| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 10/16/2007 | US7282543 Water-based system to manufacture polymeric coatings which generally does not require surfactants, although such surfactants may be utilized |
| 10/16/2007 | US7282266 A curable mixture free of conductive pigments comprising a reaction product of epoxy materials and a phosphorus-containing compound, a curing agent and elemental silicon; excellent adhesion between the metal substrate and any coatings; used with a weldable primer; automobile coatings |
| 10/16/2007 | CA2258644C Novolak compounds useful as adhesion promoters for epoxy resins |
| 10/16/2007 | CA2175266C Highly active double metal cyanide complex catalysts |
| 10/11/2007 | WO2007114822A1 Thermally curable epoxy-amine barrier sealants |
| 10/11/2007 | WO2007114464A1 Resin composition for forming insulating layer |
| 10/11/2007 | WO2007114462A1 Resin composition for insulating layer |
| 10/11/2007 | US20070235127 Photochemically and thermally curable adhesive formulations |
| 10/11/2007 | DE19538468B4 Verfahren zur flächigen Verklebung von Werkstücken, geklebter Verbund und Verwendung davon A method for surface bonding of workpieces, bonded composite and use thereof |
| 10/10/2007 | EP1842849A1 Trisoxetane compound, process for producing the same, and optical waveguide using the same |
| 10/10/2007 | EP1701690A4 Epoxy adhesive composition method of preparing using |
| 10/10/2007 | EP1408087B1 Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method |
| 10/10/2007 | CN101052919A Sulfonic-ester-containing composition for formation of antireflection film for lithography |
| 10/10/2007 | CN101050300A Self-emulsifying type aqueous latex of epoxy hardener, and preparation method |
| 10/10/2007 | CN100342511C Underfill encapsulant for wafer packaging and method for its application |
| 10/10/2007 | CN100341916C Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing these |
| 10/09/2007 | US7279574 Heat conductivity, it is also useful as an insulating material requiring high heat releasability such as a printed circuit substrate |
| 10/09/2007 | US7279223 Underfill composition and packaged solid state device |
| 10/09/2007 | CA2378013C Process for the continuous production of epoxy-(meth)acrylic-styrene polymers and their use in coating |
| 10/09/2007 | CA2168041C Viscosity-modified lactide polymer composition and process for manufacture thereof |
| 10/04/2007 | WO2007111606A1 Radiation-or thermally-curable barrier sealants |
| 10/04/2007 | WO2007111136A1 Curable epoxy resin composition |
| 10/04/2007 | WO2007087399B1 Epoxy formulations for use in lithography techniques |
| 10/04/2007 | WO2006105043A3 Janus dendrimers and dendrons |
| 10/04/2007 | US20070232728 resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The invention has solved the object by a resin composition for semiconductor encapsulation |
| 10/04/2007 | US20070232713 Radiation Curable Liquid Resin Composition for Optical Three-Dimensional Molding and Optical Molded Article Obtained by Photocuring Same |
| 10/04/2007 | US20070232485 Low-cure powder coatings and methods for using the same |
| 10/04/2007 | US20070231463 Aqueous Self-Adhesive Coating for Electrical Steel and its Uses |
| 10/04/2007 | DE102006015084A1 Halogenfreie flammgeschützte Epoxidharz-Formulierungen Halogen-free flame-retardant epoxy resin formulations |
| 10/03/2007 | EP1840166A1 Curable composition |
| 10/03/2007 | EP1840149A1 Curable resin composition and interlayer insulating film |
| 10/03/2007 | EP1840148A1 Polymerizable actinic radiation curable composition, polymerization method, actinic radiation curable ink and image formation method, and ink jet recording apparatus and epoxy compound |
| 10/03/2007 | EP1838776A1 Fire-retardant low-density epoxy composition |
| 10/03/2007 | EP1838750A1 Coating system |
| 10/03/2007 | EP1357204B1 Application type thin plate reinforcing material composition |
