Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
01/2003
01/29/2003EP1279709A1 Method of bonding adherend
01/29/2003EP1279688A1 Quick cure carbon fiber reinforced epoxy resin
01/29/2003EP1278912A2 Hydroxy-phenoxyether polymers in papermaking
01/29/2003EP1105431B1 Heat curable epoxy compositions
01/29/2003CN1394225A Epoxy resin composition and its use
01/28/2003US6512075 High Tg brominated epoxy resin for glass fiber laminate
01/28/2003US6512057 Epoxy-containing addition polymer, such as a copolymer of methyl methacrylate, styrene, and glycidyl methacrylate and a branched glutaric acid such as 2,4-diethyl glutaric acid; powder paints
01/28/2003US6512031 First curing agent for polymerizing the epoxy resin into a linear polymer, and a second curing agent for crosslinking the linear polymer into a three-dimensional polymer. The use of two curing agents corresponding to straight chain growth
01/28/2003US6512026 Powder clear varnish and aqueous powder clear varnish slurry
01/23/2003WO2003007319A2 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
01/23/2003WO2003007078A2 Photocurable resist inks
01/23/2003WO2003006553A1 Resin composition
01/23/2003US20030018132 Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device
01/23/2003US20030017351 Thermosetting epoxy resin containing dielectric ceramics with high dielectric constant
01/23/2003US20030017342 Optical adhesive composition and optical device
01/23/2003US20030017341 Adhesives and adhesive compositions containing thioether groups
01/23/2003US20030015823 Method for forming a thick section, thermoset, solid casting
01/23/2003CA2453107A1 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
01/22/2003EP1277815A1 Water-based coating composition curable with actinic energy ray, coated metallic material with cured film of the composition, production process, and method of bonding coated metallic material
01/22/2003EP1277798A2 Thermosetting resin composition
01/22/2003EP1277778A2 Stabilized cationically-curable compositions
01/22/2003EP1277777A2 Stabilized cationically-curable compositions
01/22/2003EP1277776A1 Photocurable resin composition for sealing material and method of sealing
01/22/2003EP1276816A1 Blends of polyarylether sulphone and polyamide, with improved viscosity and flowability
01/22/2003EP1276799A2 Flame retardant epoxy molding compositions
01/22/2003EP1107938B1 Recycling of thermosetting materials
01/22/2003EP0823922B1 Curable compositions composite coatings and process for having improved mar and abrasion resistance
01/22/2003CN1392883A Phosphorus-containing epoxy resin, flame-retardant highly heat-resistant epoxy resin composition containing resin, and laminate
01/22/2003CN1099434C Epxoy resin, epoxy resin composition and products of curing thereof
01/21/2003US6509417 Coating of fatty acid-modified glycidyl copolymer, OH polymer and optional anhydride polymer
01/21/2003US6509414 To produce laminates and printed wiring boards
01/21/2003US6509413 One-component powder coating of epoxy resin, epoxy-polyamine adduct and acid matting agent
01/21/2003US6509063 Preparation of polyindanebisphenols and polymers derived therefrom
01/21/2003US6509013 Water insoluble crosslinked allyl amine homo- or copolymer and carrier; removing phosphate from gastrointestinal tract; hyperphosphatemia
01/21/2003CA2224441C Photogeneration of amines from .alpha.-aminoacetophenones
01/16/2003WO2003004481A1 Process for manufacturing an a-dihydroxy derivative and epoxy resins prepared therefrom
01/16/2003US20030013600 Catalyst for production of epoxides and methods for production thereof and epoxides
01/15/2003EP1275674A1 Epoxy resin composition and prepreg made with the epoxy resin composition
01/15/2003EP1275673A2 Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same
01/15/2003EP1274783A2 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same
01/15/2003EP1274770A1 High strength polymers and aerospace sealants therefrom
01/15/2003CN1390870A Acid catalyzed copolymerization of water and epoxy resin and application thereof
01/15/2003CN1390748A Metal containers
01/14/2003US6507049 Encapsulants for solid state devices
01/14/2003US6506921 Amine compounds and curable compositions derived therefrom
01/14/2003US6506869 Anhydride-terminated polyimide from a dianhydride and a diaminopolysiloxane as curing agent
01/14/2003US6506868 Silane-modified polyamide(polyimide) and/or phenolic resin; heat resistance, high strength, noncracking
01/14/2003US6506821 A self-dispersible curable epoxy resin composition containing a reaction product of: (a) 1.0 equivalent of epoxy resin; equivalent of polyhydric phenol; and equivalent of an amine/epoxy adduct formed by reacting: (i) an aromatic
