Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
06/2007
06/21/2007US20070142491 photocationic polymerized epoxy resin having a a high crosslinking density being the cured product of an epoxy resin including a dicyclopentadiene skeleton and a polyepoxide having a high number of epoxy groups; antiswelling agents;waterproofing; dimensional stability; ink jet printing head; patterns
06/21/2007US20070141507 Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof
06/20/2007EP1798249A1 Curing agent composition for epoxy resins and epoxy resin composition
06/20/2007EP1485416B1 Hail-resistant acrylic laminated glass and method for producing the same
06/20/2007CN1984961A 环氧树脂组合物及半导体装置 Epoxy resin composition and semiconductor device
06/20/2007CN1984959A Comb-like polyetheralkanolamines in inks
06/20/2007CN1984938A Photocurable/thermosetting resin composition and cured product thereof
06/20/2007CN1982356A Epoxypropoxy end capped polyether and phenyl comodified polysiloxane, and preparation and use thereof
06/20/2007CN1322580C 胶粘带 Adhesive tape
06/20/2007CN1322371C Solid imaging compsns. for preparing polypropylene-like articles
06/20/2007CN1322079C Aqueous non-ionically stabilised epoxy resins
06/20/2007CN1322056C Heat-curable resin composition and use thereof
06/19/2007US7232877 Reacting epoxy compound with carbon dioxide in presence of catalyst; low temperature, low pressure ; turbine mixing device; star oligomer
06/19/2007CA2282640C Process for making double metal cyanide catalysts
06/14/2007WO2007066763A1 Liquid resin composition for electronic element and electronic element device
06/14/2007US20070135616 Production of method of granular epoxy resin, and granular epoxy resin package
06/14/2007US20070134498 Resin composition for protective film
06/14/2007US20070132947 Method of manufacturing a replica as well as a replica obtained by carrying out an uv light-initiated cationic polymerization
06/13/2007EP1795558A1 Modified epoxy resin composition
06/13/2007EP1795550A1 Epoxy resin composition for optical semiconductor encapsulation
06/13/2007EP1795549A1 Polymerizable composition
06/13/2007EP1795548A1 Curable diamantane compound
06/13/2007EP1648950B1 Thermohardening compositions comprising low-temperature impact strength modifiers
06/13/2007EP1171502B1 Resin composition for photofabrication of three dimensional objects
06/13/2007CN1980973A Curing agents for epoxy resins
06/13/2007CN1980972A Epoxy resin, method for producing same and epoxy resin composition therof
06/13/2007CN1980970A 改性聚酰亚胺树脂和可固化的树脂组合物 Modified polyimide resin and a curable resin composition
06/13/2007CN1980969A Stable cationically crosslinkable/polymerizable dental composition with a high filler content
06/13/2007CN1978525A Epoxy/layersilicate hano composite material, and its preparing method
06/13/2007CN1978493A Method for synthesizing liquid rubber-epoxy resin polymer
06/13/2007CN1978483A Active epoxy toughening-curing agent, and its preparing method
06/13/2007CN1321144C Low-cure powder coatings and methods for using the same
06/12/2007US7230122 Arylsulfonium salts of 1-halothioxanthones and 2-decyl-1-tetradecyl bromide as an intermediate for their preparation; photocurable adhesive, coating or sealant compositions
06/12/2007US7230068 water-soluble compound that includes a polyether or vinyl ether with at least one terminal azide moiety; for linkage of water soluble polymers to a therapeutic agent
06/12/2007US7230052 Epoxy resin composition and fiber reinforced composite material using epoxy resin composition
06/12/2007US7230043 Hydrophilic polymer composition
06/12/2007US7229529 Low odor binders curable at room temperature
06/12/2007CA2170067C Solventless resin composition having minimal reactivity at room temperature
06/07/2007WO2007064366A1 Expandable sealant for fasteners
06/07/2007WO2007063947A1 Phenol resin composition, cured product thereof, resin composition for copper clad laminate, copper clad laminate and novel phenol resin
06/07/2007WO2007063894A1 Phenolic resin, process for production thereof, epoxy resin, and use thereof
06/07/2007WO2007063652A1 Photoacid generator composition, cationically photopolymerizable composition, inkjet ink and inkjet recording method using same
06/07/2007WO2007063580A1 Halogen-free epoxy resin composition, cover lay film, bonding sheet, prepreg, laminated sheet for printed wiring board
06/07/2007WO2007062853A1 Use of 1-(n'-cyanoguanyl) derivates of n-containing five-membered heterocyclic rings as hardeners for epoxy resin compositions
06/07/2007WO2007043684A9 Phenol polymer, production method thereof and use thereof
06/07/2007WO2007038764A3 Epoxy based oil free root canal sealer
06/07/2007CA2631137A1 Expandable sealant for fasteners
06/06/2007EP1792961A1 Low-cure powder coatings, related coating method and coated substrates
06/06/2007EP1216266B1 Transparent liquid resin material for smt-enabled led-applications at higher temperatures and higher luminosities
06/06/2007DE102005057590A1 Verwendung von 1-(N'-Cyanoguanyl)-Derivaten N-haltiger Fünfringheterozyklen als Härter für Epoxidharzmassen Using 1- (N'-Cyanoguanyl) derivatives N-containing five-membered ring heterocycles as a hardener for epoxide resin
