit board |
10/26/2006 | US20060241251 Coherent Insert |
10/26/2006 | US20060240356 Positive type photosensitive epoxy resin composition and printed circuit board using the same |
10/26/2006 | US20060240157 Garlic vodka |
10/25/2006 | EP1715381A1 Photosensitive resin composition and cured product thereof |
10/25/2006 | EP1714993A1 Thermoplastic elastomer composition and molded article |
10/25/2006 | EP1714992A1 Thermoplastic elastomer composition and molded article |
10/25/2006 | EP1714991A1 Photosensitive epoxy resin adhesive composition and use thereof |
10/25/2006 | EP1059323B1 Thermosetting composition containing polyhemiacetal ester resin and powdery thermosetting composition |
10/25/2006 | EP1034193B1 Phenol-novolacs with improved optical properties |
10/25/2006 | CN1852956A Water-resistant adhesive composition for wood |
10/25/2006 | CN1852932A Alicyclic epoxy resins, their preparation process, their compositions, epoxy resin cured product, and uses of alicyclic epoxy resin compositions |
10/25/2006 | CN1850878A Method for preparing carbon nano tube epoxy resin curing agent |
10/24/2006 | US7125951 Bisphenol a derivatives containing one biaryl group and a spacer; monomers for polycarbonates |
10/24/2006 | US7125917 Epoxy molding compounds with resistance to UV light and heat |
10/24/2006 | US7125609 Epoxy modified organopolysiloxane resin based compositions useful for protective coatings |
10/24/2006 | US7125558 Process for the preparation of activated polyethylene glycols |
10/19/2006 | WO2006110515A1 Film-forming compositions derived from acyclic carbonates and polyamines |
10/19/2006 | WO2006109890A1 Photosensitive resin composition, printed wiring board, and semiconductor package substrate |
10/19/2006 | WO2006109768A1 Light-transmitting resin composition |
10/19/2006 | WO2006109744A1 Epoxy resin composition |
10/19/2006 | WO2006109572A1 Reactive epoxy carboxylates and actinic radiation curable resin compositions containing the same |
10/19/2006 | US20060235183 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin |
10/19/2006 | US20060235180 Consistently produce coatings that have desirable performance properties when cured, and that are stable when uncured; low temperature cure thermosetting powder coating; be used to coat pieces of thick metal, plastics such as thermoset and thermoplastics, and wood |
10/19/2006 | US20060235101 Actinic radiation curable compositions and their use |
10/19/2006 | US20060234156 Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound |
10/18/2006 | CN1849674A Composition for polymer solid electrolyte, polymer solid electrolyte, polymer, polymer solid electrolyte battery, ion-conductive membrane, copolymer and process for producing the copolymer |
10/18/2006 | CN1849560A Photosensitive resin composition and pattern forming method using the composition |
10/18/2006 | CN1849360A Adhesive composition and using thereof |
10/18/2006 | CN1849355A Photosensitive resin composition and film having cured coat formed therefrom |
10/18/2006 | CN1849354A Composition, treated backing, and coated abrasive articles containing the same |
10/18/2006 | CN1847283A Prepn process of carbon nanotube epoxy resin curing agent |
10/18/2006 | CN1847282A Amidate modified epoxy resin and prepn of water base anticorrosive epoxy paint |
10/18/2006 | CN1280375C Adhesive for laminated product, anchoring agent, laminated films, multiplayer packaging material and packaging bag |
10/17/2006 | CA2394766C Coated metal substrates and methods for preparing and inhibiting corrosion of the same |
10/12/2006 | US20060229418 improved stability, performance |
10/12/2006 | US20060228561 Epoxy resin composition for semiconductor encapsulating use, and semiconductor device |
10/12/2006 | US20060228556 Electrodepositable coating compositions and methods for their production |
10/12/2006 | DE102005015605A1 Phosphororganische Verbindungen enthaltende Prepolymere und Verwendungen dafür Organophosphorus compounds containing prepolymers and uses therefor |
10/11/2006 | EP1710272A1 Resin dispersion and resin particle |
10/11/2006 | EP1710271A1 Resin dispersion and resin particle |
10/11/2006 | EP1710265A1 Radiopaque polymers for circuit board assembly |
10/11/2006 | EP1710264A2 Prepolymers containing phosphor organic compounds and their use |
10/11/2006 | EP1709119A1 Gelator-stabilized crystalline resins |
10/11/2006 | EP1709099A2 Thermally stable cationic photocurable compositions |
10/11/2006 | EP1508583B1 Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate each comprising or made with the same |
10/11/2006 | EP1138739B1 Photocurable resin composition for sealing material and method of sealing |
10/11/2006 | CN1845966A Low odor binders curable at room temperature |
10/11/2006 | CN1844190A Preparation of novel composite initiator and copolymerization of epoxide and cyclic ether and homopolymerization of epoxide initiated by same |
10/11/2006 | CN1279114C Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same |