01/14/2003US6506517 Surface modified carbonaceous materials
01/14/2003US6506494 Curable epoxy resin, a latent curative system of one encapsulated in thermoplastic polymeric microcapsules and a second admixed in the curable epoxy resin
01/14/2003CA2064919C Adducts of epoxides and amines
01/09/2003WO2003002689A1 Water-holding material for soil
01/09/2003WO2003002663A2 Hydrolysis resistant polyesters and articles made therefrom
01/09/2003WO2003002662A1 Curable epoxy resin composition
01/09/2003WO2003002661A1 Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials
01/09/2003WO2003002057A2 Amine compounds and curable compositions derived therefrom
01/09/2003US20030008976 For producing pipes
01/09/2003US20030008947 Shelf-life
01/09/2003CA2452398A1 Curable epoxy resin composition
01/09/2003CA2451706A1 Amine compounds and curable compositions derived therefrom
01/09/2003CA2449265A1 Hydrolysis resistant polyesters and articles made therefrom
01/08/2003EP1273609A1 Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them
01/08/2003EP1273608A1 Flame-retardant epoxy resin composition, molded object thereof, and electronic part
01/08/2003EP1272587A1 Impact-resistant epoxy resin compositions
01/08/2003EP1272586A2 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
01/08/2003EP1272542A2 Gas barrier compositions having improved barrier properties
01/08/2003EP1272535A2 Hydrogels and methods for their production
01/08/2003EP1272346A2 Laminates and coated materials comprising hydroxy-phenoxyether polymers
01/08/2003EP1218178A4 An adhesion promoting layer for use with epoxy prepregs
01/08/2003CN1390246A Flame-retardant epoxy resin composition and liminate made with same
01/08/2003CN1390240A Continuous process for the production of polyether polyols
01/08/2003CN1390154A Metal salts of phosphoric acid esters as cross linking catalysts
01/07/2003US6503967 Hardener for epoxy resin and epoxy resin composition
01/07/2003US6503629 For forming a corrosion resistant coating film on steel, comprising a polyol-modified, amino group-containing epoxy resin modified with caprolactone
01/03/2003WO2003000798A1 Thermosetting resin composition, process for producing the same, and suspension-form mixture
01/02/2003US20030004296 Latent curing agent for epoxy resin, and curable epoxy resin composition
01/02/2003US20030004282 Smoothness, corrosion resistance
01/02/2003US20030004281 Glycidylester compositions and a process for their manufacture
01/02/2003US20030004270 Ammonia and organic amine catalysis of epoxy hybrid powder coatings
01/02/2003US20030004231 Epoxy resin modified with phosphate, phosphonate compound
01/02/2003US20030004230 Water-based coating composition
01/02/2003US20030004221 Lamination; display image
01/02/2003US20030003308 Oxygen-absorbing multi-layer film
01/02/2003US20030003305 Polytriazine product of cyanate ester monomer or prepolymer and a bismaleimide, and a flame inhibitor of a polyepoxide reacted with an organic phosphorus compound
01/02/2003US20030001140 For use in encapsulating electronic packages including optoelectronics such as light emitting diodes
01/02/2003US20030001135 Water dilutable amine curing agents for aqueous two component epoxy resin systems
01/02/2003EP1271578A2 Thermosetting composite dielectric film and method of manufacturing the same
01/02/2003EP1270668A1 Epoxy resin composition and electronic part
01/02/2003EP1270645A1 Resin for optical material
01/02/2003EP1270636A1 Photocurable composition, process for producing photocurable composition, photocurable pressure-sensitive adhesive sheet, process for producing photocurable pressure-sensitive adhesive sheet, and method of bonding
01/02/2003EP1270635A1 Solvent-based process for manufacturing latent curing catalysts
01/02/2003EP1270634A1 Resin composition containing aromatic episulfide and optical material
01/02/2003EP1270633A1 Alicylic epoxy compounds and their preparation process, alicylic epoxy resin composition, and encapsulant for light-emitting diode
01/02/2003EP1270632A1 Phosphorus-containing epoxy resin, flame-retardant highly heat-resistant epoxy resin composition containing the resin, and laminate
01/02/2003EP1270206A1 Oxygen-absorbing multi-layer film
01/02/2003EP1269261A2 Solid imaging compositions for preparing polypropylene-like articles
01/02/2003EP1268665A1 Flame retardant phosphorus element-containing epoxy resin compositions
01/02/2003EP1268636A1 Branched polymeric surfactant reaction products, methods for their preparation, and uses therefor
01/02/2003EP1268603A2 Mannich bases and further compounds based on alkyldipropylenetriamines as hardeners for epoxy resins
01/02/2003EP1268457A1 Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent