| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
|---|
| 01/02/2003 | EP1268192A2 Laminate and process for producing a laminate of this type |
| 01/02/2003 | EP0996657B1 Hydroxy-functional oligomers for high solids coatings |
| 01/02/2003 | EP0953618B1 Curable composition for coating material and articles coated therewith |
| 01/01/2003 | CN1388818A Sealing material for plastic liquid crystal display cells |
| 01/01/2003 | CN1388143A Potential curing agent for epoxy resin solidified epoxy resin composition |
| 12/31/2002 | US6500564 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 12/31/2002 | US6500545 Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers |
| 12/31/2002 | US6500544 Corrosion resistant coatings |
| 12/27/2002 | WO2002070191A8 Fluxing underfill compositions |
| 12/26/2002 | US20020197479 Cyanate ester-containing insulating composition, insulating film made therefrom and multilayer printed circuit board having the film |
| 12/25/2002 | CN1387475A Autodeposition coatings and process for preparing same |
| 12/25/2002 | CN1097099C Cathodic electrodeposition method utilizing cyclic carbonate-curable coating composition |
| 12/24/2002 | US6498260 Polyepoxides; electronic packages |
| 12/24/2002 | US6498200 Cationically polymerizable resin composition |
| 12/24/2002 | CA2071012C Stabilization of mineral filled polyesters using epoxy compounds |
| 12/19/2002 | WO2002100962A1 Ammonia and organic amine catalysis of epoxy hybrid powder coatings |
| 12/19/2002 | WO2002100951A1 Thermosetting resin composition |
| 12/19/2002 | WO2002100867A1 Well-defined nanosized building blocks for organic/inorganic nanocomposites |
| 12/19/2002 | WO2002100538A2 Method for the production of cycloaliphatic compounds having side chains with epoxy groups by hydrogenation on ru/s102 catalysts |
| 12/19/2002 | WO2002061010A3 Method for adhering substrates using light activatable adhesive film |
| 12/19/2002 | US20020193552 Flame retardant resin material and flame retardant resin composition |
| 12/19/2002 | US20020193519 Comprises epoxy resin, polysiloxane and curing agent; moldability; catalytic polymerization; nondegrading; elasticity |
| 12/19/2002 | US20020192477 Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith |
| 12/19/2002 | DE10128889A1 Wasserverdünnbare Aminhärter für wäßrige Zweikomponenten-Epoxidharz-Systeme The water dilutable amine curing agent for aqueous two component epoxy resin systems |
| 12/18/2002 | EP1266945A2 Aqueous blinders |
| 12/18/2002 | EP1266936A1 Epoxy resin composition used for encapsulating semiconductor and semiconductor device using the composition |
| 12/18/2002 | EP1266922A1 Photocurable/thermosetting composition for forming matte film |
| 12/18/2002 | EP1266921A1 Epoxy resin composition for fiber-reinforced composite material |
| 12/18/2002 | EP1266920A2 Water-thinnable amine curing agents for aqueous epoxy resins with two coponent |
| 12/18/2002 | EP1266919A1 Epoxy resin, epoxy resin mixtures, epoxy resin compositions and products of curing of the same |
| 12/18/2002 | EP1266264A1 Non-aromatic chromophores for use in polymer anti-reflective coatings |
| 12/18/2002 | EP1127093B1 Curable coating compositions containing blends of carbamate-functional compounds |
| 12/18/2002 | EP1124909B1 Curable coating compositions containing blends of carbamate-functional compounds |
| 12/18/2002 | EP1003816B1 Aqueous dispersions of epoxy resins |
| 12/18/2002 | CN1386128A Method of manufacturing a replica as well as a replica obtained by carrying out a UV light-initiated cationic polymerization |
| 12/18/2002 | CN1096479C Curable epoxy resin compositions containing water-processable polyamine hardeners |
| 12/17/2002 | US6495653 Retaining curability even at a low temperatures, low viscosity, rapid cure |
| 12/17/2002 | US6495637 Water-compatible urethane-containing amine hardener |
| 12/17/2002 | US6495270 Addition product of a heterocyclic amidine and a quinone is accelerator; encapsulation of electronic component parts; rapid curability, curability after moisture absorption under moist condition, pot life and flow properties |
| 12/17/2002 | CA2042065C Tackified dual cure pressure-sensitive adhesive |
| 12/15/2002 | CA2390775A1 Aqueous binders |
| 12/12/2002 | WO2002098981A1 Epoxy molding compounds containing phosphor and process for preparing such compositions |
| 12/12/2002 | WO2002098664A1 Dual curable encapsulating material |
| 12/12/2002 | WO2002065216A3 Cationically curable compositions containing triarylcyclopropenylium salts |
| 12/12/2002 | WO2002062907A3 Curable, weldable coating compositions |
| 12/12/2002 | US20020188070 Resin composition and cationic electrodeposition coating composition |
| 12/12/2002 | US20020188033 Active energy beam curable composition and ink |
| 12/12/2002 | US20020187353 Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same |
| 12/12/2002 | DE10128204A1 Production of cycloaliphatic compounds that have side chains containing epoxy groups, useful for the production of weather resistant paint systems, comprises use of a supported ruthenium catalyst. |
| 12/11/2002 | EP1265280A1 Resin component for encapsulating semiconductor and semiconductor device using it |
| 12/11/2002 | EP1264869A2 Metal container |
| 12/11/2002 | EP1263882A2 Silicone amino-epoxy cross-linking system |
