Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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07/02/2003 | EP1323759A1 Powder coating composition containing low temperature curable epoxy resin |
07/02/2003 | EP1323742A2 Radiation sensitive refractive index changing composition and refractive index changing method |
07/02/2003 | EP1322691A1 Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers |
07/02/2003 | EP1030894B1 Conductive organic coatings |
07/02/2003 | EP0738759B1 Epoxy resin composition for sealing photosemiconductor device |
07/02/2003 | CN1427831A Reworkable composition of oxirane (S) or thiirane (S)-containing resin and curing agent |
07/02/2003 | CN1427753A Fluxing under fill compositions |
07/02/2003 | CN1427306A Radiation sensitive refractivity change composition and method for changing refractivity |
07/02/2003 | CN1427051A Composition using low-temp hardening epoxy resin for powdery paint |
07/02/2003 | CN1427035A Paste for connecting circuit, anisotropic conducting paste and application thereof |
07/02/2003 | CN1426996A N-(aminopropyl)-tolylene diamine and its application as epoxy curing agent |
07/02/2003 | CN1426995A N-cyanoethylated 0-and meta-tolylene diamine composition and preparing process thereof |
07/02/2003 | CN1113074C Phenolic resin as water-unaffected accelerators for epoxy resin hardeners |
07/01/2003 | US6586607 Esterification of bis/2-hydroxyethoxy/benzene/-m/ using propylene or ethylene carbonate in the presence of triphenylphosphine catalysts, then reacting with epichlorohydrin to form epoxy resins |
07/01/2003 | US6586526 Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof |
07/01/2003 | US6586512 Composition comprising superabsorbent polymer comprising at least one polymerized monomer selected from carboxylic acid, acrylamide, or derivatives thereof, and binding amount of hydroxy-functionalized polyether |
07/01/2003 | US6586495 Alkylsiloxane-containing epoxy resin composition, surface modifying method using the same, ink-jet recording head and liquid-jet recording apparatus |
06/26/2003 | WO2003052813A2 Dual cure b-stageable underfill for wafer level |
06/26/2003 | WO2003052016A2 Dual cure b-stageable adhesive for die attach |
06/26/2003 | WO2003051955A1 Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom |
06/26/2003 | WO2003051649A2 Method of making models |
06/26/2003 | US20030120021 Crosslinking agents |
06/26/2003 | US20030119987 Non-polyvinyl chloride, interpenetrating network epoxy/urethane acrylates |
06/26/2003 | US20030119931 Photopolymerizable mixtures of a vinyl ether, photoinitiator system of an iodonium salt, a visible light sensitizer, and electron donor compound, and optional spiroorthocarbonates, epoxides, polyols; e.g. dental composites |
06/26/2003 | US20030119930 Polyether polyols with increased functionality |
06/26/2003 | US20030118834 Epoxy curing agent emulsification for TTR application |
06/26/2003 | US20030116347 Electronic component |
06/25/2003 | EP1321481A1 Modified polyolefin resin, modified polyolefin resin composition, and use thereof |
06/25/2003 | EP1321459A2 N-Cyanoethylated ortho and meta toluenediamine compositions and process for making them |
06/25/2003 | EP1321453A2 N-(Aminopropyl)-toluenediamines and their use as epoxy curing agents |
06/25/2003 | EP0620259B1 Epoxy/polyester hot melt compositions |
06/25/2003 | CN1112723C Mounting structure and mounting process for semiconductor device |
06/25/2003 | CN1112418C Solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
06/24/2003 | US6583198 A photocurable resin consists of an acid modified vinyl group containing epoxy resin, an elastomer, a photopolymerization initiator, a diluent and a curing agent, can give high performance cured film |
06/24/2003 | US6582781 Multilayer cholesteric pigments |
06/21/2003 | CA2414760A1 Radiation sensitive refractive index changing composition and refractive index changing method |
06/19/2003 | WO2003050188A1 Epoxy resin composition and light source cover for illumination |
06/19/2003 | US20030114606 A phosphazene compound or polyphosphazenes; fireproofing |
06/19/2003 | US20030114556 Epoxy resin component, filler, initiator; filler contains silanized fused silica; processable as a one-component system |
06/19/2003 | US20030113662 Photo-curable resin composition, patterning process, and substrate protecting film |
06/19/2003 | US20030113544 Radiation curable resin composition for fresnel lens and fresnel lens sheet |
06/19/2003 | US20030112307 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink |
06/19/2003 | US20030111174 A fast curable blends comprising a reactive elastomer, an epoxy resin, a phenol resin and a curing accelerator; used in flip-chip mounting, preventing the popcorn phenomenon and delamination |
06/18/2003 | EP1319677A1 Accelerator system for epoxy resins |
06/18/2003 | EP1319038A2 Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers |
06/18/2003 | EP1319031A2 Method of preparing particulate crosslinked polymer |
06/18/2003 | EP1282660A4 Rheology-controlled epoxy-based compositions |
06/18/2003 | EP0973808B1 Non-toxic initiators, resins with cross-linkable organofunctional groups containing same, and use for preparing stable and non-toxic polymers |
06/18/2003 | DE10211295C1 Production of epoxy-terminated polymeric polysulfide, useful for producing e.g. adhesive, coating or sealant, involves dissolving thiol-terminated polymeric polysulfide in excess epichlorohydrin and starting reaction with alkali hydroxide |
06/18/2003 | CN1425042A Coherent insert |