06/06/2007DE102005029792B4 Härtungsmittel für wässrige Epoxidharz-Dispersionen A curing agent for aqueous epoxy resin dispersions
06/06/2007DE10151469B4 Stoff zur Hydrophobierung nativer Einwegmaterialien und Verfahren zu seiner Herstellung Fabric for hydrophobicizing native disposable materials and process for its preparation
06/06/2007CN1977018A Viscous chemical anchoring adhesive
06/06/2007CN1976968A Flexible, impact resistant primer
06/06/2007CN1976592A Vendable sandwich and food products
06/06/2007CN1974546A Diphenol derivative containing aromatic schiff base and ether band structure and its prepn and application
06/06/2007CN1320020C Epoxy resin complex with long chemical storage stability and temperature thixotropy
06/06/2007CN1320019C Epoxy resin composition for sealing optical semiconductor
06/06/2007CN1319876C Method for preparing biodegradable water treatment agent PECS
06/05/2007US7226981 Curing agent composition for epoxy resin
06/05/2007US7226976 Low temperature curing; storage stability; comprises: a radically polymerized polymer of a monomer having at least one polymerizable double bond, which polymer has at least one tertiary amino group; anda polymer having at least one hydroxyl group and at least one urethane and/or urea bond
06/05/2007US7226725 Using the negative resist composition in a bilayer resist process to form fine patterns
06/05/2007CA2253242C Photopolymerizable thermosetting resin composition
05/2007
05/31/2007WO2007061080A1 Curable composition
05/31/2007WO2007061037A1 Liquid resin composition for electronic component and electronic component device
05/31/2007WO2007060091A1 Curing agent for epoxy resins
05/31/2007US20070123693 Polymer derivatives
05/31/2007US20070123691 polyoxyalkylene glycol or polyvinyl alcohol with a terminal azide moiety
05/31/2007US20070123684 Epoxy compound, preparation method thereof, and use thereof
05/31/2007US20070123600 Actinic ray curable composition, actinic ray curable ink, and image formation process employing the same
05/31/2007US20070119745 Curable; for fixing fibres, scrims, fabrics or composites, for reinforcing buildings, for example walls or ceilings or floors; or for fixing building components, such as panels or blocks made of stone, glass or plastics; after curing, large tolerance range for temperatures; high bond stress value
05/30/2007EP1303568B1 Method of manufacturing a replica as well as a replica obtained by carrying out a uv light-initiated cationic polymerization
05/30/2007CN1972978A Epoxy resin, epoxy resin composition and cured product thereof
05/30/2007CN1971888A Adhesives and electric devices
05/30/2007CN1970671A Adhesives and electric devices
05/30/2007CN1970599A SU-8 epoxy resin separation method
05/30/2007CN1318490C Solidifying promoter, epoxy resin composition and semiconductor device
05/30/2007CN1318486C Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers
05/30/2007CN1318474C Photocurable and thermosetting resin composition and printed circuit boards made by using the same
05/30/2007CN1318473C Unsaturated polybranched compounds, curable compositions containing the same and cured articles thereof
05/29/2007US7223820 Amine hardener for epoxy resins
05/24/2007WO2007037500A9 Epoxy resin composition and semiconductor device
05/24/2007WO2007006425A3 Powder paint composition
05/24/2007US20070116938 Polymer composite formed article, printed wiring board using the formed article, and methods of producing them
05/23/2007EP1788060A1 Adhesive composition
05/23/2007EP1786866A1 Polymer resin composition
05/23/2007EP1786849A1 Polyaminoamide-monoepoxy adducts
05/23/2007CN1966605A Amphoteric ion polymeric alcohol for drilling fluid and its preparation method
05/23/2007CN1966571A Preparation method of epoxy resin base micron to nano grade pore gelatin
05/23/2007CN1966545A Enzymatic hydrolysis lignin epoxy resin material formula and its preparation method
05/23/2007CN1317353C Liquid crystal display sealing material using plastic substrate
05/23/2007CN1317314C Cross-linked polyoxy functional resin and functionated derivatives
05/22/2007US7220819 Electroluminescent conjugated polymers containing phosphorescent moieties and the application thereof in LED
05/22/2007US7220785 Anisotropically conductive adhesive comprising crushable microcapsules adhered to a surface of conductive particles
05/18/2007WO2007055134A1 Photosensitive resin composition for optical waveguide formation, optical waveguide and method for producing optical waveguide
05/17/2007US20070112210 Heterogeneous ruthenium catalyst, methods for hydrogenating a carbocyclic aromatic group, and nucleus-hydrogenated diglycidyl ether of bisphenols a and f
05/17/2007US20070112145 Storage stability; polyoxyalkylene glycol containing active silicon groups and alkyl acrylate copolymer; bonding strength
05/16/2007EP1785441A1 Epoxy resin composition, products of curing thereof, material for the encapsulation of semiconductors, novel phenol resin, novel epoxy resin, process for production of novel phenol resin and process for production of novel epoxy resin
05/16/2007EP1785440A1 Curable resin composition, shaped article and method for producing same
05/16/2007EP1456334B1 Cleaning agent composition comprising polymers containing nitrogen