| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 09/11/2007 | US7268181 Curable epoxy resin, hardeners, accelerators with fillers and flexibility agents with colors for potting and crosslinking of polysiloxanes, crosslinking |
| 09/11/2007 | US7268174 Homogeneous alumoxane-LCT-epoxy polymers and methods for making the same |
| 09/11/2007 | US7268171 Water-based coating composition curable with actinic energy ray, coated metallic material with cured film of the composition, production process, and method of bonding coated metallic material |
| 09/11/2007 | US7267877 Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same |
| 09/11/2007 | CA2422166C Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers |
| 09/11/2007 | CA2349139C Cationic resin composition |
| 09/07/2007 | WO2007100734A2 A halogen-free phosphorous epoxy resin composition |
| 09/07/2007 | WO2007099753A1 Active ray-curable composition, active ray-curable inkjet ink using same, image-forming method and inkjet recording apparatus |
| 09/07/2007 | WO2007099674A1 Epoxy resin composition, hardening product thereof, novel epoxy resin, novel phenolic resin and semiconductor sealing material |
| 09/07/2007 | WO2007099670A1 Process for producing phenolic resin and process for producing epoxy resin |
| 09/06/2007 | US20070208106 Cationically Curable Epoxy Resin Composition |
| 09/05/2007 | EP1829936A1 Active ray-curable composition, active ray-curable ink and image-forming method |
| 09/05/2007 | EP1829909A1 Method for producing branched polyether resin composition and method for producing acid-pendant branched polyether resin composition |
| 09/05/2007 | EP1546231B1 Solvent-borne two component modified epoxy-aminosilane coating composition |
| 09/05/2007 | EP1303567B2 Volume-modified casting compounds based on polymeric matrix resins |
| 09/05/2007 | CN101031616A Semiconductor-sealing epoxy resin composition and semiconductor device sealed therewith |
| 09/05/2007 | CN101031602A Epoxy resin composition for sealing optical semiconductor |
| 09/05/2007 | CN100336210C Barrier layer made of a curable resin containing polymeric polyol |
| 09/05/2007 | CN100335524C Alpha, omega end amino polyether used as epoxy resin curing agent and method for preparing the same |
| 09/05/2007 | CN100335523C Process for producing high-purity epoxy resin and epoxy resin composition |
| 09/04/2007 | US7265167 Containing phenolic resin and inorganic filler; preventing short circuiting in devices having reduced pitch distance between interconnection electrodes or wires |
| 08/30/2007 | WO2007097231A1 Process for producing low-molecular polyphenylene ether |
| 08/30/2007 | WO2007097209A1 Epoxy resin composition |
| 08/30/2007 | WO2007097196A1 Flame-retardant resin composition, prepreg using same, resin sheet and molded article |
| 08/30/2007 | US20070203254 Sulfonium salt photoinitiators and use thereof |
| 08/29/2007 | EP1826228A1 Composition capable of cationic polymerization and actinic energy ray curing and method of image forming using the composition |
| 08/29/2007 | EP1826227A1 Thermosetting epoxy resin composition and use thereof |
| 08/29/2007 | EP1106639B1 Photocurable composition containing iodonium salt compound |
| 08/29/2007 | CN101027359A 改性环氧树脂组合物 Modified epoxy resin composition |
| 08/29/2007 | CN101027337A 聚合性组合物 The polymerizable composition |
| 08/29/2007 | CN101027336A Epoxy resin composition, cured product thereof, semiconductor sealing material, new phenolic resin, new epoxy resin, method for producing the new phenolic resin, and method for producing the new epoxy |
| 08/29/2007 | CN101024681A Method for preparing fluorine-contained multi-function epoxy resin |
| 08/29/2007 | CN101024680A Binaphthyl-radicle-contained di-phenol A-type resin and its preparing method |
| 08/29/2007 | CN100334125C High temperature corrosion-resisting resin |
| 08/29/2007 | CN100334124C Organic imvite modified epoxyresin |
