| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 05/28/2003 | EP1314748A2 Curable resin compositions |
| 05/28/2003 | EP1314716A1 Amine phenolic compounds and their use as hardener and/or accelerators in epoxy coatings |
| 05/28/2003 | EP1314197A1 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| 05/28/2003 | EP1060205B1 Water dispersible curing agents for epoxy resin |
| 05/28/2003 | CN1109702C Epoxy resin compn. for printed wiring board and laminated board produced with use of same |
| 05/27/2003 | US6570029 No-flow reworkable epoxy underfills for flip-chip applications |
| 05/27/2003 | US6569983 Using Jeffamines"; fracturing subterranean formation |
| 05/27/2003 | US6569959 Modified phenolic hydroxyl-containing resin by reacting epoxy resin with difunctional phenol |
| 05/27/2003 | US6569926 Polymer compound with improved gloss properties |
| 05/27/2003 | US6569910 Ion exchange resins and methods of making the same |
| 05/27/2003 | CA2310960C Phosphate-binding polymers for oral administration |
| 05/27/2003 | CA2083058C Post-extended anionic polyurethane dispersion |
| 05/22/2003 | WO2003042316A1 Low read-through epoxy-bonded smc |
| 05/22/2003 | WO2003042298A1 Modified epoxy resins |
| 05/22/2003 | WO2003042275A1 Autodepositing anionic epoxy resin water dispersion |
| 05/22/2003 | US20030094738 Mixture of photocationic polymerizable substance and a photocationic polymerization initiator contains an oxetane such as 3- ethyl-3-hydroxymethyloxetane to suppress of odor and cloudiness even when heated |
| 05/22/2003 | US20030094237 For manufacturing/implanting bioprostheses such as heart valve prostheses, surgical patch, annuloplasty rings, and pacemakers |
| 05/22/2003 | CA2466980A1 Autodepositing anionic epoxy resin water dispersion |
| 05/22/2003 | CA2466063A1 Low read-through epoxy-bonded smc |
| 05/21/2003 | EP1312127A2 Epoxy nitrile insulator and seal for fuel cell assemblies |
| 05/21/2003 | EP1163288B1 Heat-curable, thermally expandable moulded part |
| 05/21/2003 | EP0835322B1 Dehalogenation of polyamine, neutral curing wet strength resins |
| 05/21/2003 | EP0782601B1 Epoxy adhesive composition |
| 05/21/2003 | CN1419573A Mannich bases and further compounds based on alkyldipropylenetriamines as hardeners for epoxy resins |
| 05/21/2003 | CN1109058C Composite catalyst of bimetal cyanide and its preparing process and application |
| 05/20/2003 | US6566423 Mixtures comprising epoxide compounds and their use |
| 05/20/2003 | US6566414 Using radiating microwave for heating and curing epoxy resin and curing agent formulation |
| 05/20/2003 | US6565772 Epoxy resin; mixing under vacuum |
| 05/20/2003 | CA2063971C Hardeners for powder coating compositions based on polyester resins |
| 05/15/2003 | WO2003041465A1 Photoimageable dielectric material for circuit protection |
| 05/15/2003 | WO2003041464A2 Improved epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
| 05/15/2003 | WO2003040251A1 High temperature epoxy adhesive films |
| 05/15/2003 | WO2003040206A1 Epoxy resin compositions for fiber-reinforced composite materials, process for production of the materials and fiber-reinforced composite materials |
| 05/15/2003 | WO2003040203A1 Curable composition excellent in optical characteristics |
| 05/15/2003 | WO2003040133A1 Maleic acid derivative and curable composition containing the same |
| 05/15/2003 | WO2003039849A1 Spoolable composite tubing with a catalytically cured matrix |
| 05/15/2003 | US20030092852 Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same |
| 05/15/2003 | US20030092777 Multi-component, on site foaming system and its use |
| 05/15/2003 | US20030091844 Crosslinked elastic polymer in a photo- or thermally-polymerizable resin |
| 05/15/2003 | US20030091833 One pot production of polyurethanes for use as adhesives, sealing compounds, and as coating materials in automotive/furniture finishing |
| 05/15/2003 | US20030091830 Powder coating material and functional coatings for high long-term service temperature |
| 05/15/2003 | CA2465958A1 Spoolable composite tubing with a catalytically cured matrix |
| 05/14/2003 | EP1310534A1 Treating primer for coil coating |
| 05/14/2003 | EP1310525A1 Copper foil with resin and printed wiring boards made by using the same |
| 05/14/2003 | EP1309645A2 Use of cross-linker and compositions made therefrom |
| 05/14/2003 | EP1210480B1 Method of producing paper, paperboard and cardboard |
| 05/14/2003 | EP1012200B1 Epoxy resin compositions |
| 05/14/2003 | EP0861278B1 Reactive resin manufacture |
| 05/14/2003 | CN1417246A In-situ and inclusion polymerization process of preparing composite particle/epoxy resin nano material |
| 05/14/2003 | CN1417196A Compound with (methyl) acrylyl radical and its preparation process |
| 05/14/2003 | CN1108333C High internal phase ratio emulsions and stable aqueous dispersions of hydroxy-functional polymers |
| 05/13/2003 | US6562934 Reacting diamine and alkenyl compound in presence of strong base catalyst to form amino compound useful as curing agent for epoxy resins; pot life |