| 10/03/2007 | CN101048390A Heterocyclical chromophore architectures |
| 10/03/2007 | CN101045781A Preparation method of high purity electronic stage tetraphenolic ethane tetraglycidel ether epoxy resin |
| 10/03/2007 | CN100340604C Thermosetting resin composition for high speed transmission circuit board |
| 10/02/2007 | US7276563 Polyphenylene ether oligomer compound, derivatives thereof and use thereof |
| 10/02/2007 | US7276562 Protective encapsulating material, free from dust attraction and exhibits low elasticity, crack resistance, adhesion properties |
| 10/02/2007 | CA2296389C Hydroxy-functional oligomers for high solids coatings |
| 09/27/2007 | WO2007108242A1 Epoxy resin curable composition for prepreg |
| 09/27/2007 | WO2007107288A1 Use of a substituted guanidine compound as a hardener for epoxy resins |
| 09/27/2007 | WO2007107192A2 Paint composition, in particular anti-corrosive paint for rare earth permanent magnets |
| 09/27/2007 | US20070225465 Composition for Sealing Optical Semiconductor, Optical Semiconductor Sealing Material, and Method for Producing Composition for Sealing Optical Semiconductor |
| 09/27/2007 | US20070225458 cationic polymerization catalysts; acid generators; storage stability |
| 09/27/2007 | US20070225453 Polyacrylic Hydrazide and Crosslinking Agent or Curing Agent for Resin |
| 09/27/2007 | US20070225437 Aromatic-free polysiloxane containing at least 2 epoxy groups, 1,3-bis((3-m-hydroxyphenyl)propyl)-1,3-dimethyldisiloxane, and a curing accelerator; cured product has high flexibility and improved adhesive characteristics |
| 09/27/2007 | US20070225395 Thermally stable cationic photocurable compositions |
| 09/27/2007 | US20070224337 Process For Coating Electrically Conductive Subsstrates |
| 09/27/2007 | US20070223868 Photosensitive Resin Composition for Optical Waveguide Formation and Optical Waveguide |
| 09/27/2007 | US20070221890 Phosphorus Containing Compounds Useful for Making Halogen-Free, Ignition-Resistant Polymer |
| 09/27/2007 | US20070221712 Thermosetting flux and solder paste |
| 09/26/2007 | EP1837358A1 Latent curing agent |
| 09/26/2007 | EP1837357A1 Actinic ray curable composition, actinic ray curable ink, method of image forming therewith, inkjet recording apparatus and epoxy compound |
| 09/26/2007 | EP1695989B1 Curable composition |
| 09/26/2007 | EP1559735B1 Sealing material for liquid crystal and liquid crystal display cell using same |
| 09/26/2007 | CN101044432A Alkali development-type photosensitive resin composition, substrate with projections for liquid crystal division alignment control formed using the same, and liquid crystal display device |
| 09/26/2007 | CN101044185A Photosensitive compositions based on polycyclic polymers |
| 09/26/2007 | CN101044184A Radiation curable resin, liquid crystal sealing material, and liquid crystal display cell using same |
| 09/26/2007 | CN101044183A Polyepoxy compound, method for producing same, thermosetting resin composition containing same, cured product of such composition, and method for removing such cured product |
| 09/26/2007 | CN100339421C Carbon fiber-reinforced resin composite materials |
| 09/26/2007 | CN100339412C Granular epoxy, its producing method and granular epoxy resin package |
| 09/20/2007 | WO2007105795A1 Phenoxy resin for optical material, resin composition for optical material, resin film for optical material, and optical waveguide using those |
| 09/20/2007 | WO2007105781A1 Thermosetting resin composition and uses thereof |
| 09/20/2007 | WO2007105713A1 Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film |
| 09/20/2007 | WO2007105556A1 Curable composition for optical material and optical waveguide |
| 09/20/2007 | WO2007105357A1 Epoxy resin composition for sealing of semiconductor and semiconductor device |
