Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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11/27/2002 | EP1259566A1 Thermosetting resin composition |
11/26/2002 | WO2001092416A1 Conductive resin composition |
11/26/2002 | US6486297 High strength polymers and aerospace sealants therefrom |
11/26/2002 | US6486266 Thermosetting resin composition |
11/26/2002 | US6486256 Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst |
11/26/2002 | US6486235 Composition of epoxy resin, curing agent, phosphate of resorcinol, Al (OH) |
11/26/2002 | US6485885 Photopolymerizable thermosetting resin compositions |
11/26/2002 | US6485834 Flexible deployable preform |
11/26/2002 | US6485793 Particularly suitable for auto bodies made of sheet metal and/or plastic, applied by means of electrostatically assisted high-speed rotation or pneumatically, as a coating for car bodies coated with waterborne basecoat |
11/26/2002 | US6485788 Thermosetting compositions containing epoxy-functional polymers prepared using atom transfer radical |
11/26/2002 | US6485787 An epoxy component, and a polyfunctional amine component where the urethane acrylate reacts with the amine to form a secondary amine component which reacts with the epoxy to form a crosslinked polymer; quick curing traffic paint |
11/26/2002 | US6485589 Melt-flowable materials and method of sealing surfaces |
11/26/2002 | CA2413180A1 A conductive resin composition |
11/23/2002 | CA2387070A1 Acid catalyzed copolymerization of water and epoxy resin and uses thereof |
11/21/2002 | WO2002092904A1 BLOCK, NON-(AB)n SILICONE POLYALKYLENEOXIDE COPOLYMERS WITH TERTIARY AMINO LINKS |
11/21/2002 | WO2002092659A1 Moulding composition for producing bipolar plates |
11/21/2002 | WO2002092636A1 Process for producing epoxidized diene polymer |
11/21/2002 | US20020171132 Reworkable and thermally conductive adhesive and use thereof |
11/21/2002 | DE10123451A1 Aqueous epoxy resin emulsion, e.g. useful for making prepregs, comprises a water-emulsifiable epoxy resin and a hardener which is a di- or trivalent metal complex including a nitrogen base |
11/21/2002 | CA2470556A1 Block, non-(ab)n silicone polyalkyleneoxide copolymers with tertiary amino links |
11/20/2002 | CN1094494C Copolyether and solid polymer electrolyte |
11/19/2002 | US6482899 Latency curing agents; storage stability |
11/19/2002 | US6482868 Accelerators useful for energy polymerizable compositions |
11/19/2002 | CA2115144C Macromonomers having reactive side groups |
11/14/2002 | US20020169259 Ketimine as latent curing agent; excellent storage stability |
11/14/2002 | US20020169226 Phenolic resins for use as permanent mask resist pattern; heat resistance, humidity-heat resistance, adhesibility, mechanical properties, and electrical properties |
11/14/2002 | US20020168527 Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom |
11/13/2002 | EP1256032A1 Liquid, radiation-curable composition, especially for stereolithography |
11/13/2002 | EP1194465B1 Compositions for protecting cable strands for highway structures |
11/13/2002 | CN1094135C Epoxy polysiloxane coating and flooring compositions |
11/12/2002 | US6479596 Epoxy acrylates |
11/12/2002 | US6479585 Power coating of carboxyl-functional acrylic resin and polyepoxy resin |
11/12/2002 | US6479167 Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith |
11/12/2002 | US6479151 Dispersion of a partially neutralized amino-functional epoxy derived polymer and a compound with at least two acetoacetate groups and/or acetoacetamide groups; coatings with hardness, gloss, water and solvent resistance; adhesive strength |
11/12/2002 | US6479103 Blocked polyurethane resins, epoxy resins, together with curing agents containing nitrogen and conductive extenders are suitable for coating metal surfaces, in particular sheet steel in the coil coating process |
11/07/2002 | WO2002068551A3 Reactive non-isocyanate coating compositions |
11/07/2002 | WO2002034418A3 Method for producing a multilayer coating and the use thereof |
11/07/2002 | US20020164485 Structural modified epoxy adhesive compositions |
11/07/2002 | DE10214515A1 New curable compound is liquid state before curing and soften/liquefy in short time after curing at lower temperature than thermal decomposition point |
11/06/2002 | EP1254193A1 Reactive particles, curable composition comprising the same and cured products |
11/06/2002 | EP1163280B1 Epoxy resin compositions having a long shelf life |
11/06/2002 | CN1093866C Use of silicon-modified epoxy resin as casting material for electrical working or electronic assembly |
11/05/2002 | US6476160 One-pack composition of epoxy resin(s) with no oh groups and ketimine |
11/05/2002 | US6476100 Solid surface materials prepared from extrudable acrylic composites |
11/05/2002 | US6475641 Connecting material and connection structure |
11/05/2002 | US6475568 Block, non-(AB)n silicone polyalkyleneoxide copolymers with tertiary amino links |
10/31/2002 | WO2002086003A1 A thermosetting adhesive film, and an adhesive structure based on the use thereof |
10/31/2002 | WO2002085975A1 Composition of acrylated urethane oligomer, epoxy resin and amine hardener |
10/31/2002 | WO2002066485A3 Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom |
10/31/2002 | US20020161162 Ambient cure fast dry solvent borne coating compositions |
