Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
08/2007
08/01/2007EP1813634A1 Curing agent for epoxy resins and epoxy resin composition
08/01/2007EP1813633A1 Aqueous dispersions of chain-extended epoxy amine adducts
08/01/2007EP1597315B1 Molding compositions containing quaternary organophosphonium salts
08/01/2007EP1237983B1 Polymerizable composition, cured material thereof and method for manufacturing the same
08/01/2007CN1329449C Epoxy modified organopolysiloxane resin based compositions useful for protective coatings
08/01/2007CN1329438C Epoxy resin curing agent for enhanced wear resistance and weatherability of cured materials
08/01/2007CN1329433C Epoxy resin and thermosetting cyanate ester resin copolymer and method for preparing the same
08/01/2007CN1329423C Epoxy alkane poly merization catalyst and method for preparing poly epoxy alkane with different molecular weights
08/01/2007CN101007864A Multiple functionality epoxide resin and its preparation method
08/01/2007CN101007863A Preparation method of non-ionic room temperature-cured aqueous epoxy curing agent
07/2007
07/31/2007US7250482 Silicone modified acrylics and epoxies
07/31/2007CA2258040C Curable thermoset resin composition
07/26/2007WO2007083715A1 Liquid epoxy resin, epoxy resin composition, and cured article
07/26/2007WO2007083690A1 Active energy ray-curable resin composition and use thereof
07/26/2007WO2007083673A1 Liquid epoxy resin composition and adhesive using same
07/26/2007WO2007083473A1 Active ray-curable composition, active ray-curable ink, and image-forming method using same
07/26/2007WO2007082853A1 Curing agents for epoxy-functional compounds
07/26/2007WO2007038764A8 Epoxy based oil free root canal sealer
07/26/2007WO2006035955A8 Curable diamantane compound
07/26/2007DE19534594B4 Kationisch härtende, flexible Epoxidharzmassen und ihre Verwendung zum Auftragen dünner Schichten Cationically curing, flexible epoxy resin compositions and to their use for application of thin layers
07/25/2007EP1810985A1 Curable composition
07/25/2007EP1809683A2 Amines-epoxy compositions with high chemical resistance properties
07/25/2007EP1694791B1 Cationically curable composition
07/25/2007EP1687374B1 Method for making an organic fibre based on an epoxy resin and a rheology-controlling agent and corresponding dry goods
07/25/2007CN1328307C Heat activated epoxy adhesive and use in a structural foam insert
07/25/2007CN101006103A Radiation-curable coatings for wood substrates from multifunctional acrylate oligomers
07/25/2007CN101003614A Process for producing epoxy resin
07/24/2007US7247684 Network polymers comprising epoxy-terminated esters
07/24/2007US7247660 Dental composition based on silicone crosslinkable by cation process
07/24/2007US7247351 Bonding strength, chemical resistance, radiation resistance, shrinkage inhibition; chain extension; combining an adduct of at least one amine with at least one epoxy functional silicone to form a polyol prepolymer chain extender, mixing with polyisocyanate to form a silicone modified polyurea
07/19/2007WO2007080871A1 Aromatic ether polymer, method for producing same and polymer composition
07/18/2007CN1327278C Sealant composition for liquid crystal and process for producing liquid-crystal display panel with the same
07/18/2007CN1326939C Optical solidifying-thermo solidifying resin composition and its solidified products
07/18/2007CN1326905C Network polymers comprising epoxy-terminated esters
07/18/2007CN1326904C Photobase generators, curable compositions prepared by using same and process of curing
07/18/2007CN101002137A Liquid crystal sealant and liquid crystal display cell utilizing the same
07/18/2007CN100999568A Epoxy resin or compound with phosphonate as molecular skeleton and synthesizing process thereof
07/18/2007CN100999567A Synthesizing process of epoxy resin containing adamantane structure on molecular main chain
07/18/2007CN100999443A Process for producing dichloropropanol
07/17/2007US7244801 Tertiary aminourea compound or a tertiary aminourethane compound reacted with an acidic hydrogen-containing compound such as bisphenol A, used to catalyze the low temperature crosslinking of thermosetting resins, especially epoxy resins
07/17/2007US7244473 Active ray curable ink-jet composition, image forming method using the same, ink-jet recording apparatus, and triarylsulfonium salt compound
07/17/2007CA2234508C Cathodic electrodeposition coating with carbamate-functional crosslinking agents
07/12/2007WO2007077837A1 Alkali developable curable composition and cured product thereof
07/12/2007US20070161100 Photosensitive resin composition and cured product thereof
07/12/2007US20070160849 Powder coating composition suitable for thermo-sensitive substrates
07/12/2007US20070160745 Manufacturing method for white light emitting diode device including two step cure process
07/11/2007EP1806376A1 Heat-resistant composite material
07/11/2007EP1806375A1 Process for obtaining aqueous compositions comprising curing epoxy agents
07/11/2007EP1805150A2 Heterocyclical chromophore architectures
07/11/2007EP1528090B1 Epoxy resin powder coating material
07/11/2007EP1162228B1 Prepreg and fiber-reinforced composite material
07/11/2007CN1997707A Amine compositions
07/11/2007CN1997683A Thermally conductive material for electronic and/or electrical components, and use thereof
07/11/2007CN1997682A Resin composition for semiconductor sealing and semiconductor device
07/11/2007CN1325532C Actinic radiation hardenable resin composition and hardening product thereof
07/10/2007US7241856 Dental resins, dental composite materials, and method of manufacture thereof
07/10/2007US7241499 Sizing composition for glass yarns, the glass yarns thus obtained and composite materials comprising said yarns
07/10/2007CA2378031C Process for the continuous production of gel free polymers, and powder and liquid coating applications containing gel free polymers
07/05/2007WO2007075927A1 Branched polyglycols and branched polyether functional organopolysiloxanes and coatings containing same
07/05/2007WO2007075769A1 A curable epoxy resin composition and laminates made therefrom
07/05/2007WO2007075718A1 A curable epoxy resin composition having a mixed catalyst system and laminates made therefrom
07/05/2007WO2007075271A1 Fluorinated surfactants
07/05/2007WO2007074890A1 Curable composition in combination with thermal radical curing/thermal latent curable epoxy
07/05/2007WO2007074813A1 Curable composition
07/05/2007US20070155917 Curable resin composition
07/05/2007US20070155915 excellent curability at low temperature and it provides a cured coating film having excellent appearance; organic accelarator is salicylic acid.
