Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
07/2003
07/02/2003EP1323759A1 Powder coating composition containing low temperature curable epoxy resin
07/02/2003EP1323742A2 Radiation sensitive refractive index changing composition and refractive index changing method
07/02/2003EP1322691A1 Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers
07/02/2003EP1030894B1 Conductive organic coatings
07/02/2003EP0738759B1 Epoxy resin composition for sealing photosemiconductor device
07/02/2003CN1427831A Reworkable composition of oxirane (S) or thiirane (S)-containing resin and curing agent
07/02/2003CN1427753A Fluxing under fill compositions
07/02/2003CN1427306A Radiation sensitive refractivity change composition and method for changing refractivity
07/02/2003CN1427051A Composition using low-temp hardening epoxy resin for powdery paint
07/02/2003CN1427035A Paste for connecting circuit, anisotropic conducting paste and application thereof
07/02/2003CN1426996A N-(aminopropyl)-tolylene diamine and its application as epoxy curing agent
07/02/2003CN1426995A N-cyanoethylated 0-and meta-tolylene diamine composition and preparing process thereof
07/02/2003CN1113074C Phenolic resin as water-unaffected accelerators for epoxy resin hardeners
07/01/2003US6586607 Esterification of bis/2-hydroxyethoxy/benzene/-m/ using propylene or ethylene carbonate in the presence of triphenylphosphine catalysts, then reacting with epichlorohydrin to form epoxy resins
07/01/2003US6586526 Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof
07/01/2003US6586512 Composition comprising superabsorbent polymer comprising at least one polymerized monomer selected from carboxylic acid, acrylamide, or derivatives thereof, and binding amount of hydroxy-functionalized polyether
07/01/2003US6586495 Alkylsiloxane-containing epoxy resin composition, surface modifying method using the same, ink-jet recording head and liquid-jet recording apparatus
06/2003
06/26/2003WO2003052813A2 Dual cure b-stageable underfill for wafer level
06/26/2003WO2003052016A2 Dual cure b-stageable adhesive for die attach
06/26/2003WO2003051955A1 Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom
06/26/2003WO2003051649A2 Method of making models
06/26/2003US20030120021 Crosslinking agents
06/26/2003US20030119987 Non-polyvinyl chloride, interpenetrating network epoxy/urethane acrylates
06/26/2003US20030119931 Photopolymerizable mixtures of a vinyl ether, photoinitiator system of an iodonium salt, a visible light sensitizer, and electron donor compound, and optional spiroorthocarbonates, epoxides, polyols; e.g. dental composites
06/26/2003US20030119930 Polyether polyols with increased functionality
06/26/2003US20030118834 Epoxy curing agent emulsification for TTR application
06/26/2003US20030116347 Electronic component
06/25/2003EP1321481A1 Modified polyolefin resin, modified polyolefin resin composition, and use thereof
06/25/2003EP1321459A2 N-Cyanoethylated ortho and meta toluenediamine compositions and process for making them
06/25/2003EP1321453A2 N-(Aminopropyl)-toluenediamines and their use as epoxy curing agents
06/25/2003EP0620259B1 Epoxy/polyester hot melt compositions
06/25/2003CN1112723C Mounting structure and mounting process for semiconductor device
06/25/2003CN1112418C Solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers
06/24/2003US6583198 A photocurable resin consists of an acid modified vinyl group containing epoxy resin, an elastomer, a photopolymerization initiator, a diluent and a curing agent, can give high performance cured film
06/24/2003US6582781 Multilayer cholesteric pigments
06/21/2003CA2414760A1 Radiation sensitive refractive index changing composition and refractive index changing method
06/19/2003WO2003050188A1 Epoxy resin composition and light source cover for illumination
06/19/2003US20030114606 A phosphazene compound or polyphosphazenes; fireproofing
06/19/2003US20030114556 Epoxy resin component, filler, initiator; filler contains silanized fused silica; processable as a one-component system
06/19/2003US20030113662 Photo-curable resin composition, patterning process, and substrate protecting film
06/19/2003US20030113544 Radiation curable resin composition for fresnel lens and fresnel lens sheet
06/19/2003US20030112307 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink
06/19/2003US20030111174 A fast curable blends comprising a reactive elastomer, an epoxy resin, a phenol resin and a curing accelerator; used in flip-chip mounting, preventing the popcorn phenomenon and delamination
06/18/2003EP1319677A1 Accelerator system for epoxy resins
06/18/2003EP1319038A2 Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers
06/18/2003EP1319031A2 Method of preparing particulate crosslinked polymer
06/18/2003EP1282660A4 Rheology-controlled epoxy-based compositions
06/18/2003EP0973808B1 Non-toxic initiators, resins with cross-linkable organofunctional groups containing same, and use for preparing stable and non-toxic polymers
06/18/2003DE10211295C1 Production of epoxy-terminated polymeric polysulfide, useful for producing e.g. adhesive, coating or sealant, involves dissolving thiol-terminated polymeric polysulfide in excess epichlorohydrin and starting reaction with alkali hydroxide
06/18/2003CN1425042A Coherent insert
