| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 08/06/2003 | EP0886661B1 Curable epoxy resin compositions containing water-processable polyamine hardeners |
| 08/06/2003 | CN1434834A Photocurable composition and mfg. method, photocurable pressure-sensitive adhesive sheet and mfg. and bonding method |
| 08/06/2003 | CN1434833A Photocurable/thermoseting composition for forming matte film |
| 08/05/2003 | US6602936 Resin containing a polyepoxide and a polyisocyanate and atomized aluminum powder |
| 08/05/2003 | US6602602 Prepared by suspension polymerization; chromatographic columns; narrow particle size distribution |
| 07/31/2003 | WO2003061577A2 Polyalkylene glycol with moiety for conjugating biologically active compound |
| 07/31/2003 | US20030144540 N-cyanoethylated ortho and meta toluenediamine compositions and process for making them |
| 07/31/2003 | US20030144416 Chain extender, a catalyst, a reactive epoxy resin, and a polymeric toughner forms a thermally curable structural adhesive |
| 07/31/2003 | US20030144381 A curable blends comprising epoxy resin, acid anhydride, phenolic resin curing agent, and fine particles for use in liquid crystal displays, electroluminescence displays, plasma displays, charge coupled devices and semiconductors |
| 07/31/2003 | US20030143797 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| 07/31/2003 | US20030141592 Dual cure B-stageable underfill for wafer level |
| 07/31/2003 | CA2840490A1 Polyalkylene glycol with moiety for conjugating biologically active compounds |
| 07/31/2003 | CA2753899A1 Polyalkylene glycol with moiety for conjugating biologically active compounds |
| 07/30/2003 | EP1331244A1 Epoxy resin composition and its use |
| 07/30/2003 | EP1331234A1 Potting composition based on duroplastic epoxid resin |
| 07/30/2003 | EP1330502A2 Coating composition |
| 07/30/2003 | EP0979249B1 Process for producing a coating composition |
| 07/30/2003 | CN1433532A Photosensitive resin composition |
| 07/30/2003 | CN1433436A Glyoxal-phenolic condensates with enhanced fluorescence |
| 07/30/2003 | CN1432602A Epoxy resin composition, surface treatment method, liquid jetting record head and liquid jetting recorder |
| 07/30/2003 | CN1432601A Epoxy resin composition, surface treatment method, liquid jetting record head and liquid jeeint recorder |
| 07/30/2003 | CN1432600A Epoxy resin composition, surface treatment method, liquid jetting record head and liquid jetting recorder |
| 07/29/2003 | US6600056 Catalyst for production of epoxides and methods for production thereof and epoxides |
| 07/29/2003 | US6599960 Storage-stable cationcally polymerized preparations with improved hardening characteristics |
| 07/29/2003 | US6599954 Resin composition is cured by means of the autogeneously generated energy, or both the autogeneously generated energy and the energy from the external energy source |
| 07/29/2003 | US6599952 Triazine polyol starters of any desired functionality under relatively mild conditions; high temperature and pressures not required |
| 07/29/2003 | CA2069991C Thermosetting resin composition |
| 07/24/2003 | WO2003059975A1 Photosensitive resin composition and printed wiring boards |
| 07/24/2003 | US20030139559 One-part, room temperature moisture curable resin composition |
| 07/24/2003 | US20030139506 Powdered epoxy composition |
| 07/24/2003 | US20030139494 Heat resistance, high strength, stiffness, impact strength |
| 07/24/2003 | US20030139486 Radiation sensitive refractive index changing composition and refractive index changing method |
| 07/24/2003 | DE10223283C1 Production of epoxy-terminated polymeric polysulfide, useful e.g. for making adhesive, coating or sealant, comprises dosing thiol-terminated polysulfide into epichlorohydrin and reaction in presence of aqueous alkali hydroxide solution |
| 07/23/2003 | EP1329473A1 Epoxy resin composition, surface treatment method, liquid-jet recording head and liquid-jet recording apparatus |
| 07/23/2003 | EP1329472A1 Epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus |
| 07/23/2003 | EP1328568A2 Self-crosslinking resins and coating compositions made therefrom |
| 07/23/2003 | EP1328567A1 High functional polymers |
| 07/23/2003 | EP1328529A1 Well-defined nanosized building blocks for organic/inorganic nanocomposites |
| 07/23/2003 | EP0735118B1 Powder coating resin composition |
| 07/23/2003 | CN1432140A Solid imaging compsns. for preparing polypropylene-like articles |
| 07/23/2003 | CN1431239A Process for mfg. high molecular expoxy resin |
| 07/22/2003 | US6596841 Polythiol, polymerizable composition, resin and lens, and process for preparing thiol compound |
| 07/22/2003 | US6596813 Composition of epoxy resin, phenolic resin, butadiene particles and amino silicone oil |
| 07/17/2003 | WO2003057780A1 Powdered epoxy composition |
| 07/17/2003 | WO2003057759A1 Method of manufacturing a replica as well as a replica obtained by carrying out an uv light-initiated cationic polymerization |
| 07/17/2003 | WO2003057754A1 Highly functional polymers |
| 07/17/2003 | WO2003057753A1 Adhesive of epoxy compound, aliphatic amine and tertiary amine |
| 07/17/2003 | US20030135059 Liquid epoxy compound and process for preparing the same |
| 07/17/2003 | US20030135011 Epoxy resin composition and prepreg made with the epoxy resin composition |