| 05/13/2003 | US6562884 Epoxy resin compositions having a long shelf life |
| 05/13/2003 | US6562482 Liquid potting composition |
| 05/13/2003 | US6562410 Heat curable epoxy compositions |
| 05/13/2003 | US6562179 High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of these |
| 05/08/2003 | WO2003038887A1 Contact planarization materials that generate no volatile byproducts or residue during curing |
| 05/08/2003 | WO2003037985A1 Curable epoxy resin compositions and process for production thereof |
| 05/08/2003 | WO2003037976A1 Curable organic resin composition |
| 05/08/2003 | WO2003037965A1 Sliding member and pump |
| 05/08/2003 | WO2003037955A1 Process for producing phenolic resin and epoxy resin |
| 05/08/2003 | WO2003037954A1 Phenolic resin, epoxy resin, process for producing the same, and resin composition for semiconductor encapsulation material |
| 05/08/2003 | WO2003037953A1 Resin composition |
| 05/08/2003 | US20030088036 Toughened thermosetting resins and preparation of the same |
| 05/08/2003 | US20030087992 Containing a curing agent, a curing accelerator and an inorganic filler that has a particle size of a maximum particle diameter of not more than 10 mu m and a mean particle diameter of not more than 3 mu m |
| 05/08/2003 | US20030087189 Photosensitive resin composition |
| 05/08/2003 | US20030087101 Resin-coated copper foil, and printed wiring board using resin-coated copper foil |
| 05/08/2003 | US20030087052 Spoolable composite tubing with a catalytically cured matrix |
| 05/08/2003 | CA2462613A1 Contact planarization materials that generate no volatile byproducts or residue during curing |
| 05/07/2003 | EP1308471A2 Radiation curable resin composition for Fresnel lens and Fresnel lens sheet |
| 05/07/2003 | EP1308434A1 (Meth)acryloyl group-containing compound and method for producing the same |
| 05/07/2003 | EP1307497A2 Epoxy resins and process for making the same |
| 05/07/2003 | EP1141072B1 Epoxy functional polyester resins, process for their preparation, and outdoor durable coating compositions comprising them |
| 05/07/2003 | EP0889863B1 Surface modified carbonate materials |
| 05/07/2003 | EP0690729B1 Superabsorbent polymer foam |
| 05/07/2003 | CN1415642A P or si modified flame vesistant ether resin |
| 05/07/2003 | CN1415641A Epoxy resin and its prepn. method |
| 05/06/2003 | US6559269 Resin having both oxirane rings and thiirane rings and an oxazolidine compound as the latent curing agent; storage stability |
| 05/06/2003 | US6559268 Perfluoro group-containing compounds and hardened polymer of the same |
| 05/06/2003 | US6558871 Photopolymerization initiator comprising at least one of diaryliodonium salt |
| 05/06/2003 | US6558812 Liquid epoxy resin composition and semiconductor device |
| 05/06/2003 | US6558797 Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same |
| 05/06/2003 | US6558796 Aqueous coating compositions with phosphonic acid based compounds |
| 05/02/2003 | EP1306414A2 Powdery coating composition, functional coatings with a higher service life temperature |
| 05/02/2003 | EP1306400A1 Flame retardant epoxy resin modified with phosphorus and silicon |
| 05/02/2003 | EP1306369A1 Novel sulfur compounds and intermolecular compounds containing the same as the component compound |
| 05/02/2003 | EP1115563A4 Phenol-novolacs with improved optical properties |
| 05/01/2003 | WO2003035778A2 Thermally curable binding agents |
| 05/01/2003 | WO2003035718A1 Hardenable cyanate compositions |
| 05/01/2003 | US20030083452 Adhesion promoters or curable compositions |
| 05/01/2003 | US20030083397 Dual cure coating composition and process for using the same |
| 05/01/2003 | US20030082385 Mixture of carbon fibers, epoxy resin and curing agents |
| 05/01/2003 | US20030082355 Photopoilymerization; anhydride crosslinked phenolic resin |
| 05/01/2003 | CA2463069A1 Thermally curable binding agents |
| 04/30/2003 | CN1414030A Active energy ray solidified resin composition for Fresnel lens and Fresnel lens rasher |
| 04/29/2003 | US6555628 Controlled conversion resins derived from reacting epoxy resin, dihydric phenol, acid anhydride, and/or amine; protective/powder coatings |
| 04/29/2003 | US6555622 Vinyl polymer having a reactive functional group selected from the group containing an alcoholic hydroxyl, phenolic hydroxyl, amino, amido and carboxyl group prepared by living radical polymerization |
| 04/29/2003 | US6555617 Modified polyvinyl acetal resin obtained by acetalizing a polyvinyl alcohol with an aldehyde and then modifying the resultant acetalization product with an acid anhydride |
| 04/29/2003 | US6555602 Semiconductor encapsulation with low viscosity at </= 80 degrees c |
| 04/29/2003 | US6555592 Epoxidized novolak phenolic resin modified with an unsaturated monobasic carboxylic acid, a dibasic acid, and an acid anhydride, a photopolymerizable monomer, photoinitiator and an epoxy novolak resin; use as solder mask |