| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
|---|
| 10/02/2003 | US20030187099 Filling three-dimensional cavities; curable epoxy resin |
| 10/02/2003 | US20030187088 Photo-curable coating compostion for hard protective coat and coated article |
| 10/02/2003 | US20030186049 Activatable material |
| 10/02/2003 | US20030185996 Epoxy resin composition, surface treating method, ink-jet recording head, and ink-jet recording apparatus |
| 10/01/2003 | EP1348742A2 Coating powders, methods of manufacture thereof, and articles formed therefrom |
| 10/01/2003 | EP1348727A2 Image-receiving layer composition and overcoat layer composition for ink-jet recording |
| 10/01/2003 | EP1208128B1 Polyamines comprising urea groups, method for their production, and their use as hardeners for epoxide resins |
| 10/01/2003 | EP1204691B1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 10/01/2003 | EP1095088B1 Self-dispersing hardenable epoxy resins |
| 10/01/2003 | EP1095087B1 Self-dispersing hardenable epoxy resins |
| 10/01/2003 | EP1091926B1 Phenalkylamine derivatives, their use as curing agents in epoxy resin compositions and curable epoxy resin compositions containing them |
| 10/01/2003 | EP0707610B1 Self-dispersing curable epoxy resins and coatings |
| 10/01/2003 | EP0703931B1 Vibration damping constructions using thermally polymerized epoxides |
| 10/01/2003 | EP0642416B1 Fiber/resin composites and method of preparation |
| 10/01/2003 | CN1445256A Naphthyl type epoxy resin and its preparing method |
| 10/01/2003 | CN1445255A Method for catalysis synthesizing methylic metlbond epoxy acryl resin |
| 09/30/2003 | US6627685 Phosgenating Bisphenol A to produce Bisphenol A bischloroformate, and then reacted with either epichlorohydrin, glycidol or pinacol and another chemical |
| 09/30/2003 | US6627684 Comprising an epoxy resins with two or more epoxy groups, an aromatic diamine curing agent containing asymmetric chemical structures with different reactivity and an inorganic powder; printed circuits; controlling the thickness; workability |
| 09/30/2003 | US6627683 Curing cyclic hydrocarbon including oxirane or thiirane moiety joined by (thio)ester by exposure to heat and decomposition; polyepoxides and polythioepoxides |
| 09/30/2003 | US6627328 Naphthalene epoxide, curing agent, activator and silica-titania filler; sealing material for optical semiconductor; cured products having high transparency at various temperatures |
| 09/30/2003 | CA2227961C Curable coating compositions containing carbamate additives |
| 09/28/2003 | CA2423214A1 Coating powders, methods of manufacture thereof, and articles formed therefrom |
| 09/25/2003 | WO2003078504A1 Branched polyorganosiloxane polymers |
| 09/25/2003 | WO2003078485A1 Hail-resistant acrylic laminated glass and method for producing the same |
| 09/25/2003 | WO2002074492A3 Abrasive particles that include a polymeric material and abrasive articles made from them |
| 09/25/2003 | US20030181623 Can be used as water-repellent coating to be advantageously applied to areas that are apt to be brought into contact with solutions and substances containing components that can damage film forming property and adhesion of ordinary water repellent |
| 09/25/2003 | US20030181611 Organoborane amine complex polymerization initiators and polymerizable compositions |
| 09/24/2003 | EP1099138B1 Stereolithographic compositions for preparing polyethylene-like articles |
| 09/24/2003 | EP0843685B1 Ionizing radiation curing of epoxy resin systems incorporating cationic photoinitiators |
| 09/24/2003 | CN1122360C Surface wave component and method of producing attenuating structure thereof |
| 09/23/2003 | US6624260 Rubber-modified epoxy resin composition |
| 09/23/2003 | US6624259 Powder coating of polyepoxide or β-hydroxyalkylamide, acid resin, polycarboxylic acid and 3° or 4° nitrogen source |