06/17/2003 | US6579914 Cationic photoinitiator for aliphatic epoxide, free radical photoinitiator for urethane diacrylate oligomer, reactive diluent; improved stress relaxation, good adhesion to glass; no copolymerization between the epoxide and diacrylate |
06/17/2003 | US6579566 One-component epoxy resin system for trickle impregnation and hot dip rolling |
06/17/2003 | US6579325 Silicone compositions for treating wool materials |
06/17/2003 | CA2079657C Solid compositions of polyglycidyl compounds having a molecular weight of less than 1500 |
06/12/2003 | WO2003048251A1 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s) |
06/12/2003 | WO2003048171A1 Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins |
06/12/2003 | WO2003048170A1 Basic silane coupling agent-organic carboxylic acid salt composition, process for preparing the salt composition and epoxy resin compositions containing the same |
06/12/2003 | WO2003048066A1 Sizing composition for glass yarns, the glass yarns thus obtained and composite materials comprising said yarns |
06/12/2003 | US20030109378 Hardening catalyst containing tetraalkylphosphonium tetrafluoroborate for baking at low temperature; improving storage stability and pot life |
06/12/2003 | US20030108810 Deodorizing agent for sulfur- or nitrogen-containing salt photoinitiators |
06/11/2003 | EP1317498A2 Holographic storage medium comprising polyfunctional epoxy monomers capable of undergoing cationic polymerization |
06/11/2003 | EP1086403B1 Liquid, radiation-curable composition, especially for stereolithography |
06/11/2003 | EP0974078B1 Ternary photoinitiator system for curing of epoxy/polyol resin compositions |
06/11/2003 | CN1423678A Flame retardant phosphorus element-containing epoxy resin compositions |
06/11/2003 | CN1423674A Flame retardant epoxy molding compositions |
06/11/2003 | CN1422883A Epoxide polymerization catalyst preparation method |
06/10/2003 | US6577492 Use of 9,9-bis(aminophenyl)fluorene curing agents reduces water adsorption in the dielectric layer |
06/10/2003 | US6576690 Phosphorous-containing flame retarding epoxy resin and an epoxy resin composition containing the same |
06/10/2003 | US6576688 Waterborne sanitary can coating compositions |
06/10/2003 | US6576382 Photosensitive cationically polymerizable epoxy based system does not contain bromine; useful as a solder mask |
06/10/2003 | US6576297 Curable resin compositions |
06/10/2003 | US6576159 Colorants, electroconductive materials; solubility, dissociation |
06/10/2003 | CA2269803C Gas barrier coating compositions containing platelet-type fillers |
06/10/2003 | CA2176203C Water soluble active sulfones of poly(ethylene glycol) |
06/05/2003 | WO2003046076A1 Toughened thermosetting resins and preparation of the same |
06/05/2003 | WO2003046042A1 Radiation curable resin composition for making colored three dimensional objects |
06/05/2003 | WO2003046026A1 Epoxy group containing vinylidene fluoride copolymer, and resin composition, electrode structure and non-aqueous electrochemical element comprising the same |
06/05/2003 | US20030105268 Converting an aryl allyl ether of a phenol to an alpha -dihydroxy derivative in the presence of an oxidant and a catalyst, which is further converted to an aryl glycidyl ether epoxy resin |
06/04/2003 | EP1316574A1 Aqueous hardeners for aqueous epoxy resin dispersions |
06/04/2003 | EP1165647B1 Single component adhesive with an adaptable open joint time |
06/04/2003 | EP0980353B1 Cationically polymerizable compositions capable of being coated by electrostatic assistance |
06/04/2003 | EP0970161B1 Boroxine compositions |
06/04/2003 | CN1422394A Liquid, radiation-curable composition, especially for stereolithography |
06/04/2003 | CN1422316A Impact-resistant epoxy resin compositions |
06/04/2003 | CN1422293A Aqueous two-component cross-linkable composition |
06/03/2003 | US6573357 Contacting a ketone with a polyamine; removing a water by-product produced in the reaction mixture; removing the excess of ketone reactant from the reaction mixture and recycling a portion of it; recovering ketimine |
06/03/2003 | US6573309 Heat-curable, thermally expandable moulded park |
06/03/2003 | US6572980 Curable epoxy or episulfide containing aromatic compound and curing agent; repair, replacement, recovery and/or recycling of electronics |
06/03/2003 | US6572972 Aqueous binders |
06/03/2003 | US6572971 Structural modified epoxy adhesive compositions |
05/30/2003 | WO2003044089A1 Thermosetting resin compositions useful as underfill sealants |
05/30/2003 | WO2003044074A1 Process for the alkoxylation of organic compounds |
05/30/2003 | WO2003044073A1 Process for the polymerisation of epoxy resins |
05/30/2003 | WO2003043973A2 Amine phenolic compounds and their use as hardeners and/or accelerators in epoxy coatings |
05/30/2003 | WO2003027181A3 Low gloss asa resin |
05/30/2003 | CA2467488A1 Process for the polymerisation of epoxy resins |
05/29/2003 | US20030100676 An oxazolidine compound which can be used as a latent curing agent for a moisture curable epoxy or polyepoxide resin |
05/29/2003 | US20030099839 Free of halogen and diantimony trioxide; useful as an encapsulating material in the semiconductor industry |
05/29/2003 | US20030099824 For producing coatings with high hardness, scratch resistance, abrasion resistance, low curling properties, adhesion, and chemical resistance |
05/29/2003 | US20030098649 Alicylic epoxy compounds and their preparation process, alicylic epoxy resin composition, and encapsulant for light-emitting diode |