Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
11/2006
11/15/2006CN1284815C Solidifing agent of modified like epoxy resins by alcyl amine
11/14/2006US7135544 Living olefin polymerization processes
11/14/2006US7135224 Adhesive tape
11/09/2006WO2006118334A1 Curable silicone composition and cured product therefrom
11/09/2006WO2006118323A1 Composition containing fluorine-containing aromatic polymer and laminated body containing fluorine-containing aromatic polymer
11/09/2006WO2006118241A1 Liquid epoxy resin, epoxy resin composition and cured product thereof
11/09/2006WO2006118240A1 Epoxy resin and epoxy resin composition
11/09/2006WO2006118059A1 Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof
11/09/2006WO2006093949A9 Two-component epoxy adhesive composition
11/09/2006US20060252911 adamantyl diglycidyl ether or 1-adamantanol epichlorohydrin adduct curable to polyepoxides; encapsulant for light-emitting diode; superior optical properties, heat resistance, photostability, and shrinkage inhibition
11/09/2006US20060252891 Epoxy-acrylate/amine adhesive composition
11/09/2006US20060252159 Photocrosslinked hydrogel blend surface coatings
11/08/2006EP1719802A1 Method for curing an epoxy resin composition containing reactive phosphonate
11/08/2006EP1719789A1 Hyperbranched polymer and cycloaliphatic epoxy resin thermosets
11/08/2006EP1718453A1 Infiltrant system for rapid prototyping process
11/08/2006EP1718447A1 Heat-curable molding material pellet having multilayer structure
11/08/2006EP1578851B1 Heat activated epoxy adhesive and use in a structural foam insert
11/08/2006EP1481019B1 Process for preparing chain extended thermoplastic guanidinium polymers
11/08/2006EP1214191A4 Treated copper foil and process for making treated copper foil
11/08/2006CN1860164A Thermohardenable epoxy resin-based compositions, 3(4)-(aminomethyl)-cyclohexane-propanamine and 1,4(5)-cyclooctane dimethanamine
11/08/2006CN1858083A Ammonia 618 epoxy resin additive compound-acetone imine
11/08/2006CN1284010C Method of sealing lens
11/08/2006CN1283709C Particle, composition and protective film
11/08/2006CN1283685C Radiation curable resin composition for making colored three dimensional objects
11/08/2006CN1283684C Improved resin of epoxy-ester and preparation method
11/08/2006CN1283682C Indole resins, epoxy resins, and resin compositions containing the same
11/08/2006CN1283339C Method for preparing multifunctional deemulsifying agent of crude oil and products thereof
11/07/2006US7132557 Amine compounds and curable compositions derived therefrom
11/07/2006US7132216 Non-aromatic chromophores for use in polymer anti-reflective coatings
11/02/2006WO2006116033A2 Method for preparing tomato sauce and pasta
11/02/2006WO2006115231A1 Curable resin composition and process for producing bonded part obtained with the same
11/02/2006WO2006115074A1 Composition comprising polymer having ethylene-dicarbonyl structure for use in forming anti-reflective coating for lithography
11/02/2006WO2006076310A3 Reinforcing sheet
11/02/2006US20060247401 Process for production of monosulfonium salts, cationic polymerization initiators, curable compositions, and products of curing
11/02/2006US20060247393 semiconductor encapsulating resin; polyepoxide of biphenyl-4,4'-diglycidyl ether and 3,3',5,5'-tetramethylbiphenyl-4,4'-diglycidyl ether, phenolic resin, low amount of filler, curing accelerator; inherently fire resistant without added flame retardant; forms foamed layer at ignition for fire retardancy
11/02/2006US20060247392 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin
11/02/2006US20060247391 Epoxy resin composition and semiconductor apparatus
11/02/2006US20060247334 Epoxy resin composition and method for producing heat-resistant laminate sheet
11/02/2006US20060247333 Epoxy resin composition
11/02/2006US20060246188 Method for preparing tomato sauce using convective heating and sauce and pasta products produced thereby
11/02/2006EP1716195A1 Multicomponent kit for fastening purposes and the use thereof
11/02/2006CA2603889A1 Method for preparing tomato sauce and pasta
11/01/2006CN1856521A Latent hardener
11/01/2006CN1856520A Epoxy resin compositions, processes utilzing same and articles made therefrom
11/01/2006CN1854133A Heterocycle-bearing onium salts
11/01/2006CN1282697C Thermosetting organic resin composition
10/2006
10/31/2006CA2340373C Thermosetting compositions containing carboxylic acid functional polymers prepared by atom transfer radical polymerization
10/26/2006WO2006112438A1 Epoxy resin composition, hardening product thereof, semiconductor sealing material, novel epoxy resin, novel polyhydroxy compound and process for producing the same
10/26/2006WO2006112396A1 Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component
10/26/2006WO2005104750A3 Method and apparatus for forming a finished article of manufacture and a finished article of manufacture made by a new and novel process
