| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 11/21/2007 | EP1325937B1 Epoxy resin composition, process for producing fiber -reinforced composite materials and fiber-reinforced composite materials |
| 11/21/2007 | CN101074311A Production of micron-solid epoxy-resin microsphere containing surface active group |
| 11/21/2007 | CN101074129A Production of flocculating agent containing fluorine cation |
| 11/21/2007 | CN100349962C Siloxane copolymer, making method, and thermosetting resin composition |
| 11/21/2007 | CN100349949C Multi-metal cyanide complex catalyst and preparation thereof |
| 11/21/2007 | CN100349948C Method of preparation of a water based epoxy curing agent |
| 11/21/2007 | CN100349947C Latent hardener, process for producing the same, and adhesive containing latent hardener |
| 11/21/2007 | CN100349903C NOvel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, compositions and laminates devived therefrom |
| 11/20/2007 | US7297448 Data storage medium comprising colloidal metal and preparation process thereof |
| 11/20/2007 | US7297192 Triazine-phenolic resin, melamine or melamine cyanurate, and zinc borate, zinc molybdate, or a metal hydroxide; halogen free |
| 11/20/2007 | CA2511566C Manufacture of void-free laminates and use thereof |
| 11/20/2007 | CA2192368C Curable compositions |
| 11/15/2007 | WO2007129662A1 Insulating material, process for producing electronic part/device, and electronic part/device |
| 11/15/2007 | US20070265427 liquid thermosetting polyepoxides to seal optical semiconductor; polycarbonate; free from curing failure, optically homogenous, low elastic modulus in bending, high bending strength, high glass transition temperature, high optical transparency; |
| 11/15/2007 | US20070264506 Epoxy Resin Compositions Containing Mannich Bases, Suitable for High-Temperature Applications |
| 11/15/2007 | US20070261883 Methods For Improving The Flux Compatibility Of Underfill Formulations |
| 11/14/2007 | EP1854819A1 Epoxy resin composition, cured object obtained therefrom, semiconductor-encapsulating material, novel phenolic resin, and novel epoxy resin |
| 11/14/2007 | CN101073037A Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same |
| 11/14/2007 | CN101072808A Method for producing acid anhydride based epoxy resin curing agent, acid anhydride based epoxy resin curing agent, epoxy resin composition, cured article therefrom and optical semiconductor device |
| 11/14/2007 | CN101072807A 热固性环氧树脂组合物及其用途 Thermosetting epoxy resin composition and use thereof |
| 11/14/2007 | CN101070373A Epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic components, stabilizers for electrical insulating |
| 11/14/2007 | CN101070372A Resin-modified method epoxy resin and preparing method |
| 11/14/2007 | CN100348639C High-temperature-resistant bisphenolA-glycidol ether epoxy resin system and production thereof |
| 11/13/2007 | US7294915 Underfill and mold compounds including siloxane-based aromatic diamines |
| 11/13/2007 | CA2248304C Surface modified carbonate materials |
| 11/08/2007 | WO2007127032A2 One-part uv and abrasion resistant pigmented surfacing film composition for prepregs |
| 11/08/2007 | WO2007126637A2 Process for the preparation of powder coatings on heat-sensitive substrates |
| 11/08/2007 | WO2007126130A1 Solder resist material, wiring board using the solder resist material, and semiconductor package |
| 11/08/2007 | WO2007126066A1 Photopolymerization initiator and photocurable composition |
| 11/08/2007 | WO2007125979A1 Resin composition, prepreg, laminate, and wiring board |
| 11/08/2007 | WO2007125956A1 Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device |
| 11/08/2007 | WO2007125929A1 Epoxy resin composition for fiber-reinforced composite material |
| 11/08/2007 | WO2007125890A1 Adamantyl group-containing epoxy-modified (meth)acrylate and resin composition containing the same |
| 11/08/2007 | WO2007125795A1 Active ray curable composition, active ray curable inkjet ink, image forming method using the active ray curable inkjet ink, and inkjet recording apparatus |
| 11/08/2007 | WO2007125759A1 Epoxy resin composition, fiber-reinforced composite material and method for producing the same |
| 11/08/2007 | WO2007125635A1 Resin composition for semiconductor encapsulation and semiconductor device |
| 11/08/2007 | WO2007124911A1 Radiation curable resin composition and rapid three dimensional imaging process using the same |
| 11/08/2007 | US20070259993 Process for producing polyphenylene ether composition |
| 11/08/2007 | CA2650563A1 Epoxy resin composition for fiber-reinforced composite material |
| 11/08/2007 | CA2649841A1 Resin composition, prepreg, laminate, and wiring board |
| 11/08/2007 | CA2643308A1 Process for the preparation of powder coatings on heat-sensitive substrates |
| 11/07/2007 | EP1852479A1 Method for protecting dynamically loaded surfaces and coating therefor |
| 11/07/2007 | EP1852452A1 Latent hardener for epoxy resin and epoxy resin composition |
| 11/07/2007 | EP1852451A1 Epoxy resin, hardenable resin composition containing the same and use thereof |
| 11/07/2007 | CN101068891A Near infrared radiation curable powder coating composition having enhanced flow characteristics |
| 11/07/2007 | CN101068846A 环氧树脂组合物及半导体器件 Epoxy resin composition and semiconductor device |
| 11/07/2007 | CN101068845A Composition, cured product and article |
