Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
11/2002
11/27/2002EP1259566A1 Thermosetting resin composition
11/26/2002WO2001092416A1 Conductive resin composition
11/26/2002US6486297 High strength polymers and aerospace sealants therefrom
11/26/2002US6486266 Thermosetting resin composition
11/26/2002US6486256 Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst
11/26/2002US6486235 Composition of epoxy resin, curing agent, phosphate of resorcinol, Al (OH)
11/26/2002US6485885 Photopolymerizable thermosetting resin compositions
11/26/2002US6485834 Flexible deployable preform
11/26/2002US6485793 Particularly suitable for auto bodies made of sheet metal and/or plastic, applied by means of electrostatically assisted high-speed rotation or pneumatically, as a coating for car bodies coated with waterborne basecoat
11/26/2002US6485788 Thermosetting compositions containing epoxy-functional polymers prepared using atom transfer radical
11/26/2002US6485787 An epoxy component, and a polyfunctional amine component where the urethane acrylate reacts with the amine to form a secondary amine component which reacts with the epoxy to form a crosslinked polymer; quick curing traffic paint
11/26/2002US6485589 Melt-flowable materials and method of sealing surfaces
11/26/2002CA2413180A1 A conductive resin composition
11/23/2002CA2387070A1 Acid catalyzed copolymerization of water and epoxy resin and uses thereof
11/21/2002WO2002092904A1 BLOCK, NON-(AB)n SILICONE POLYALKYLENEOXIDE COPOLYMERS WITH TERTIARY AMINO LINKS
11/21/2002WO2002092659A1 Moulding composition for producing bipolar plates
11/21/2002WO2002092636A1 Process for producing epoxidized diene polymer
11/21/2002US20020171132 Reworkable and thermally conductive adhesive and use thereof
11/21/2002DE10123451A1 Aqueous epoxy resin emulsion, e.g. useful for making prepregs, comprises a water-emulsifiable epoxy resin and a hardener which is a di- or trivalent metal complex including a nitrogen base
11/21/2002CA2470556A1 Block, non-(ab)n silicone polyalkyleneoxide copolymers with tertiary amino links
11/20/2002CN1094494C Copolyether and solid polymer electrolyte
11/19/2002US6482899 Latency curing agents; storage stability
11/19/2002US6482868 Accelerators useful for energy polymerizable compositions
11/19/2002CA2115144C Macromonomers having reactive side groups
11/14/2002US20020169259 Ketimine as latent curing agent; excellent storage stability
11/14/2002US20020169226 Phenolic resins for use as permanent mask resist pattern; heat resistance, humidity-heat resistance, adhesibility, mechanical properties, and electrical properties
11/14/2002US20020168527 Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom
11/13/2002EP1256032A1 Liquid, radiation-curable composition, especially for stereolithography
11/13/2002EP1194465B1 Compositions for protecting cable strands for highway structures
11/13/2002CN1094135C Epoxy polysiloxane coating and flooring compositions
11/12/2002US6479596 Epoxy acrylates
11/12/2002US6479585 Power coating of carboxyl-functional acrylic resin and polyepoxy resin
11/12/2002US6479167 Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith
11/12/2002US6479151 Dispersion of a partially neutralized amino-functional epoxy derived polymer and a compound with at least two acetoacetate groups and/or acetoacetamide groups; coatings with hardness, gloss, water and solvent resistance; adhesive strength
11/12/2002US6479103 Blocked polyurethane resins, epoxy resins, together with curing agents containing nitrogen and conductive extenders are suitable for coating metal surfaces, in particular sheet steel in the coil coating process
11/07/2002WO2002068551A3 Reactive non-isocyanate coating compositions
11/07/2002WO2002034418A3 Method for producing a multilayer coating and the use thereof
11/07/2002US20020164485 Structural modified epoxy adhesive compositions
11/07/2002DE10214515A1 New curable compound is liquid state before curing and soften/liquefy in short time after curing at lower temperature than thermal decomposition point
11/06/2002EP1254193A1 Reactive particles, curable composition comprising the same and cured products
11/06/2002EP1163280B1 Epoxy resin compositions having a long shelf life
11/06/2002CN1093866C Use of silicon-modified epoxy resin as casting material for electrical working or electronic assembly
11/05/2002US6476160 One-pack composition of epoxy resin(s) with no oh groups and ketimine
11/05/2002US6476100 Solid surface materials prepared from extrudable acrylic composites
11/05/2002US6475641 Connecting material and connection structure
11/05/2002US6475568 Block, non-(AB)n silicone polyalkyleneoxide copolymers with tertiary amino links
10/2002
10/31/2002WO2002086003A1 A thermosetting adhesive film, and an adhesive structure based on the use thereof
10/31/2002WO2002085975A1 Composition of acrylated urethane oligomer, epoxy resin and amine hardener
10/31/2002WO2002066485A3 Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom
10/31/2002US20020161162 Ambient cure fast dry solvent borne coating compositions