10/26/2006US20060241274 Difunctional phenol (e.g. bisphenol A) coupled with a divinyl ethers of a (poly)oxyalkylene glycol optionally capped by epihalohydrin; moisture resistance and water resistance; coatings, structural materials; semiconductor encapsulant, printed circuit board
10/26/2006US20060241251 Coherent Insert
10/26/2006US20060240356 Positive type photosensitive epoxy resin composition and printed circuit board using the same
10/26/2006US20060240157 Garlic vodka
10/25/2006EP1715381A1 Photosensitive resin composition and cured product thereof
10/25/2006EP1714993A1 Thermoplastic elastomer composition and molded article
10/25/2006EP1714992A1 Thermoplastic elastomer composition and molded article
10/25/2006EP1714991A1 Photosensitive epoxy resin adhesive composition and use thereof
10/25/2006EP1059323B1 Thermosetting composition containing polyhemiacetal ester resin and powdery thermosetting composition
10/25/2006EP1034193B1 Phenol-novolacs with improved optical properties
10/25/2006CN1852956A Water-resistant adhesive composition for wood
10/25/2006CN1852932A Alicyclic epoxy resins, their preparation process, their compositions, epoxy resin cured product, and uses of alicyclic epoxy resin compositions
10/25/2006CN1850878A Method for preparing carbon nano tube epoxy resin curing agent
10/24/2006US7125951 Bisphenol a derivatives containing one biaryl group and a spacer; monomers for polycarbonates
10/24/2006US7125917 Epoxy molding compounds with resistance to UV light and heat
10/24/2006US7125609 Epoxy modified organopolysiloxane resin based compositions useful for protective coatings
10/24/2006US7125558 Process for the preparation of activated polyethylene glycols
10/19/2006WO2006110515A1 Film-forming compositions derived from acyclic carbonates and polyamines
10/19/2006WO2006109890A1 Photosensitive resin composition, printed wiring board, and semiconductor package substrate
10/19/2006WO2006109768A1 Light-transmitting resin composition
10/19/2006WO2006109744A1 Epoxy resin composition
10/19/2006WO2006109572A1 Reactive epoxy carboxylates and actinic radiation curable resin compositions containing the same
10/19/2006US20060235183 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin
10/19/2006US20060235180 Consistently produce coatings that have desirable performance properties when cured, and that are stable when uncured; low temperature cure thermosetting powder coating; be used to coat pieces of thick metal, plastics such as thermoset and thermoplastics, and wood
10/19/2006US20060235101 Actinic radiation curable compositions and their use
10/19/2006US20060234156 Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound
10/18/2006CN1849674A Composition for polymer solid electrolyte, polymer solid electrolyte, polymer, polymer solid electrolyte battery, ion-conductive membrane, copolymer and process for producing the copolymer
10/18/2006CN1849560A Photosensitive resin composition and pattern forming method using the composition
10/18/2006CN1849360A Adhesive composition and using thereof
10/18/2006CN1849355A Photosensitive resin composition and film having cured coat formed therefrom
10/18/2006CN1849354A Composition, treated backing, and coated abrasive articles containing the same
10/18/2006CN1847283A Prepn process of carbon nanotube epoxy resin curing agent
10/18/2006CN1847282A Amidate modified epoxy resin and prepn of water base anticorrosive epoxy paint
10/18/2006CN1280375C Adhesive for laminated product, anchoring agent, laminated films, multiplayer packaging material and packaging bag
10/17/2006CA2394766C Coated metal substrates and methods for preparing and inhibiting corrosion of the same
10/12/2006US20060229418 improved stability, performance
10/12/2006US20060228561 Epoxy resin composition for semiconductor encapsulating use, and semiconductor device
10/12/2006US20060228556 Electrodepositable coating compositions and methods for their production
10/12/2006DE102005015605A1 Phosphororganische Verbindungen enthaltende Prepolymere und Verwendungen dafür Organophosphorus compounds containing prepolymers and uses therefor
10/11/2006EP1710272A1 Resin dispersion and resin particle
10/11/2006EP1710271A1 Resin dispersion and resin particle
10/11/2006EP1710265A1 Radiopaque polymers for circuit board assembly
10/11/2006EP1710264A2 Prepolymers containing phosphor organic compounds and their use
10/11/2006EP1709119A1 Gelator-stabilized crystalline resins
10/11/2006EP1709099A2 Thermally stable cationic photocurable compositions
10/11/2006EP1508583B1 Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate each comprising or made with the same
10/11/2006EP1138739B1 Photocurable resin composition for sealing material and method of sealing
10/11/2006CN1845966A Low odor binders curable at room temperature
10/11/2006CN1844190A Preparation of novel composite initiator and copolymerization of epoxide and cyclic ether and homopolymerization of epoxide initiated by same
10/11/2006CN1279114C Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same