| 08/28/2007 | US7262514 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device |
| 08/28/2007 | US7262261 Condensation products of dihydroxyaromatics with di- or polyepoxides alkylolated by reaction with aldehyde; food and beverage packaging; chemical, solvent, and corrosion resistance |
| 08/28/2007 | US7262256 Polycarboxylic acid mixture |
| 08/28/2007 | US7261938 Formed by binding polymers directly to the substrate via epoxy groups, attaching another material through epoxy groups and crosslinking other epoxies; macromolecules, biomolecules, and polymerization initiators may be grafted; smart materials in which the layers have different responses to stimuli |
| 08/23/2007 | WO2007094173A1 Adamantane derivative, composition comprising the derivative, and optical and electronic member using the composition |
| 08/23/2007 | WO2007075927B1 Branched polyglycols and branched polyether functional organopolysiloxanes and coatings containing same |
| 08/23/2007 | US20070197756 Curable Composition And Optical Member Using Same |
| 08/23/2007 | US20070196664 Epoxy resin composition and semiconductor device |
| 08/23/2007 | US20070196612 Liquid epoxy resin composition |
| 08/23/2007 | US20070196589 A crossed-linked, cationically-polymerized resist of epoxy resin containing disiloxane groups and an underlayer bytween the substrate, polymethyl methacrylate, and resist; spin coating; accurately controlled thickness and uniformity; lowviscosity; UV-assisted, Step-and-Flash nanoimprintlithography |
| 08/23/2007 | US20070194274 Low odor binders curable at room temperature |
| 08/23/2007 | CA2654697A1 Method for deprotecting aryl or alkyl sulfonamides of primary or secondary amines |
| 08/22/2007 | EP1819503A1 Continuous pultrusion process for producing high performance structural profiles |
| 08/22/2007 | CN1333011C Curable composition |
| 08/21/2007 | US7259213 Indole resins epoxy resins and resin compositions containing the same |
| 08/16/2007 | WO2007092117A1 Corrosion and alkali-resistant composition and method for coating a metal substrate |
| 08/16/2007 | WO2007091358A1 Latent curing agent |
| 08/16/2007 | WO2006045407A3 Amines-epoxy compositions with high chemical resistance properties |
| 08/16/2007 | US20070191556 Polymeric epoxy resin composition |
| 08/16/2007 | US20070191555 Thermosetting resin composition and its article |
| 08/16/2007 | US20070190344 A cyclic polymer of silsesquioxane skeleton with side chains formed byhydrosilation of an unsaturated end group containing an active polymerfunctional group; polyimidesiloxane copolymers; polyestersiloxane copolymers; high molecular weight; thin films; strength; heat resistance;waterproofing; |
| 08/16/2007 | DE19639313B4 Photohärtbare Epoxysilicone, die Fluoreszenz- oder photosensibilisierende Markierungsfarbstoffe als funktionelle Gruppen aufweisen Have photocurable epoxy silicones, the fluorescence labeling dyes or photosensitizing as functional groups |
| 08/16/2007 | CA2641847A1 Humidifier and evaporation mat contained therein |
| 08/15/2007 | EP1818351A1 Underfill encapsulant for wafer packaging and method for its application |
| 08/15/2007 | EP1818350A1 Epoxy resin composition for prepreg, prepreg, and multilayered printed wiring board |
| 08/15/2007 | EP1817385A1 Hydrolysis-stable, hydrophobic, solvent-free polyols |
| 08/15/2007 | CN1331911C Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin |
| 08/15/2007 | CN101017324A Photosensitive composition, photosensitive colored composition, color filter, and liquid crystal display |
| 08/15/2007 | CN101016445A Underfill encapsulant for wafer packaging and method for its application |
| 08/15/2007 | CN101016369A Microcapsule incubated epoxide curing agent and preparing method thereof |
| 08/14/2007 | US7255926 Layered structure includes an optically or an electrically active thin film, such as a radiation detector, a solar cell or a solar module, or an optoelectronical component, such as a light emitting displaying device and a liquid crystal display (LCD) screen, insensitive to moisture |