06/17/2003US6579914 Cationic photoinitiator for aliphatic epoxide, free radical photoinitiator for urethane diacrylate oligomer, reactive diluent; improved stress relaxation, good adhesion to glass; no copolymerization between the epoxide and diacrylate
06/17/2003US6579566 One-component epoxy resin system for trickle impregnation and hot dip rolling
06/17/2003US6579325 Silicone compositions for treating wool materials
06/17/2003CA2079657C Solid compositions of polyglycidyl compounds having a molecular weight of less than 1500
06/12/2003WO2003048251A1 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s)
06/12/2003WO2003048171A1 Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins
06/12/2003WO2003048170A1 Basic silane coupling agent-organic carboxylic acid salt composition, process for preparing the salt composition and epoxy resin compositions containing the same
06/12/2003WO2003048066A1 Sizing composition for glass yarns, the glass yarns thus obtained and composite materials comprising said yarns
06/12/2003US20030109378 Hardening catalyst containing tetraalkylphosphonium tetrafluoroborate for baking at low temperature; improving storage stability and pot life
06/12/2003US20030108810 Deodorizing agent for sulfur- or nitrogen-containing salt photoinitiators
06/11/2003EP1317498A2 Holographic storage medium comprising polyfunctional epoxy monomers capable of undergoing cationic polymerization
06/11/2003EP1086403B1 Liquid, radiation-curable composition, especially for stereolithography
06/11/2003EP0974078B1 Ternary photoinitiator system for curing of epoxy/polyol resin compositions
06/11/2003CN1423678A Flame retardant phosphorus element-containing epoxy resin compositions
06/11/2003CN1423674A Flame retardant epoxy molding compositions
06/11/2003CN1422883A Epoxide polymerization catalyst preparation method
06/10/2003US6577492 Use of 9,9-bis(aminophenyl)fluorene curing agents reduces water adsorption in the dielectric layer
06/10/2003US6576690 Phosphorous-containing flame retarding epoxy resin and an epoxy resin composition containing the same
06/10/2003US6576688 Waterborne sanitary can coating compositions
06/10/2003US6576382 Photosensitive cationically polymerizable epoxy based system does not contain bromine; useful as a solder mask
06/10/2003US6576297 Curable resin compositions
06/10/2003US6576159 Colorants, electroconductive materials; solubility, dissociation
06/10/2003CA2269803C Gas barrier coating compositions containing platelet-type fillers
06/10/2003CA2176203C Water soluble active sulfones of poly(ethylene glycol)
06/05/2003WO2003046076A1 Toughened thermosetting resins and preparation of the same
06/05/2003WO2003046042A1 Radiation curable resin composition for making colored three dimensional objects
06/05/2003WO2003046026A1 Epoxy group containing vinylidene fluoride copolymer, and resin composition, electrode structure and non-aqueous electrochemical element comprising the same
06/05/2003US20030105268 Converting an aryl allyl ether of a phenol to an alpha -dihydroxy derivative in the presence of an oxidant and a catalyst, which is further converted to an aryl glycidyl ether epoxy resin
06/04/2003EP1316574A1 Aqueous hardeners for aqueous epoxy resin dispersions
06/04/2003EP1165647B1 Single component adhesive with an adaptable open joint time
06/04/2003EP0980353B1 Cationically polymerizable compositions capable of being coated by electrostatic assistance
06/04/2003EP0970161B1 Boroxine compositions
06/04/2003CN1422394A Liquid, radiation-curable composition, especially for stereolithography
06/04/2003CN1422316A Impact-resistant epoxy resin compositions
06/04/2003CN1422293A Aqueous two-component cross-linkable composition
06/03/2003US6573357 Contacting a ketone with a polyamine; removing a water by-product produced in the reaction mixture; removing the excess of ketone reactant from the reaction mixture and recycling a portion of it; recovering ketimine
06/03/2003US6573309 Heat-curable, thermally expandable moulded park
06/03/2003US6572980 Curable epoxy or episulfide containing aromatic compound and curing agent; repair, replacement, recovery and/or recycling of electronics
06/03/2003US6572972 Aqueous binders
06/03/2003US6572971 Structural modified epoxy adhesive compositions
05/2003
05/30/2003WO2003044089A1 Thermosetting resin compositions useful as underfill sealants
05/30/2003WO2003044074A1 Process for the alkoxylation of organic compounds
05/30/2003WO2003044073A1 Process for the polymerisation of epoxy resins
05/30/2003WO2003043973A2 Amine phenolic compounds and their use as hardeners and/or accelerators in epoxy coatings
05/30/2003WO2003027181A3 Low gloss asa resin
05/30/2003CA2467488A1 Process for the polymerisation of epoxy resins
05/29/2003US20030100676 An oxazolidine compound which can be used as a latent curing agent for a moisture curable epoxy or polyepoxide resin
05/29/2003US20030099839 Free of halogen and diantimony trioxide; useful as an encapsulating material in the semiconductor industry
05/29/2003US20030099824 For producing coatings with high hardness, scratch resistance, abrasion resistance, low curling properties, adhesion, and chemical resistance
05/29/2003US20030098649 Alicylic epoxy compounds and their preparation process, alicylic epoxy resin composition, and encapsulant for light-emitting diode