Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08G - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds › C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
04/2003
04/08/2003US6544652 Cyanate ester-containing insulating composition, insulating film made therefrom and multilayer printed circuit board having the film
04/08/2003US6544650 Modeling a first material with respect to a characteristic of the first material; modeling a second material with respect to a characteristic of the second value for characteristic; modeling an interface generating a set of evaluation data
04/08/2003CA2184318C Composite material, method for producing the same and composite material for lateral rigid member for track belt
04/08/2003CA2031679C Non-aqueous dispersions
04/03/2003WO2003027181A2 Low gloss asa resin
04/03/2003WO2003027164A1 Curable resin composition
04/03/2003WO2003026888A1 Autodeposition compositions
04/03/2003US20030065109 A curable epoxy resin comprising 5-methylresorcin monomer with epihalohydrin; low viscosity liquid, heat resistant cured product; electronic materials, materials for lamination, coating, adhesion
04/03/2003US20030065095 Comprising a bisphenol type epoxy resin, a phenol novolak type epoxy resin, and an aromatic amine curing agent; a cured product displays a breaking elongation of at least 5%; low viscosity, high stength, heat resistance; aircraft components
04/03/2003US20030064305 Photosensitive resin composition and printed wiring board
04/03/2003US20030064304 Photosensitive resin composition and printed wiring board
04/03/2003US20030064256 Weldable coating compositions having improved intercoat adhesion
04/03/2003US20030064228 Alicyclic epoxy resin, a polyamine and a dissolving latent acid catalyst
04/03/2003US20030062630 Heat resistant thermoplastic resin, epoxy resin and triphenol curing agent; reliable low temperatures bonding
04/03/2003US20030062125 Cationic-polymerizable compound, a photocationic initiator and aromatic ether compound or an aliphatic thioether; liquid crystal or electroluminescent display having excellent adhesive strength and moisture permeation resistance
04/03/2003CA2461735A1 Autodeposition compositions
04/03/2003CA2461234A1 Low gloss asa resin
04/03/2003CA2461012A1 Curable resin composition
04/02/2003EP1298155A1 Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board, and plugged-through-hole printed wiring board
04/02/2003EP1298154A1 Process for preparing epoxy resin
04/02/2003EP1297049A1 Accelerators for cationic polymerization catalyzed by iron-based catalysts
04/02/2003EP1297048A1 Low moisture absorption epoxy resin systems
04/02/2003EP1192199A4 Phenol-novolacs with improved optical properties
04/02/2003EP1095089B1 Hardener for epoxy resins
04/02/2003EP1030885B1 Water compatible curing agents for epoxy resins
04/02/2003EP0745640B1 Prepreg and fiber-reinforced composite material
04/02/2003EP0711314B9 Viscosity-modified lactide polymer composition and process for manufacture thereof
04/01/2003US6541541 Epoxy resin or polyepoxy compound based on glycidol and a bisphenol compound; use as sizing agent for glass fibers; fiber-reinforced resins resistant to thermal coloring and excellent in physical properties
04/01/2003US6541535 Binder oligomer or polymer comprises terminally and/or laterally, at least one vinyl ether group a) and at least one group b) which is coreactive with the vinyl ether groups
04/01/2003US6540942 Nonaqueous compositions and additives therefor
04/01/2003CA2088346C Process for preparing metal cyanide complex catalyst
03/2003
03/27/2003WO2003025043A1 Resin composition for optical-semiconductor encapsulation
03/27/2003WO2003007078A3 Photocurable resist inks
03/27/2003WO2002100538A3 Method for the production of cycloaliphatic compounds having side chains with epoxy groups by hydrogenation on ru/s102 catalysts
03/27/2003US20030059618 Waterproofing, heta resistance, radiation transparent; encapsulating electronics
03/27/2003US20030059561 Coating interior surface with polymer; gas barrier; corrosion resistance; beverage cans
03/27/2003US20030057402 Conductive resin composition
03/27/2003CA2442314A1 Photosemiconductor encapsulating resin composition
03/26/2003EP1296189A2 Photosensitive resin composition and printed wiring board
03/26/2003EP1296188A2 Photosensitive resin composition and printed wiring board
03/26/2003EP1295900A2 Uses of epoxy-acrylates
03/26/2003EP1295899A2 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink
03/26/2003EP1295857A1 Aqueous resin composition
03/26/2003EP1295181A2 Method for making or adding structures to an article
03/26/2003EP1114076B1 Accelerators for hardenable systems
03/26/2003CN1405199A Polyfunctional epoxy resin and its preparation method
03/26/2003CN1103791C Polymer material, process for its production and use thereof
03/25/2003US6538052 Curable compositions of glycidyl compounds, aminic hardeners and novel low viscosity curing accelerators