| 12/11/2002 | EP1015519B1 Powder varnish dispersion |
| 12/11/2002 | EP0934366B1 Solventless primers which are hardenable by radiation |
| 12/11/2002 | CN1384975A Reworkable thermosetting resin composition |
| 12/11/2002 | CN1384782A Treated copper foil and process for making treated copper foil |
| 12/11/2002 | CN1384144A Thermosetting epoxy resin composition and its formed body and multilayered printed circuit board |
| 12/11/2002 | CN1384143A Semiconductor packing epoxy resin composition and its making process and semiconductor device |
| 12/11/2002 | CN1095989C Process for measurement of degree of cure and percent resin of fiberglass-reinforced epoxy resin prepreg |
| 12/10/2002 | US6492483 Process comprises passing continuously (i) a liquid epoxy resin having a first molecular weight, (ii) a catalyst and (iii) a compound having at least one active hydrogen or reactive functional group capable of reacting with the liquid |
| 12/10/2002 | US6492478 Wherein the variables are as defined in the claims, to crosslinked polymers, to either homo-polymers or copolymers prepared from those novel prepolymers, to mouldings produced from the said homo- or co-polymers, and especially to contact |
| 12/10/2002 | US6492438 Electrically connectable adhesive agent for semiconductor |
| 12/10/2002 | US6492437 Solvent-based process for manufacturing latent curing catalysts |
| 12/10/2002 | US6492092 Such as isobornylmethacrylate-p-hydroxyphenylmethacrylamide copolymer with 1,4-cyclohexanedimethanol diglycidyl ether crosslinker; insoluble to topcoat resist solvents, minimizes reflectivity, etch rate comparable to novolaks |
| 12/10/2002 | US6492027 Cationic resin composition |
| 12/10/2002 | US6491845 Epoxy hardener of phenolic or 2° OH polyol and methylol polyol |
| 12/10/2002 | US6491783 Using adhesive made up of part a and part b mixed together, wherein part a includes 12-99% by weight bisphenol a or f type epoxy resin, part b includes 6-99% by weight amidoamine curing agent |
| 12/10/2002 | CA2113269C Process for preparing a dispersion and for preparing polymer particles |
| 12/05/2002 | WO2002097002A1 Ultraviolet activatable adhesive film |
| 12/05/2002 | WO2002096987A1 Copper foil with resin and printed wiring boards made by using the same |
| 12/05/2002 | WO2002096969A1 Light- and heat-curing resin composition |
| 12/05/2002 | WO2002083806A1 Optical adhesive composition and optical apparatus |
| 12/05/2002 | US20020183461 Resin having both oxirane rings and thiirane rings and an oxazolidine compound as the latent curing agent; storage stability |
| 12/05/2002 | US20020183450 React with a terminal amino group of polyamine with an epoxy compound, decyclizing; forming an intermediate for polyurea coatings |
| 12/05/2002 | US20020183449 Curable compounds, curable resin compositions containing the same and methods of easily disassembling cured materials |
| 12/05/2002 | US20020182418 Weldable, coated metal substrates and methods for preparing and inhibiting corrosion of the same |
| 12/05/2002 | US20020182339 Irradiation crosslinking a mixture of an epoxy compound, polyol like a polyetherpolyol or a polyesterpolyol, and a photoinitiator and applying the exposed composition onto a substrate thereby forming a coating upon the substrate. |
| 12/05/2002 | US20020180099 Continuous processing; emulsion polymerization |
| 12/05/2002 | CA2411185A1 Optical adhesive composition and optical device |
| 12/04/2002 | EP1262506A1 Photocationic initiator combinations |
| 12/04/2002 | EP1262505A1 Acid catalysed copolymerization of epoxy resins and water |
| 12/04/2002 | CN1383436A Epoxy resin compsn. and laminate using same |
| 12/04/2002 | CN1382745A Thermoset resin compsns. and its mfg. method |
| 12/03/2002 | US6489405 Curable polyoxyalkylene amines used for encapsulation of electrical and electronic apparatus |
| 12/03/2002 | US6489380 Mixtures of fillers, heterocylic ethers, nitriles, lewis acid catalysts and/or brownsted acids having high flexibility and hermetic sealing, used in semiconductor applications |
| 12/03/2002 | US6489042 Covercoats to protect the circuitry |
| 12/03/2002 | CA2065181C Epoxy resin mixtures, in particular for the production of prepregs with a long shelf life |
| 11/28/2002 | WO2002094948A1 Thermosetting acryl powder coating |
| 11/28/2002 | WO2002094905A1 Cured thermosetting resin product |
| 11/28/2002 | WO2002079338A3 Thermosetting adhesive |
| 11/28/2002 | US20020177685 Methods and materials for fabrication of alumoxane polymers |
| 11/28/2002 | US20020177683 Highly purified epoxy resin |
| 11/28/2002 | US20020177674 Resin composition for coating |
| 11/28/2002 | US20020177073 Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography |
| 11/28/2002 | US20020177072 Composition for photoimaging |
| 11/28/2002 | US20020176994 Mixture of epoxy, tertiary amine, anhydride, hydroxy- and, optionally, acid functional compounds or polymers; solvent resistance, hardness; use in metal coatings |
| 11/28/2002 | US20020176046 Sealing material for plastic liquid crystal display cells |
| 11/28/2002 | CA2447630A1 Thermosetting acryl powder coating |
| 11/27/2002 | EP1260551A1 Flame-retardant epoxy resin composition and laminate made with the same |
| 11/27/2002 | EP1260532A1 Latent curing agent for epoxy resin, and curable epoxy resin composition |