| 07/17/2003 | US20030134976 Coatiing composition |
| 07/17/2003 | US20030134926 Reacting a compound having both a (meth)acryloyl group and a vinyl ether group with a compound having at least two functional groups capable of an addition reaction with said vinyl ether group |
| 07/17/2003 | US20030133902 Method of making phosphate-binding polymers for oral administration |
| 07/17/2003 | US20030131937 Thermosetting resin compositions useful as underfill sealants |
| 07/17/2003 | CA2468699A1 Powdered epoxy composition |
| 07/16/2003 | EP1327911A1 Liquid, radiation-curable composition, especially for stereolithography |
| 07/16/2003 | CN1430658A Water-based coating composition curable with actinicenergy ray, coated metallic material with cured film of the composition, production process, and method of bonding coated matellic material |
| 07/16/2003 | CN1430636A Powder compositions for heat sensitive substrates |
| 07/16/2003 | CN1114664C Structure and its manufacturing method |
| 07/15/2003 | US6593487 Latent curing agents for epoxy resins |
| 07/15/2003 | US6593401 Low temperature curable epoxy resin, method for preparing the same, and paint composite using the same |
| 07/15/2003 | US6593388 Cationic polymers |
| 07/15/2003 | US6592994 For obtaining haze-free clear coatings |
| 07/10/2003 | WO2003055954A1 A coating composition and method for preparing and applying the same |
| 07/10/2003 | WO2003055836A1 Polycarboxylic acid mixture |
| 07/10/2003 | US20030130481 Aqueous solutions of inorganic nitrate salts are used to accelerate the gelling of epoxy gelcoat resins without adversely affecting the glass transition temperature |
| 07/10/2003 | US20030130441 Bisphenol-epichlorohydrin adduct or epoxy resin and a curing agent selected form phenolic or polyester based curing agent |
| 07/10/2003 | US20030130437 Comprising an epoxy resin and a vinyl polymer which has a main chain produced by living radical polymerization and has a reactive functional group at a main chain terminus; flexiblity, hardness |
| 07/10/2003 | US20030130435 Modified polyvinyl acetal resin, curable resin composition containing the same, and laminated products |
| 07/10/2003 | US20030130371 An aqueous radiation-curable blend of an acrylated resin having a phosphate group, an unsaturated phosphate compound and an unsaturated resin; high solvent resistance and adhesion to metal surface material; weldable joints |
| 07/10/2003 | US20030130358 Novel sulfur compounds and intermolecular compounds containing the same as the component compounds |
| 07/10/2003 | US20030129542 Contact planarization materials that generate no volatile byproducts or residue during curing |
| 07/10/2003 | US20030129438 Dual cure B-stageable adhesive for die attach |
| 07/10/2003 | US20030129411 Impregnating core fiber with thermoplastic resin |
| 07/10/2003 | US20030129383 Liquid thermosetting resin composition, printed wiring boards and process for their production |
| 07/09/2003 | EP1325937A1 Epoxy resin composition, process for producing fiber -reinforced composite materials and fiber-reinforced composite materials |
| 07/09/2003 | EP1325053A1 Die-attaching paste and semiconductor device |
| 07/09/2003 | EP1084169B1 Low viscosity compositions of epoxy functional polyester resins |
| 07/09/2003 | EP0968459B1 Ternary photoinitiator system for curing of epoxy resins |
| 07/09/2003 | EP0871678B1 Polyfunctionally reactive polymer substances |
| 07/09/2003 | CN1429258A Corrosion resistant coatings |
| 07/09/2003 | CN1428470A Length-measuring staying device for weft |
| 07/09/2003 | CN1113926C Storage-stable compositions useful for production of structural forms |
| 07/08/2003 | US6590018 Vinyl silane compounds containing epoxy functionality |
| 07/08/2003 | US6590011 Radiation initiated epoxy-amine systems |
| 07/08/2003 | US6590010 Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective coating |
| 07/08/2003 | US6589621 Thermally stable polyetheramines |
| 07/08/2003 | CA2102138C Structural adhesive composition having high temperature resistance |
| 07/08/2003 | CA2086906C Epoxy resin with aminomethylene groups |
| 07/08/2003 | CA2033882C Curing compositions |
| 07/03/2003 | WO2003054092A1 Coating composition |
| 07/03/2003 | WO2003054086A1 Coating compositions, coated glass fibers and composites reinforced with the glass fibers |
| 07/03/2003 | WO2003054069A1 Expandable epoxy resin-based systems modified with thermoplastic polymers |
| 07/03/2003 | WO2003054051A1 Method and composition for recovering hydrocarbon fluids from a subterranean reservoir |
| 07/03/2003 | US20030125502 Comprises esterified phosphoric acids; protective coatings; corrosion resistance |
| 07/03/2003 | US20030125433 Chemical resistance |
| 07/03/2003 | US20030125423 Adhesives containing cycloaliphatic-containing polyepoxide resin, aromatic polyepoxide resin, and 9,9-bis(3-methyl-4-aminophenyl)fluorene; improved peel and shear strength |
| 07/03/2003 | US20030124378 Fluxing underfill compositions |
| 07/03/2003 | US20030124355 2,4-toluenebis(N,N-dimethyl urea) catalyst; preferably contains a latent curing agent, such as dicyandiamide. |
| 07/03/2003 | US20030121606 Low read-through epoxy-bonded SMC |
| 07/03/2003 | CA2471368A1 Expandable epoxy resin-based systems modified with thermoplastic polymers |