03/25/2003US6537729 Solid imaging compositions for preparing polyethylene-like articles
03/25/2003CA2404979A1 Conductive resin composition
03/20/2003WO2003022953A1 Structural hot melt material and methods
03/20/2003WO2003022952A1 Adhesive for gas barrier laminates and laminated films
03/20/2003WO2003022949A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
03/20/2003WO2003022904A1 Network polymers comprising epoxy-terminated esters
03/20/2003US20030055131 For applying to automobile body
03/20/2003US20030054173 Sound damping for automobiles; blend of flexible and rigidity epoxy resin and curing agents
03/20/2003US20030054146 Epoxy resin composition and laminate using the same
03/20/2003US20030052310 Perfluorinated amide salts and their uses as ionic conducting materials
03/20/2003US20030051807 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
03/20/2003CA2460312A1 Network polymers comprising epoxy-terminated esters
03/20/2003CA2427866A1 Structural hot melt material and methods
03/19/2003EP1293549A1 Adhesive for resin roll assembly and resin roll
03/19/2003EP1293536A1 Sealing material for plastic liquid crystal display cells
03/19/2003EP1292859A2 Data storage medium comprising colloidal metal and preparation process thereof
03/19/2003EP0929608B1 Curable thermoset resin composition
03/19/2003CN1404493A Gas barrier compositions having improved barrier properties
03/18/2003US6534621 Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom
03/18/2003US6534601 Flame retardant epoxy resin modified with phosphorus and silicon
03/18/2003US6534554 Microdomains of acidic and basic resins in contact with each other; water purification; recovering sugars, proteins, metals
03/18/2003US6534193 Liquid epoxy resin composition and semiconductor device
03/18/2003US6534179 Polytriazine product of cyanate ester monomer or prepolymer and a bismaleimide, and a flame inhibitor of a polyepoxide reacted with an organic phosphorus compound
03/18/2003US6534178 Carboxyl-functional polyester epoxy resin powder coatings based on 1,3-propanediol
03/18/2003US6533503 Polymerizable monomer or curable resin, a polymerization initiator and/or curing accelerator that can be activated and/or released thermally at a temperature above 30 degrees Celcius, and optional filler; pot life and faster curing time
03/13/2003WO2003020789A1 Low viscosity curing agents compositions in epoxy resin systems for low temperature cure applications
03/13/2003WO2003020788A1 Thermoplastic poly(hydroxy amino ether) binder
03/13/2003WO2003020512A1 High nitrogen containing triazine-phenol-aldehyde condensate
03/13/2003WO2002074839A3 Abrasive articles having a polymeric material
03/13/2003WO2002048234A3 Epoxy resins and process for making the same
03/13/2003US20030050421 Polymer composition and method of rapid preparation in situ
03/13/2003US20030050399 Cured epoxy resin provides solder crack resistance on use of lead-free solder and improved flame retardance
03/13/2003US20030047279 Adhesive and coating formulations for flexible packaging
03/12/2003EP1291404A1 Optical adhesive composition and optical apparatus
03/12/2003EP1291390A1 Conductive resin composition
03/12/2003EP1290089A2 Soft polymer composition including epoxy
03/12/2003EP1290058A2 Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom
03/12/2003EP1290054A1 Glyoxal-phenolic condensates with enhanced fluorescence
03/12/2003EP1127094B1 Curable coating compositions containing blends of carbamate-functional compounds
03/12/2003CN1402840A Non-aromatic chromophores for use in polymer anti-reflective coatings
03/12/2003CN1102846C Photopolymerizable dental compositions
03/11/2003US6531567 Hardeners for epoxy resins
03/11/2003US6531549 Crystallized epoxy resins, their production method, and curable compositions comprising them
03/06/2003WO2003018665A1 Process for the preparation of activated polyethylene glycols
03/06/2003WO2003018663A1 Deodorizing agent for sulfur- or nitrogen-containing initiators
03/06/2003WO2002059177A3 Poly (hydroxyaminoethers) having a low chloride content
03/06/2003US20030045650 A reaction product of an epoxy resin and an alkyl-substituted acetoacetate and a reaction product of an alcohol having atleast one hydroxyl group in one molecule and an alkyl substituted acetoacetate; solvent-free
03/06/2003US20030045635 Polysilazane-modified polyamine hardeners for epoxy resins
03/06/2003US20030044618 Reacting a bromine-containing epoxy resin and a (meth)acrylic acid; mixing with polyacrylate ester monomer; and curing with ultraviolet radiation or electron beams; useful with optical fiber, lens, and communication device.
03/06/2003US20030044605 Insulated electrical coil having enhanced oxidation resistant polymeric insulation composition
03/06/2003US20030044521 Low voc laminating formulations
03/06/2003US20030042466 Modified blend of epoxy resin and polyanhydride
1 ... 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 ... 303