| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 04/29/2003 | US6555591 Foam cross-linked with metal salt and process for production |
| 04/29/2003 | US6555227 Heat curing; adhesives |
| 04/29/2003 | US6555023 Enhanced oxidation resistant polymeric insulation composition for air-cooled generators |
| 04/25/2003 | CA2391059A1 Powder coating material and functional coatings for high long-term service temperatures |
| 04/24/2003 | WO2003034152A1 Composition for forming antireflection film for lithography |
| 04/24/2003 | WO2003033500A1 Photoactivable nitrogen bases |
| 04/24/2003 | WO2003007319A3 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes |
| 04/24/2003 | US20030078322 Conductive resin compositions and electronic parts using the same |
| 04/23/2003 | EP1303568A2 Method of manufacturing a replica as well as a replica obtained by carrying out a uv light-initiated cationic polymerization |
| 04/23/2003 | EP1303567A1 Volume-modified casting compounds based on polymeric matrix resins |
| 04/23/2003 | EP1303553A2 Radiation-curable compositions and cured articles |
| 04/23/2003 | EP1196239B1 Process and apparatus for preparing a composition of matter utilizing an ultrasonic device |
| 04/23/2003 | EP1135429B1 Polyadditions in aqueous and non-aqueous mini-emulsions |
| 04/23/2003 | EP1109869B1 Aqueous powder lacquer dispersion |
| 04/23/2003 | EP0938526B1 Thermosettable pressure sensitive adhesive |
| 04/23/2003 | EP0861277B1 Powderable reactive resin compositions |
| 04/23/2003 | EP0851887B1 Epoxy resin compositions, prepregs, cured composites, and methods of making the same |
| 04/23/2003 | EP0813621B1 Cathodic electrodeposition method utilizing cyclic carbonate-curable coating composition |
| 04/23/2003 | CN1412837A 电子元件 Electronic component |
| 04/23/2003 | CN1412244A Toughened thermosetting resin and its preparation method |
| 04/23/2003 | CN1412217A Closed circulating packed tower for preparing epoxyethane and epoxypropane polymer |
| 04/23/2003 | CN1412215A Multicomponent in suit foaming system and its use |
| 04/23/2003 | CN1106418C Sealant use in welding flux connecting piece of sealed electron package device and sealing method |
| 04/23/2003 | CN1106417C Polymerizable composition based on epoxides |
| 04/23/2003 | CN1106273C Soluble-fusible phenolic resin with improved optical properties |
| 04/22/2003 | US6552144 Process for the continuous production of gel free polymers, and powder and liquid coating applications containing gel free polymers |
| 04/22/2003 | US6552134 Isocyanate-modified epoxy-functional polyester |
| 04/22/2003 | US6552127 Thermoplastic resin composition |
| 04/22/2003 | US6551714 Flame-retardant resin composition, and prepregs and laminates using such composition |
| 04/22/2003 | US6551711 Metal-polymer composite comprises metal and substrate layer disposed on the metal, substrate layer formed from curable thermosetting resin system comprising a curing agent and 0.1 to 100 weight percent episulfide |
| 04/22/2003 | CA2219483C Material comprising a polyamide, a polyether-polyamide block polymer and a functionalized polyolefin, film and object obtained from the said material |
| 04/22/2003 | CA2112862C Electrodeposition coating composition comprising crosslinked microparticles |
| 04/17/2003 | WO2003032090A1 Photosensitive resin composition |
| 04/17/2003 | WO2003031495A1 Adducts consisting of epoxides and polyaminoamides containing imidazoline groups |
| 04/17/2003 | WO2003031494A1 Polyester |
| 04/17/2003 | WO2003031493A1 Method for the production of tubes in composite materials |
| 04/17/2003 | WO2003031492A1 Thermally reworkable epoxy resins and compositions based thereo n |
| 04/17/2003 | WO2003031424A1 Polyepoxy compounds having an amide linkage |
| 04/17/2003 | US20030073802 Process for preparing epoxy resin |
| 04/17/2003 | US20030073801 Shrinkage inhibition; dimensional stability |
| 04/17/2003 | US20030073781 Phosphorus-containing resin and flame retardant resin composition containing the same |
| 04/17/2003 | US20030073770 Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent |
| 04/17/2003 | US20030071368 Epoxy resin compositions, solid state devices encapsulated therewith and method |
| 04/17/2003 | US20030071367 Epoxy resin compositions, solid state devices encapsulated therewith and method |
| 04/17/2003 | US20030071366 For encapsulating a solid state device, such as a light emitting diode |
| 04/17/2003 | CA2462339A1 Polyepoxy compounds having an amide linkage |
| 04/16/2003 | EP1302499A2 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink |
| 04/16/2003 | EP1302495A1 Epoxy resin composition and fiber-reinforced composite material formed with the epoxy resin composition |
| 04/16/2003 | EP1302492A1 Multi-component local foaming system and its use |
| 04/16/2003 | EP1301553A2 High functional polymers |
| 04/16/2003 | EP0885913B1 Copolyether and solid polymer electrolyte |