10/31/2002US20020161068 Polymerizable composition, cured material thereof and method for manufacturing the same
10/31/2002US20020160309 Photopolymerization; three-dimensional object
10/31/2002US20020160202 Binders for air drying corrosion protection systems
10/31/2002US20020157788 Novel polymer/substrate and polymer/polymer interfaces and methods of modeling and forming same
10/30/2002EP1253811A1 Thermosetting resin composition and process for producing the same
10/30/2002EP1252551A1 Photoinitiator system with acylphosphine oxide initiators
10/30/2002EP1252244A1 Rosin-modified epoxy acrylates
10/30/2002EP1252218A1 Epoxy resin composition
10/30/2002EP1252217A1 Ambient-temperature-stable, one-part curable epoxy adhesive
10/30/2002EP1196485A4 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants
10/30/2002EP1100833B1 High powered radiation and/or thermal hardening coating powder with a functionalized base structure
10/30/2002CN1377286A Binding superabsorbent polymers to substrates
10/30/2002CN1376587A Graphic expression articles and preparation method thereof
10/29/2002US6472129 A fluorine-containing epoxy resin having in one molecule at least one perfluoroalkyl group having 6 to 12 carbon atoms and atleast two alicyclic epoxy groups, and a cationic polymerization catalyst
10/29/2002US6472085 Epoxy functional polymer prepared by atom transfer radical polymerization initiated in the presence of an initiator having at least one radically transferable group
10/24/2002WO2002083759A2 Silicone liquid crystals, vesicles, and gels
10/24/2002WO2002056921A3 Nonaqueous compositions and additives therefor
10/24/2002WO2002053200A3 Biocompatible adhesives
10/24/2002US20020156204 Liquid crystal displays with a transparent resin plate which is obtained by curing an epoxy resin
10/24/2002US20020156190 Cationically polymerizable liquid composition and tacky polymer
10/24/2002US20020156189 Epoxy resin composition and curing product therof
10/24/2002US20020155298 Mixture of epoxy resins, curing agents, solvent and organophosphorus compound
10/24/2002US20020155286 Adhesive composition and adhesive sheet for semiconductor devices
10/23/2002EP1251151A2 Epoxy resin composition, method of improving surface of substrate, ink jet recording head and ink jet recording apparatus
10/23/2002CN1376172A Amine hardener for epoxy resins
10/23/2002CN1375527A Cation electrophoretic coating composition comprising phosphonio group
10/23/2002CN1375521A Thermal-setting resin composition and semiconcutor apparatus using same
10/23/2002CN1093147C Low-birefringent organic optical component and spirobiindan polymer
10/23/2002CN1093146C Method for forming coating on heat-sensitive substrate
10/22/2002US6469109 Copper clad laminates
10/22/2002US6469074 Epoxy resin compositions have excellent electrical characteristics and adhesive strength which comprises a cyanic acid ester, an epoxy resin, an inorganic filler, a metal chelate and/or a metal salt and an acid anhydride
10/22/2002US6468660 Biocompatible adhesives
10/22/2002US6468659 Resin system
10/22/2002US6467961 Lubricating coating compound, sliding structure combining two sliding members in which lubricating coating compound is applied to one of the sliding members, and slide bearing apparatus using the same
10/17/2002WO2002081563A1 Polyester block copolymer composition
10/17/2002WO2002081540A1 Epoxy resin composition, process for producing fiber -reinforced composite materials and fiber-reinforced composite materials
10/17/2002WO2002057333A3 Epoxy resin composition for semiconductor encapsulation
10/17/2002US20020151635 As binder the reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups; a curing agent; and an electroconductive pigment dispersed in the binder; coating metal sheet
10/17/2002US20020151106 Thermosetting resin composition and semiconductor device using the same
10/17/2002US20020150762 Protective plastic coating for interior of oil pipes
10/17/2002US20020150548 Isolatable, water soluble, and hydrolytically stable active sulfones of poly (ethylene glycol) and related polymers for modification of surfaces and molecules
10/16/2002EP1248823A1 Method for the anodic electrophoretic enamelling and electrophoretic paints
10/16/2002EP1114834B1 Epoxy resin composition and process for producing silane-modified epoxy resin
10/16/2002CN1092680C Epoxy resin composition and optical information recording medium using with the same composition
10/16/2002CN1092674C Epoxy propenoic acid resin and its use
10/15/2002US6465702 Process for recycling of thermoset materials
10/15/2002US6465605 Antifoam agent
10/15/2002US6465601 Active as accelerators for curable epoxy and polyurethane systems
10/15/2002US6465597 Epoxy-amine compositions containing sulfur as a cure accelerator
10/15/2002US6465540 Polymer containing epoxized ethylenically unsaturate, diacry-lated polyether and polybasic anhydride with such as a cresol novolac epoxy resin and photoinitiator; dilute alkali deve-lopable; protective films for color filters; printed circuits