| 09/23/2003 | US6624216 Contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst; to protect and reinforce interconnections between an electronic component and a substrate in a microelectronic device |
| 09/23/2003 | US6624213 Cycloaliphatic polyepoxide resin and 9,9-bis(3-methyl-4-aminophenyl)fluorene |
| 09/23/2003 | US6623558 Epoxy resin and a moisture-curing type curing agent; applied to the surface of a tendon used in a post-tensioning system for prestressed concrete |
| 09/18/2003 | WO2003076544A1 Uv-curable epoxy resin composition comprising lactone monomer |
| 09/18/2003 | WO2003076536A1 Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby |
| 09/18/2003 | WO2003076515A1 Thermosetting resin composition and laminates and circuit board substrates made by using the same |
| 09/18/2003 | WO2003076491A1 Accelerators for cationic photopolymerization |
| 09/18/2003 | WO2003076487A1 Method for the production of epoxidized polysulfides |
| 09/18/2003 | WO2003076485A2 Organoborane amine complex polymerization initiators and polymerizable compositions |
| 09/18/2003 | US20030176627 Curing agents comprising the reaction products of carboxylic acid, triethylenetetraamine and/or polyamines used for curing epoxy resins |
| 09/18/2003 | US20030176599 Using an encapsulant-forming thermosetting resin (an epoxy resin) and an anhydride as crosslinker for the resin, crosslinks with resin that acts as a fluxing agent for soldering |
| 09/18/2003 | US20030176598 Thermosetting resin composition |
| 09/18/2003 | US20030176525 For use in composite molding material, adhesives, coating material; curability |
| 09/18/2003 | US20030176519 Accelerators for cationic photopolymerizations |
| 09/18/2003 | US20030175521 Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering |
| 09/18/2003 | CA2478084A1 Organoborane amine complex polymerization initiators and polymerizable compositions |
| 09/18/2003 | CA2477135A1 Accelerators for cationic photopolymerization |
| 09/17/2003 | EP1344109A2 Onium salts and the use therof as latent acids |
| 09/17/2003 | EP1135445B1 Weldable, coated metal substrates and methods for preparing and inhibiting corrosion of the same |
| 09/17/2003 | EP1093538B1 Polycationic polymers, their production and use |
| 09/17/2003 | CN1442685A Image method for measuring engineering embedding material |
| 09/17/2003 | CN1121468C Heat setting single component LVA (low-viscosity adhesive) system for bonding in micro-range |
| 09/17/2003 | CN1121447C Hydrophobic epoxide resin system, its cross-linked product and use |
| 09/17/2003 | CN1121437C In situ emulsified reactive epoxy polymer compositions |
| 09/16/2003 | US6620907 Process for the elimination of materials containing hydrolyzable halides and other high molecular weight materials from epihalohydrin derived epoxy resins |
| 09/16/2003 | US6620864 Epoxy compounds for use in dental medicine and/or dentistry |
| 09/16/2003 | US6620863 Optical element of light limiting dopant distributed in viscoelastic host material |
| 09/16/2003 | US6618933 Resistance to heat and humidity, producing virtually no voluminal expansion even under the conditions of high temperature and high humidity |
| 09/12/2003 | WO2003075339A1 B-stageable underfill encapsulant and method for its application |
| 09/12/2003 | WO2003075338A1 Underfill encapsulant for wafer packaging and method for its application |
| 09/12/2003 | WO2003074509A1 Heterocycle-bearing onium salts |
| 09/11/2003 | US20030171504 A cyclic addition-condensation copolymer comprising perfluoro acrylated monomer and polysiloxane group; curing epoxy copolymer can providing water-repellent and ink-repellent |
| 09/11/2003 | US20030171456 Epoxy resins |
| 09/11/2003 | US20030170567 Radiation curable resin layer |