| 04/16/2003 | CN1411478A Ambient-temp-stable one-part curable epoxy adhesive |
| 04/16/2003 | CN1105749C Conductive epoxy resin compositions and application thereof |
| 04/15/2003 | US6548627 Flame-retardant phosphorus-modified epoxy resins |
| 04/15/2003 | US6548620 Epoxy resin composition and process for producing the same |
| 04/15/2003 | US6548608 Polyetherimide and/or polysulphone, aromatic polyamine-modified epoxy resin and thermoplastic |
| 04/15/2003 | US6548576 Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
| 04/15/2003 | US6548575 High temperature underfilling material with low exotherm during use |
| 04/15/2003 | US6548566 Laminating adhesives hardenable by radiation |
| 04/15/2003 | US6548189 Epoxidized cashew nutshell liquid, a catalyst, and bisphenol a diglycidyl ether |
| 04/15/2003 | US6548175 Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof |
| 04/15/2003 | CA2043337C Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation |
| 04/10/2003 | WO2003029327A1 Particulate hydrophobic polymer, production process therefor and column for reversed-phase high-performance liquid chromatography |
| 04/10/2003 | WO2003029323A1 Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition |
| 04/10/2003 | WO2003029322A1 Curing agent composition for epoxy resins, epoxy resin composition and use thereof |
| 04/10/2003 | WO2003029321A1 Epoxy resin compositions and semiconductor devices |
| 04/10/2003 | WO2003029258A1 Oligomeric, hydroxy-terminated phosphonates |
| 04/10/2003 | WO2003029255A1 Vinyl silane compounds containing epoxy functionality |
| 04/10/2003 | WO2003029234A1 Epoxy compounds containing styrenic or cinnamyl functionality |
| 04/10/2003 | WO2003028644A2 Preparation of oligomeric cyclocarbonates and their use in ionisocyanate or hybrid nonisocyanate polyurethanes |
| 04/10/2003 | US20030069384 Preparation of polyindanebisphenols and polymers derived therefrom |
| 04/10/2003 | US20030069357 Aromatic oligomer, phenolic resin composition containing the same, and epoxy resin composition and cured product obtained therefrom |
| 04/10/2003 | US20030069356 Comprising an organophosphorus compound, a trifunctional epoxy resin and a bifunctional epoxy resin; curing; semiconductor coatings; electronic and electrical apparatus prepregs |
| 04/10/2003 | US20030069355 Low cure powder compositions for heat sensitive substrates |
| 04/10/2003 | US20030069349 Liquid epoxy resin composition and semiconductor device |
| 04/10/2003 | US20030069340 Thermoplastic poly (hydroxy amino ether) binder |
| 04/10/2003 | US20030069335 Structural hot melt material and methods |
| 04/10/2003 | US20030069331 Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
| 04/10/2003 | US20030068567 Photosensitive resin composition and printed wiring board |
| 04/10/2003 | US20030068498 An aqueous blends comprising one dispersed epoxy resin, one dispersed acrylic resin and curing agent as protective coatings for metallic substrate; nongloss, corrosion resistance, and uniform appearance |
| 04/10/2003 | US20030066988 Electroconductivity coloring |
| 04/10/2003 | CA2461698A1 Particulate hydrophobic polymer, production process therefor and column for reversed-phase high-performance liquid chromatography |
| 04/09/2003 | EP1300444A1 Epoxy resin composition and cured object obtained therefrom |
| 04/09/2003 | EP1300409A1 Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins made by using the derivatives, flame-retardant resin compositions, sealing media and laminated sheets |
| 04/09/2003 | EP1299448A1 Accelerators useful for energy polymerizable compositions |
| 04/09/2003 | EP1299447A2 No-flow flux adhesive compositions |
| 04/09/2003 | EP1274770A4 High strength polymers and aerospace sealants therefrom |
| 04/09/2003 | EP1017750B1 Clear powder coating |
| 04/09/2003 | EP0981569B1 Method for polymerizing cyclic ether |
| 04/09/2003 | EP0961797B1 Aqueous binding agent dispersion for cationic electro-dipcoat paint |
| 04/09/2003 | EP0624173B2 Precatalyzed catalyst compositions, process for preparing resins |
| 04/09/2003 | CN1409173A Photosensitive resin composition and printing circuit board |
| 04/09/2003 | CN1409172A Photosensitive resin composition and printing circuit board |
| 04/09/2003 | CN1408765A Resin composition for insulation and laminated body using said composition |
| 04/09/2003 | CN1408764A Light solidified and heat solidified resin composition and method for producing printed circuit board |
| 04/09/2003 | CN1408743A Process for preparing epoxy resin |
| 04/09/2003 | CN1105161C Heat-conductive paste |
| 04/09/2003 | CN1105132C 环氧树脂组合物和半导体器件 Epoxy resin composition and a semiconductor device |
| 04/09/2003 | CN1105128C Process for deactivating catalyst contained in formaldehyde copolymer and process for producing stabilized formaldehyde copolymer |
| 04/09/2003 | CN1105127C Process for producing stabilized formaldehyde copolymers |