07/05/2007US20070154840 cationically curable component having epoxy group containing component; oxetane group containing component, multifunctional acrylate and a radical photoinitiator and a cationic photoinitiator; use in stereolithography; flexibility, elongation, tensile strength, curl resistance, water resistance
07/05/2007CA2632576A1 Branched polyglycols and branched polyether functional organopolysiloxanes and coatings containing same
07/04/2007EP1803760A1 Aqueous aminic curing agent for epoxy resins
07/04/2007EP1803759A1 Radiation curable resin, liquid crystal sealing material, and liquid crystal display cell using same
07/04/2007EP1803758A1 Polyepoxy compound, method for producing same, thermosetting resin composition containing same, cured product of such composition, and method for removing such cured product
07/04/2007EP1802717A1 Aqueous epoxy resin systems
07/04/2007EP1802701A1 Fibre reinforced assembly
07/04/2007EP1802677A1 Epoxy resins with improved elasticity
07/04/2007EP1621566B1 Fluxing no-flow underfill composition containing benzoxazines
07/04/2007EP1273608B1 Flame-retardant epoxy resin composition, molded object thereof, and electronic part
07/04/2007CN1993399A Curable resin composition, shaped article and method for producing same
07/03/2007US7238767 Bonding strength, chemical resistance, radiation resistance, shrinkage inhibition; chain extension; combining an adduct of at least one amine with at least one epoxy functional silicone to form a polyol prepolymer chain extender, mixing with polyisocyanate to form a silicone modified polyurea
07/03/2007CA2387389C Photocationic initiator combinations
07/03/2007CA2211312C Alkylene oxide catalyst and process
06/2007
06/28/2007US20070149793 Heterogeneous ruthenium catalyst, nucleus-hydrogenated diglycidyl ether of bisphenols a and f, and method for the production thereof
06/28/2007US20070149636 Dental composition based on silicone crosslinkable by cation process
06/27/2007EP1801142A2 Resin composition,resin cured product, and liquid discharge head
06/27/2007EP1799745A1 Aging-resistant coatings and adhesive composites
06/27/2007EP1644348B1 Epoxy-capped polythioethers
06/27/2007EP1470176B1 No flow underfill composition
06/27/2007CN1989203A Flame-retardant epoxy resin composition
06/27/2007CN1989168A Catalyst for curing epoxy resins, epoxy resin composition, and powder coating composition
06/27/2007CN1989167A Thermosetting resin composition, sealing material for optical device and cured product
06/27/2007CN1989166A Epoxy resin composition for prepreg, prepreg, and multilayered printed wiring board
06/27/2007CN1989165A Epoxy resin, epoxy resin composition, and cured product thereof
06/27/2007CN1989164A 固化性组合物 The curable composition
06/27/2007CN1989145A Novel fluorinated alkylfluorophosphoric acid salt of onium and transition metal complex
06/26/2007US7235602 Dental coatings and cements; low shrinkage, high reactivity, oral stability, low viscosity, storable; processability, easy handling
06/26/2007US7235593 Command-cure adhesives
06/26/2007CA2275278C Novel resin-curing process enabling the actinic radiation cure of resins containing shieldings against actinic radiations; composition for the process, moldings, and molding process
06/21/2007WO2007069732A1 Thermosetting resin composition
06/21/2007WO2007069525A1 Epoxy resin composition for encapsulation and electronic component device
06/21/2007US20070142611 Comb-shaped epoxy resin and method for preparing comb-shaped epoxy resin
06/21/2007US20070142528 (Meth)acrylate monomer, organic peroxide, decomposition accelerator, and inorganic filler; potting material, adhesives; thermoconductivity