Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
05/2008
05/14/2008CN101177478A Linetype bisphenol F phenolic epoxy resin and preparation method thereof
05/14/2008CN101177477A Epoxy resin catalytic refining process
05/14/2008CN100387668C Epoxy compositions having improved shelf life and articles containing the same
05/14/2008CN100387652C Resin composition for protective film
05/14/2008CN100387631C Novel resin-curing process enabling the actinic radiation cure of resins containing shieldings against actinic radiations, composition for the process, moldings and molding process
05/14/2008CN100387373C Foundry binder of epoxy resin, acrylated polyisocyanate and acrylic monomer and/or polymer, and cold-box process
05/08/2008WO2008054034A1 Method for manufacturing epoxy nanocomposite material containing vapor-grown carbon nanofibers and its products thereby
05/08/2008WO2007145807A3 Oligomeric halogenated chain extenders for preparing epoxy resins
05/08/2008US20080109922 Coated seeds and materials for seed coating
05/08/2008US20080108761 Epoxy resin composition for fiber reinforced composite material, a production method for fiber reinforced composite material, and a fiber reinforced composite material
05/08/2008US20080108726 Polycarboxylic acid resins, their compositions, and their cured products
05/08/2008US20080108725 4-dodecyl-1.2-cyclohexene oxide gives a cured epoxy resin having a low refractive index and excellent transparency, curability, mold release properties, and mechanical properties; actinic radiation photosensitivity, heat thermosensitivity
05/08/2008US20080108720 Method for manufacturing monosulfonium salt, cationic polymerization initiator, curable composition, and cured product
05/08/2008DE112006001776T5 Verfahren zur Herstellung eines mikropartikulären Härtungskatalysators A process for preparing a microparticulate curing catalyst
05/07/2008EP1918341A1 Adhesive film and semiconductor device using same
05/07/2008EP1918316A1 Photo-curable resin composition
05/07/2008EP1917316A1 Coating mass
05/07/2008EP1597332B1 Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices
05/07/2008EP1344109B1 Onium salts and the use therof as latent acids
05/07/2008EP1280868B1 Rigid substrate lamination adhesive
05/07/2008CN101175788A Hardenable composition and novel adamantane compound
05/07/2008CN101173086A Curing agent for low temperature cure applications
05/07/2008CN101173036A Method for producing aquosity cashew shell liquid solidifying agent
05/07/2008CN101173033A Method for producing expediting setting type aquosity ultraviolet light solidifying composition
05/07/2008CN100386356C Improved epoxy acrylic ester and its preparation method
05/07/2008CN100386298C Novel phenol compound and novel epoxy resin derivable from such phenol compound
05/06/2008CA2244979C Proton conductor in liquid form
05/02/2008WO2008051373A2 Curable epoxy resin composition having improved adhesion to metal substrates and process for making coated and fiber-reinforced composite article
05/02/2008WO2008049860A1 Derivatized solid epoxy resin and uses thereof
05/01/2008US20080103287 Thermoplastic elastomer and thermoplastic elastomer composition
05/01/2008US20080103269 Substrate adhesion, reduced cure temperatures, simple production; electrocoatings
05/01/2008US20080103268 Metal coordinating and film-forming materials
05/01/2008US20080103236 Lubricating oil additive composition and method of making the same
05/01/2008US20080103224 Film-forming mixture of bisphenol-epichlorohydrin copolymer or a polyester, a black NIR absorbing pigment, other than carbon black, and a curing agent; useable on heat sensitive substrates and forms finishes with significantly reduced orange peel, excellent smoothness and good gloss
05/01/2008US20080102284 Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same
05/01/2008US20080099955 Method Of Making High Temperature Resistant Models Or Tools
04/2008
04/30/2008EP1916285A1 Derivatized solid epoxy resin and its use
04/30/2008EP1745096B1 Thermohardenable epoxy resin-based compositions, 3(4)-(aminomethyl)-cyclohexane-propanamine and 1,4(5)-cyclooctane dimethanamine
04/30/2008CN101171279A Epoxy resin, method for producing same and use thereof
04/30/2008CN100384903C Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate board
04/29/2008US7365147 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin
04/24/2008WO2008047613A1 Epoxy resin, method for producing the epoxy resin, epoxy resin composition using the epoxy resin, and cured product of the epoxy resin composition
04/24/2008WO2008028827A3 Base material for photostructureable resists and dielectrics
04/24/2008US20080097047 Composition comprising ionomer and polyamide
04/24/2008US20080097046 Resin composition
04/24/2008US20080093021 Two-Component Adhesive for Fabrication of Semifinished Products and Sandwich Composites
04/23/2008EP1914811A1 Light-emitting device, method for manufacturing same, molded body and sealing member
04/23/2008EP1914266A1 Prepreg
04/23/2008EP1914257A1 Curing agent for low temperature cure applications
04/23/2008EP1914256A1 Composition, actinic energy radiation hardenable composition and epoxy compound
04/23/2008EP1913050A2 Thermally curable precursor of a toughened thermo-expanded film and a film made thereof
04/23/2008CN101166791A Curable silicone composition and cured product therefrom