| 11/07/2007 | CN101068844A Radiation curable, sprayable coating compositions |
| 11/07/2007 | CN101066909A Crude product of glyceryl, its purification method and application in producing dichloropropanol |
| 11/07/2007 | CN100347220C Preparation of novel composite initiator and copolymerization of epoxide and cyclic ether and homopolymerization of epoxide initiated by same |
| 11/06/2007 | US7291690 Process for production of living radical polymers and polymers |
| 11/06/2007 | US7291684 Curable epoxidized phenolic resins containing biphenylene groups, an inorganic filler, a curing accelerator, a silane coupler, and and a dihydroxyaromatic compound; low viscosity for improved flowability without deterioration of curing; fireproofing; heat resistance (soldering); anticracking agents |
| 11/06/2007 | US7291402 Surface-treated steel sheets of good white rust resistance, and method for producing them |
| 11/01/2007 | WO2007122980A1 Active energy ray-curable resin composition and film coated with the composition |
| 11/01/2007 | WO2006116033A8 Method for preparing tomato sauce and pasta |
| 11/01/2007 | US20070255238 Hemostatic Polymer Useful for Rapid Blood Coagulation and Hemostasis |
| 11/01/2007 | US20070254986 Epoxy Resin Molding Material for Sealing and Electronic Component |
| 11/01/2007 | US20070251422 Hollow Resin Fine Particles, Organic/Inorganic Hybrid Fine Particles, and Method for Producing Hollow Resin Fine Particles |
| 10/31/2007 | EP1849831A2 Epoxy-Polysiloxane Polymer Composition |
| 10/31/2007 | EP1849808A1 Cationically curable composition and cured product thereof |
| 10/31/2007 | EP1848754A1 Low shrinkage amine-curing epoxy resin compositions comprising a lactone |
| 10/31/2007 | EP1660595B1 Curable alkanolamine-containing epoxy powder coating composition |
| 10/31/2007 | EP1412445B1 Polysilazane-modified polyamine hardeners for epoxy resins |
| 10/31/2007 | EP1310525B1 Copper foil with resin and printed wiring boards made by using the same |
| 10/31/2007 | EP1172393B1 Curable resin composition, process for producing the same, and coated object made with the same |
| 10/31/2007 | CN101065708A Method for forming photoresist pattern using double layer antireflection film |
| 10/31/2007 | CN101065415A Curable diamantane compound |
| 10/30/2007 | US7288606 Useful for casting out optoelectronic components; acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak |
| 10/25/2007 | WO2007120759A2 Silicone modified polyurea |
| 10/25/2007 | WO2007120203A2 Flame retardant compositions with a phosphorated compound |
| 10/25/2007 | WO2007119809A1 Curing accelerator for deep ultraviolet transmitting epoxy resin, deep ultraviolet transmitting epoxy resin composition, and deep ultraviolet transmitting epoxy resin cured product |
| 10/25/2007 | WO2007119651A1 Alkaline development-type solder resist, cured product of the same, and print circuit board produced using the same |
| 10/25/2007 | WO2007118645A1 Resin dispersion |
| 10/25/2007 | WO2007118507A1 Halogen-free flame-retardant epoxy resin formulations |
| 10/25/2007 | US20070249760 Modified Epoxy Resin Composition |
| 10/24/2007 | EP1786849B1 Polyaminoamide-monoepoxy adducts |
| 10/24/2007 | EP1761581B1 Curing agents for epoxy resins |
| 10/24/2007 | EP0978542B1 Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device |
| 10/24/2007 | EP0954547B1 Epoxy-polysiloxane polymer composition |
| 10/24/2007 | CN101061577A Flip-chip system and method of making same |
| 10/24/2007 | CN101061183A Thermoplastic resin composition and forming article |
| 10/24/2007 | CN101058709A Epoxy resin molding material for sealing use and semiconductor device |
| 10/24/2007 | CN100344695C Resin-coated copper foil, and sprinted wiring board using resin-coated copper foil |
| 10/23/2007 | US7285616 Aromatic polymer, method for producing the same and uses thereof |
| 10/23/2007 | US7285602 Granular epoxy resin, production method thereof, and granular epoxy resin package |
| 10/23/2007 | US7285579 Solventless, non-polluting radiation curable coatings |
| 10/23/2007 | US7285375 Photosensitive composition, photosensitive lithography plate and method for producing lithography plate |
| 10/23/2007 | CA2204913C Thermosetting compositions with improved waiting time, preparation and uses |
| 10/18/2007 | US20070244268 Hardener for Epoxy Resin and Epoxy Resin Composition |
| 10/18/2007 | US20070241436 Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device |
| 10/17/2007 | EP1845130A2 Hydrophobic crosslinkable compositions for electronic applications |
| 10/17/2007 | EP1844085A1 Composition containing a hydrogenated bisglycidyl ether and a cross-linking agent |
| 10/17/2007 | EP1581577B1 Castor oil/epoxidized soybean oil based elastomeric compositions |
| 10/17/2007 | EP1581573B1 Water-based epoxy grout |
| 10/17/2007 | EP1444283B1 Autodepositing anionic epoxy resin water dispersion |
| 10/17/2007 | EP1419191B1 Process for the preparation of activated polyethylene glycols |
| 10/17/2007 | EP1112298B1 Thermosetting compositions containing epoxy-functional polymers prepared using atom transfer radical polymerization |
| 10/17/2007 | CN101056932A Polyetheralkanolamine dispersants |
| 10/17/2007 | CN101054437A Method of preparing hydrogenated terpinene maleic anhydride glycidyl ester type epoxy resin |
| 10/17/2007 | CN100343302C Flame-retardant epoxy resin composition and cured product obtained therefrom |