| 09/20/2007 | US20070218305 Photosensitive Resin Composition, Cured Product Thereof and Production Method of Printed Circuit Board Using the Same |
| 09/20/2007 | US20070216040 Epoxy Resin Composition for the Encapsulation of Semiconductors and Semiconductor Devices |
| 09/20/2007 | DE102006043357A1 Photoempfindliche, hitzehärtbare Harzzusammensetzung, mit einem mit Resistfilm überzogene, geglättete, gedruckte Schaltungsplatine und Verfahren zu ihrer Herstellung A photosensitive thermosetting resin composition, with a resist film coated, smoothed, and printed circuit board processes for their preparation |
| 09/20/2007 | DE102006012550A1 Verwendung einer substituierten Guanidin-Verbindung sowie deren Salze oder Hydrate als Härter für Epoxidharze Use of a substituted guanidine compound and their salts or hydrates as a curing agent for epoxy resins |
| 09/19/2007 | EP1835333A1 Liquid crystal sealing material and liquid crystal display cells made by using the same |
| 09/19/2007 | EP1834977A1 Optical refractive index-modifying polymer composition, hologram recording material and method of controlling refractive index |
| 09/19/2007 | CN101040221A Composition for forming bottom anti-reflective coating containing aromatic sulfonic acid ester compound and light photoacid-generating agent |
| 09/19/2007 | CN101040025A 环氧粘合剂组合物 Epoxy adhesive composition |
| 09/19/2007 | CN101040017A Aqueous epoxy resin systems |
| 09/19/2007 | CN101039984A 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device |
| 09/19/2007 | CN101037529A Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same |
| 09/19/2007 | CN100338155C Carboxy-functional crosslinkers for epoxy-functional powder-lacquer binding agents |
| 09/19/2007 | CN100338110C Organoborane amine complex polymerization initiators and polymerizable compositions |
| 09/19/2007 | CN100337697C Medical device lubricant comprising radiation curable silicon material |
| 09/18/2007 | US7271225 having high flame retardancy; having a structural unit derived from a secondary phosphine preferably at least one selected from 1,4-cyclooctylenephosphine oxide and 1,5-cyclooctylenephosphine oxide |
| 09/18/2007 | US7271224 Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same |
| 09/18/2007 | US7270936 Negative resist composition comprising hydroxy-substituted base polymer and Si-containing crosslinker having epoxy ring and a method for patterning semiconductor devices using the same |
| 09/18/2007 | CA2353041C Matte texture powder coatings |
| 09/13/2007 | WO2005080462A3 Silane formulation for moisture-crosslinking hybrid adhesives and sealants |
| 09/13/2007 | US20070213427 Uv Hardening Glass Printing Ink And Uv Hardening Glass Printing Lacquer And Method For Printing A Glass Substrate |
| 09/13/2007 | US20070211111 Ink composition, inkjet recording method, printed material, and process for producing lithographic printing plate |
| 09/12/2007 | EP1832617A2 Polyfunctional phenylene ether oligomer, derivative thereof, resin composition containing the same, and use thereof |
| 09/12/2007 | EP1832615A2 Adhesive composition |
| 09/12/2007 | EP1831281A1 Optoelectronic molding compound that transmits visible light and blocks infrared light |
| 09/12/2007 | EP1408083B1 Curable epoxy resin composition |
| 09/12/2007 | CN101035830A Curing agents for epoxy resins |
| 09/12/2007 | CN100336864C 环氧树脂组合物 The epoxy resin composition |
| 09/12/2007 | CN100336841C Epoxy resin roughening and curing agent |
| 09/12/2007 | CN100336840C Epoxy resin curing compositions and resin compositions including same |
| 09/12/2007 | CN100336838C Epoxy resin compositions, methods of preparing, and articles made therefrom |
| 09/11/2007 | US7268192 Process for producing high-purity epoxy resin and epoxy resin composition |
| 09/11/2007 | US7268191 Mixing an epoxy resin, a phenol resin, and a hardening accelerator, under a reduced pressure and under a heating condition and then mixing |