10/31/2002 | US20020161068 Polymerizable composition, cured material thereof and method for manufacturing the same |
10/31/2002 | US20020160309 Photopolymerization; three-dimensional object |
10/31/2002 | US20020160202 Binders for air drying corrosion protection systems |
10/31/2002 | US20020157788 Novel polymer/substrate and polymer/polymer interfaces and methods of modeling and forming same |
10/30/2002 | EP1253811A1 Thermosetting resin composition and process for producing the same |
10/30/2002 | EP1252551A1 Photoinitiator system with acylphosphine oxide initiators |
10/30/2002 | EP1252244A1 Rosin-modified epoxy acrylates |
10/30/2002 | EP1252218A1 Epoxy resin composition |
10/30/2002 | EP1252217A1 Ambient-temperature-stable, one-part curable epoxy adhesive |
10/30/2002 | EP1196485A4 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
10/30/2002 | EP1100833B1 High powered radiation and/or thermal hardening coating powder with a functionalized base structure |
10/30/2002 | CN1377286A Binding superabsorbent polymers to substrates |
10/30/2002 | CN1376587A Graphic expression articles and preparation method thereof |
10/29/2002 | US6472129 A fluorine-containing epoxy resin having in one molecule at least one perfluoroalkyl group having 6 to 12 carbon atoms and atleast two alicyclic epoxy groups, and a cationic polymerization catalyst |
10/29/2002 | US6472085 Epoxy functional polymer prepared by atom transfer radical polymerization initiated in the presence of an initiator having at least one radically transferable group |
10/24/2002 | WO2002083759A2 Silicone liquid crystals, vesicles, and gels |
10/24/2002 | WO2002056921A3 Nonaqueous compositions and additives therefor |
10/24/2002 | WO2002053200A3 Biocompatible adhesives |
10/24/2002 | US20020156204 Liquid crystal displays with a transparent resin plate which is obtained by curing an epoxy resin |
10/24/2002 | US20020156190 Cationically polymerizable liquid composition and tacky polymer |
10/24/2002 | US20020156189 Epoxy resin composition and curing product therof |
10/24/2002 | US20020155298 Mixture of epoxy resins, curing agents, solvent and organophosphorus compound |
10/24/2002 | US20020155286 Adhesive composition and adhesive sheet for semiconductor devices |
10/23/2002 | EP1251151A2 Epoxy resin composition, method of improving surface of substrate, ink jet recording head and ink jet recording apparatus |
10/23/2002 | CN1376172A Amine hardener for epoxy resins |
10/23/2002 | CN1375527A Cation electrophoretic coating composition comprising phosphonio group |
10/23/2002 | CN1375521A Thermal-setting resin composition and semiconcutor apparatus using same |
10/23/2002 | CN1093147C Low-birefringent organic optical component and spirobiindan polymer |
10/23/2002 | CN1093146C Method for forming coating on heat-sensitive substrate |
10/22/2002 | US6469109 Copper clad laminates |
10/22/2002 | US6469074 Epoxy resin compositions have excellent electrical characteristics and adhesive strength which comprises a cyanic acid ester, an epoxy resin, an inorganic filler, a metal chelate and/or a metal salt and an acid anhydride |
10/22/2002 | US6468660 Biocompatible adhesives |
10/22/2002 | US6468659 Resin system |
10/22/2002 | US6467961 Lubricating coating compound, sliding structure combining two sliding members in which lubricating coating compound is applied to one of the sliding members, and slide bearing apparatus using the same |
10/17/2002 | WO2002081563A1 Polyester block copolymer composition |
10/17/2002 | WO2002081540A1 Epoxy resin composition, process for producing fiber -reinforced composite materials and fiber-reinforced composite materials |
10/17/2002 | WO2002057333A3 Epoxy resin composition for semiconductor encapsulation |
10/17/2002 | US20020151635 As binder the reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups; a curing agent; and an electroconductive pigment dispersed in the binder; coating metal sheet |
10/17/2002 | US20020151106 Thermosetting resin composition and semiconductor device using the same |
10/17/2002 | US20020150762 Protective plastic coating for interior of oil pipes |
10/17/2002 | US20020150548 Isolatable, water soluble, and hydrolytically stable active sulfones of poly (ethylene glycol) and related polymers for modification of surfaces and molecules |
10/16/2002 | EP1248823A1 Method for the anodic electrophoretic enamelling and electrophoretic paints |
10/16/2002 | EP1114834B1 Epoxy resin composition and process for producing silane-modified epoxy resin |
10/16/2002 | CN1092680C Epoxy resin composition and optical information recording medium using with the same composition |
10/16/2002 | CN1092674C Epoxy propenoic acid resin and its use |
10/15/2002 | US6465702 Process for recycling of thermoset materials |
10/15/2002 | US6465605 Antifoam agent |
10/15/2002 | US6465601 Active as accelerators for curable epoxy and polyurethane systems |
10/15/2002 | US6465597 Epoxy-amine compositions containing sulfur as a cure accelerator |
10/15/2002 | US6465540 Polymer containing epoxized ethylenically unsaturate, diacry-lated polyether and polybasic anhydride with such as a cresol novolac epoxy resin and photoinitiator; dilute alkali deve-lopable; protective films for color filters; printed circuits |