| 08/14/2007 | US7255925 Dielectrics accuracy; heat dissipation ; glass transition temperature; heat resistance; copper cladding laminate ; high speed signal transfer |
| 08/14/2007 | CA2403129C Application type thin plate reinforcing material composition |
| 08/14/2007 | CA2398369C Gas barrier compositions having improved barrier properties |
| 08/09/2007 | WO2007089643A1 Non-aqueous, liquid coating compositions |
| 08/09/2007 | WO2007088889A1 Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article |
| 08/09/2007 | WO2007064366B1 Expandable sealant for fasteners |
| 08/09/2007 | WO2006001518A3 Cationic photopolymerizable epoxy resin composition, minute structural member using the same and method for manufacturing minute structural member |
| 08/09/2007 | US20070185287 Modified epoxy resin, process for its production, photosensitive resin composition and photsensitive element |
| 08/09/2007 | US20070185249 Hyperdispersant for use in fluorocarbon coating compositions |
| 08/09/2007 | US20070185246 Asphalt-epoxy resin compositions |
| 08/09/2007 | US20070185244 solvent-free mixture of epoxy resin, hardener for epoxy resin( phenol novolaks and cresol novolaks), microgel which is reaction product of unsaturated carboxylic acid ( acrylic acid ) and base ( 2-ethyl-imidazole), and electroconductive filler like graphite; biopolar plates |
| 08/09/2007 | US20070185242 Low temperature curing ink for printing oxide coating and process the same |
| 08/09/2007 | US20070185226 Novel polymerizable compound, polymer, positive-resist composition, and patterning process using the same |
| 08/09/2007 | US20070185225 Photoinitiated reactions |
| 08/09/2007 | US20070184290 Method of bonding adherend |
| 08/09/2007 | US20070184281 A curable liquid blends comprising amines, latent curing agent which does not react until temperatures above 70 degrees C., a photopolymerizable compound and a photoinitiator; use as impregnating resins, forming fibre-reinforced composite materials |
| 08/09/2007 | US20070184280 Epoxy compounds and cured epoxy resins obtained by curing the compounds |
| 08/09/2007 | DE112005000992T5 Wasserhaltige selbstklebende Beschichtung für Elektrostahl und deren Verwendung Aqueous adhesive coating for electrical steel and their use |
| 08/09/2007 | CA2641409A1 Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good |
| 08/08/2007 | EP1816152A1 Polymerizable composition |
| 08/08/2007 | EP1525271B1 Cathodic electrocoating composition containing a morpholine dione crosslinking agent |
| 08/08/2007 | CN1330704C Epoxy resin composition and method for producing epoxy resin composition and semiconductor device obtained thereby |
| 08/08/2007 | CN1330680C Resin composition, transfer material and process for producing shaped item |
| 08/08/2007 | CN101014639A Polyaminoamide-monoepoxy adducts |
| 08/08/2007 | CN101012301A Epoxy acrylic resin and preparing method thereof |
| 08/07/2007 | US7253228 Method for producing polyurethane emulsion |
| 08/02/2007 | WO2007087399A1 Epoxy formulations for use in lithography techniques |
| 08/02/2007 | WO2007086324A1 Adamantane derivative, resin composition containing same, and optoelectronic member and sealing agent for electronic circuit using those |
| 08/02/2007 | WO2007086323A1 Photosensitive resin composition |
| 08/02/2007 | WO2007085598A1 Curable composition |
| 08/02/2007 | WO2007085291A2 Use of polysulfide-containing two-component adhesives for the production of windows |
| 08/02/2007 | US20070179256 High-purity alicyclic epoxy compound, process for production of the same, curable epoxy resin composition, cured product thereof, and application thereof |
| 08/02/2007 | DE10224275B4 Emulsionsspalter Demulsifiers |
| 08/02/2007 | CA2637246A1 Use of polysulfide-containing two-component adhesives for the production of windows |