04/23/2008CN101166789A Composition containing fluorine-containing aromatic polymer and laminated body containing fluorine-containing aromatic polymer
04/23/2008CN101166778A Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof
04/23/2008CN101166775A Epoxy resin and epoxy resin composition
04/23/2008CN101165076A Anti-flaming phosphorus-containing epoxy resin, preparation method thereof and composition containing the same
04/23/2008CN101165060A Method for modifying heat-proof plasticizing methyl nadic anhydride
04/23/2008CN100383665C Onium salts and the use therof as latent acids
04/23/2008CN100383172C Halogen-free phosphorus-free flame-retardant epoxy resin semi-cured composition and flame-retardant epoxy resin composition
04/22/2008US7361290 Electroconductive resin, composition useful for forming electroconductive resin, and method of producing electroconductive resin
04/22/2008US7360883 Active ray curable ink, image forming method and ink-jet recording apparatus
04/22/2008CA2379584C Method for producing flat articles from renewable raw materials
04/17/2008WO2008045894A1 Soluble polymers with low conversion of acids from aromatic epoxy resins and diacids and crosslinked coatings prepared therefrom
04/17/2008WO2008045892A1 Cyclic anhydride grafted epoxy resins and thermoset derivatives derived therefrom
04/17/2008WO2008045889A1 Process for preparing soluble polymers with low conversion of acid from aromatic epoxy resins and diacids and process for preparing crosslinked coatings therefrom
04/17/2008WO2008045884A1 Process for preparing soluble polymers with high conversion of acid from aromatic epoxy resins and diacids and process for preparing crosslinked coatings therefrom
04/17/2008WO2008045882A1 Soluble polymers with high conversion of acid from aromatic epoxy resins and diacids and crosslinked coatings prepared therefrom
04/17/2008WO2008044766A1 Resin composition
04/17/2008WO2008044579A1 Epoxy resin composition for sealing of semiconductor and semiconductor device
04/17/2008WO2008044496A1 Liquid resin composition for electronic part sealing and electronic part apparatus utilizing the same
04/17/2008WO2008044397A1 Transparent composite sheet
04/17/2008WO2007090313A3 Air humidifier and evaporation mat contained therein
04/17/2008US20080090990 Modified cyclic aliphatic polyamine
04/17/2008DE19524297B4 Verfahren zum Schützen der Oberfläche einer Doppelgelenkmanschette A method for protecting the surface of a double articulated cuff
04/17/2008DE102005015605B4 Phosphororganische Verbindungen enthaltende Prepolymere und Verwendungen dafür Organophosphorus compounds containing prepolymers and uses therefor
04/16/2008EP1911784A1 Silica nanoparticles thermoset resin compositions
04/16/2008EP1911579A1 Epoxy resin composition for encapsulating semiconductor device and thin semicondutor device
04/15/2008US7358312 High solid coatings; adhesives
04/10/2008WO2008041749A1 Epoxy resin, phenol resin, their production methods, epoxy resin composition and cured product
04/10/2008WO2008041555A1 Epoxy resin molding material for sealing and electronic component device
04/10/2008WO2008041547A1 Ultraviolet-curable composition for optical disk and optical disk
04/10/2008WO2008041453A1 Thermosetting resin composition and prepreg and laminate obtained with the same
04/10/2008WO2008041409A1 Cation-polymerizable resin composition containing multi-branched polyether polyol, adhesive agent comprising the composition, and laminate and polarizing plate using the adhesive agent
04/10/2008WO2008040963A1 Composite materials with improved performance
04/10/2008US20080085844 Method and composition for recovering hydrocarbon fluids from a subterranean reservoir
04/10/2008CA2664927A1 Composite materials with improved performance
04/09/2008EP1907486A1 Film-forming compositions derived from acyclic carbonates and polyamines
04/09/2008EP1907436A1 Composition
04/09/2008EP1523529B1 Process of manufacture of powder coatings compositions crosslinked with an acid functional reaction product of tris (2-hydroxiethyl) isocyanurate and a cyclic anhydride
04/09/2008CN101160549A Composition comprising polymer having ethylene-dicarbonyl structure for use in forming anti-reflective coating for lithography
04/09/2008CN101157751A Aqueous epoxy resin and preparation method and method for preparing varnish by using aqueous epoxy resin
04/09/2008CN100379831C Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby
04/09/2008CN100379787C Epichlorohydrin amine polymers used for treating the surface of leather
04/09/2008CN100379781C Polyoxazolidone adhesive resin compoistion prepared from polyepoxides and polyisocyanates
04/09/2008CN100379780C Curable resins and curable resin compositions containing the same
04/09/2008CN100379554C Autodeposition compositions
04/08/2008US7354978 Soldering resistance; mixture with phenolic resin, hardener promoter, filler and triazole compound; encapsulating semiconductors
04/08/2008US7354638 Substrate such as paper impregnated with a Lewis acid- or base-catalyzed resorcinol diglycidyl ether resin; has a higher coefficient of friction than material based on a phenol resin; automatic transmission friction assembly
04/08/2008US7354628 Medical device lubricant comprising radiation curable silicon material
04/03/2008WO2008010823A3 Thermoplastic based composites
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