| 09/11/2003 | US20030170401 Epoxy resin composition, surface treatment method, liquid ejection recording head, and liquid ejection recording apparatus |
| 09/11/2003 | US20030170396 For increasing hardness of films; corrosion resistence; waterproofing |
| 09/11/2003 | US20030169313 Epoxy resin composition, surface treatment method, liquid-jet recording head and liquid-jet recording apparatus |
| 09/11/2003 | US20030168652 Light emitting apparatus |
| 09/10/2003 | EP1342741A1 Carbodiimide composition for acoustically matching layer, process for producing a formed article for said layer and ultrasonic transducer using said formed article |
| 09/10/2003 | EP1341859A1 Aqueous coating material, method for producing the same and use thereof |
| 09/10/2003 | EP1341847A1 Thermally conductive casting compound |
| 09/10/2003 | CN1441818A High funtional polymers |
| 09/09/2003 | US6617701 Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device |
| 09/09/2003 | US6617698 Reworkable and thermally conductive adhesive and use thereof |
| 09/09/2003 | US6617401 Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device |
| 09/09/2003 | US6617400 Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst |
| 09/09/2003 | US6617399 Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners |
| 09/09/2003 | US6617046 For sealing gaps between printed circuit boards and semiconductor packages |
| 09/09/2003 | US6617029 Nitrogen-containing flame retarding epoxy resin and an epoxy resin composition containing the same |
| 09/09/2003 | US6617028 Phosphorus and nitrogen containing resin hardener and a flame retarding resin composition containing said hardener |
| 09/09/2003 | US6617021 Blend of epoxy resin, phenolic resin, butadiene-styrene copolymer and organosilicon compound |
| 09/09/2003 | US6616984 Cocuring agent is preferable 2-allyphenyl glycidyl ether, 2,2'-diallybisphenol A diglycidyl ether, or mixtures thereof. |
| 09/09/2003 | US6616979 Powder coating with non-crystalline and crystalline epoxy resins and curing agent |
| 09/09/2003 | US6616976 Contacting metal surface with adhesion promotion formulation to form a micro-roughened conversion coated metal surface; contacting micro-roughened conversion coated metal surface with epoxy resin to prepare for receiving polymer |
| 09/09/2003 | CA2255530C Barrier layer composition for plastic bodies |
| 09/09/2003 | CA2144547C Aqueous essentially voc-free adhesive epoxy primer |
| 09/04/2003 | WO2003072635A1 Prepolymers for native epoxide resins and method for producing said prepolymers |
| 09/04/2003 | WO2003072629A1 HIGH FUNCTIONALITY VINYL ESTER RESINS COMPATIBLE WITH VINYL ESTERS OF α,α BRANCHED ALKANE CARBOXYLIC ACIDS |
| 09/04/2003 | WO2003072627A1 Low-corrosive epoxy resins and production method therefor |
| 09/04/2003 | WO2003072625A1 Photocurable resin composition for optical waveguide and optical waveguide made of the same |
| 09/04/2003 | WO2003072568A1 Thioxanthone derivatives, and their use as cationic photoinitiators |
| 09/04/2003 | WO2001014470A9 Process for producing tyres, tyres thus obtained and elastomeric compositions used therein |
| 09/04/2003 | US20030166796 Epoxy resin composition and cured object obtained therefrom |
| 09/04/2003 | US20030166780 Thermoplastic resin composition |
| 09/04/2003 | US20030166750 Photographic binder; polyvinyl acetal |
| 09/04/2003 | US20030166747 Casting compound based on thermosetting epoxy resins |
| 09/04/2003 | US20030166746 Organic component comprises long-chain cycloaliphatic epoxy resin, short-chain cycloaliphatic epoxy resin, cyanate ester, lewis acid catalyst; useful in die attach adhesives, underfills, encapsulants, via fills, prepreg binders |
| 09/04/2003 | US20030166745 Composition containing a carbodiimide resin and inorganic hollow bodies and another reactive resin |